High Voltage Ceramic Capacitor

This specification applies to high voltage ceramic capacitors used in high voltage electric equipment. These capacitors are designed for applications requiring high reliability and are manufactured by HVC Capacitor Manufacturing Co., Ltd., a Hong Kong-funded enterprise established in 2012. The production base is located in Humen, Dongguan, with 95% of products exported. HVC specializes in high voltage ceramic capacitors, including blue ceramic disc and bolt-type ceramic capacitors, with ceramic disc capacitors offering voltages from 2KV to 50KV and utilizing a proprietary N4700 military-grade ceramic dielectric material (6KV to 40KV). Key applications include high-end medical electronic equipment (CT, X-ray machines, C-arms, DR, dental X-ray machines), airport security, non-destructive testing, and electrostatic dust removal equipment. Bolt-type ceramic capacitors, primarily using N4700 material, cover voltage ranges from 10KV to 150KV and are encapsulated in black epoxy resin. Major clients include General Electric, Konica Minolta, Hitachi ABB, Nikon, Siemens, Johnson & Johnson, and Baker Hughes. HVC's business philosophy is to produce high-quality electronic components using military-grade materials to meet international industrial standards. The company also offers high-voltage diodes and thick-film resistors to complement its capacitor product line.

Product Attributes

• Brand: HVC
• Origin: Dongguan, China (Production Base)
• Material: N4700 Military-grade ceramic dielectric
• Color: Blue (Ceramic Disc Type), Black (Bolt-type ceramic capacitor)
• Certifications: Not explicitly mentioned, but implies adherence to high reliability standards for applications like medical and aerospace.

Technical Specifications

Operating Conditions and Cautions

Operating Voltage: Maintain Vp-p or Vo-p within rated voltage range for AC/ripple circuits. Account for irregular voltages during power transitions. Ensure applied voltage considers self-generated heat within 5C at 25C ambient temperature. Use a thermocouple of small thermal capacity (K of f0.1mm) for measurement, avoiding radiant heat and wind interference. Excessive heat degrades characteristics and reliability.

Operating Temperature and Self-Generated Heat: Keep surface temperature below the upper limit of the rated operating temperature range. Account for self-generated heat due to dielectric loss in high-frequency or pulse current applications. Applied voltage should be such that self-generated heat is within 5C at 25C ambient temperature. Measurement should be done without cooling fans.

Operating and Storage Environment: Avoid corrosive atmospheres (chloride gas, sulfide gas, acid, alkali, salt) and moisture. Use insulating media (epoxy resin, silicone oil) with at least 3mm clearance in each direction. Verify cleaning, bonding, and molding processes do not affect product quality. Storage temperature and humidity: -10 to 40C and 15 to 85% RH. Use within 6 months of delivery.

Vibration and Impact: Do not expose capacitors or leads to excessive shock or vibration during use.

Soldering: Do not exceed solder heat resistance specifications. Excessive heating can melt internal junction solder and cause thermal shocks, cracking the ceramic element. Recommended soldering iron conditions: Tip temperature 400C max., wattage 50W max., time 3.5s max. Failure to comply may result in short circuits, fuming, or partial dispersion.

Limitation of Applications: Contact HVC before using for applications requiring especially high reliability to prevent damage to third-party life, body, or property. This includes aircraft, aerospace, undersea, power plant control, medical, transportation, traffic signal, disaster prevention/crime prevention, data-processing equipment, and applications of similar complexity/reliability requirements.

Cleaning: For ultrasonic cleaning, observe the following: Rinse bath capacity: 20 watts/liter or less. Rinsing time: 5 minutes maximum. Do not vibrate the PCB/PWB directly. Excessive ultrasonic cleaning can cause fatigue destruction of lead wires.

Capacitance Change:

• Class 1 capacitors: Capacitance may change slightly with surrounding temperature or applied voltage. Contact HVC for strict time constant circuits.
• Class 2 and 3 capacitors: Exhibit aging characteristics (capacitance decreases slightly over time). Capacitance can change significantly with temperature and applied voltage. Not suitable for time constant circuits. Contact HVC for detailed information.

Tests

Visual Examination

• Appearance dimensions: Checked visually or with Venire Calipers.
• Marking: Must be easily legible and checked visually.

Electrical Performance Tests

• Dielectric Strength (Between Lead wires): No failure when DC voltage of 150% rated voltage applied for 60s in insulating liquid/gas (Charge/discharge current: 50mA max.).
• Body Insulation: No failure when DC 15kV applied for 10s between lead wires and small metals (2mm clearance) (Charge/discharge current: 50mA max.).
• Insulation Resistance (I.R.): Measured with DC 1kV within 605s of charging. (Value not specified in detail, but 200,000 M is listed for N4700).
• Capacitance: Within specified tolerance. Measured at 20C, 10.2kHz, AC5V(r.m.s.) max.
• Dissipation Factor (D.F.): 0.2% max. (for N4700).
• Temperature Characteristic: Capacitance change from step 3 value shall not exceed limits. Steps include -4700ppm/C (for N4700), 202C, 852C.

Mechanical Performance Tests

• Strength of Lead Pull: Lead wire shall not cut off, capacitor shall not break. Apply tensile weight up to 10N radially to each lead wire for 101s.
• Bending: Each lead wire subjected to 5N weight, 90 bend in one direction, return to original, then 90 bend in opposite direction (1 bend in 2-3s).
• Solderability of Leads: Lead wire soldered with uniformly coated surface over 3/4 circumferential direction. Dipped into 25% methanol solution of rosin, then into molten solder (2355C) for 20.5s. Depth of dipping: 1.5 to 2.0mm from root of lead wires.
• Soldering Effect:
• Appearance: No marked defect.
• Capacitance Change: Within 10%.
• Dielectric Strength (Between lead wires): No failure. Lead wires immersed into melted solder (35010C) up to 1.5 to 2.0mm from main body for 3.50.5s. Post-treatment: Store for 242h at room condition.