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Specifications
Voltage Rating:
50V
Capacitance:
24pF
Temperature Coefficient:
C0G
Tolerance:
±1%
Mfr. Part #:
CGA0402C0G240F500GT
Package:
0402
Key Attributes
Model Number:
CGA0402C0G240F500GT
Product Description
Product Overview
This specification applies to multilayer chip ceramic capacitors (MLCCs). These capacitors are designed for various electronic applications requiring stable capacitance and reliable performance.
Product Attributes
- Brand: CGA (implied from product code)
- Material: Dielectric Ceramic, Nickel (internal electrode), Copper (external electrode), Nickel Layer, Tin Layer
- Temperature Characteristics: C0G
Technical Specifications
| Model | Description | Capacitance | Capacitance Tolerance | Rated Voltage | Temperature Range | Temperature Coefficient | Dimensions (L x W x T) mm | Packaging | Packaging Quantity |
|---|---|---|---|---|---|---|---|---|---|
| CGA0402C0G240F500GT | Multilayer Chip Ceramic Capacitor | 24pF | 1% | 50Vdc | -55 to +125 | 30ppm/ | 1.00+0.20/-0.05 x 0.50+0.20/-0.05 x 0.50+0.20/-0.05 | 180mm Reel | 10,000 |
Specifications and Test Methods
| Item | Material | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
|---|---|---|---|
| Appearance | - | No defects or abnormalities. | Visual (Microscope) inspection. |
| Dimensions | - | Refer to dimension specifications. | Micrometer inspection. |
| Capacitance | C0G | Within specified tolerance. | Test Voltage: 0.5-5.0Vrms (50V), 1.00.2Vrms (50VRV250V), 0.5V0.1Vrms (250VRV500V), 1.00.2Vrms (>500V). Frequency: 1.00.1MHz (C1000pF), 1.00.1KHz (C>1000pF), 120Hz24Hz (C>10uF). |
| Temperature Characteristics of Capacitance | C0G | Change within 30ppm/. | Measured at specified temperature steps after thermal equilibrium. Reference temperature: 252. |
| Insulation Resistance(I.R.) | - | 10 G or RC 500F (whichever is smaller). | Test Voltage: 300% RV (RV50V), 200% RV (50VRV250V), 150% RV (250VRV500V), 130% RV (>500V). Test Temperature: 25. |
| Voltage proof | - | Withstand test voltage, no defects or abnormalities. | Test Voltage: 250% RV (RV50V), 200% RV (50VRV250V), 150% RV (250VRV500V), 120% RV (>500V). Test Temperature: 25. |
| Adhesive Strength of Termination | - | No terminal detachment, ceramic breakage, etc. | Applied Force: 5N (0402:2.5N / 0201:1N). Application Time: 101s. Application Direction: Gradual force applied horizontally on the P.C. board at the center of the specimen. |
| Substrate Bending test | - | Appearance: No defects or abnormalities. C/C | Capacitor soldered on P.C. board, then bent by 1mm. |
| Solderability | - | 95% of the terminal should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (Lead-free solder). Flux: Isopropyl alcohol Rosin 25% solid solution. Soldering Temperature: 2455C. Dwell Time: 20.5s. Soldering Position: Until both ends are completely wetted. |
| Resistance to Soldering Heat | C0G | Capacitance change within 2.5% or 0.25pF (whichever is larger). | Solder Bath Method. Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder). Test Temperature: 2605. Test Time: 101s. Preheating Temperature: 110 to 140. Preheating Time: 1 minute. Post-treatment: Stand for 242 hours at room temperature, then measure. |
| Temperature Cycle | COG | Capacitance change: 5 cycles. COG: Within 0.5pF or 1% (whichever is larger). X7R/X5R: 15%. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand for 242 hours at room temperature, then measure. Temperature Cycle: 5 cycles. Steps: Low temp 3 (303min), Room temp (2~5min), High temp 3 (303min), Room temp (2~5min). Post-treatment: Stand for 242 hours at room temperature, then measure. |
| High Temperature High Humidity (Load) | X7R/X5R | Capacitance change: 12.5%. Quality Factor/Dissipation Factor (X7R/X5R/X6S) 16V: 7% or 2 times initial value. 25V: 5% or 2 times initial value (larger value taken). Insulation Resistance: 500M or R.C 5s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand for 242 hours at room temperature, then measure. Test Temperature: 402. Test Humidity: 90%RH to 95%RH. Test Time: 50024 hours. Test Voltage: Rated voltage (not exceeding 630V). Charging/Discharging Current: Max 50mA. Voltage Treatment: 1 hour at test temperature and voltage, then stand for 242 hours at ambient conditions before measurement. |
| Life | X7R/X5R | Capacitance change: 15%. Quality Factor/Dissipation Factor (C0G): Capacitance 30pF: 350min. 10pF C 30pF: 275+5/2*C min. 10pF: 200+10*C min. Quality Factor/Dissipation Factor (X7R/X5R/X6S) 16V: 7% or 2 times initial value. 25V: 5% or 2 times initial value (larger value taken). Insulation Resistance: X7R: 1G or R.C10s. X5R: 1G or R.C 50s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand for 242 hours at room temperature, then measure. Test Temperature: Highest operating temperature 3. Test Time: 100012 hours. Test Voltage (life): 100% R.V. Charging/Discharging Current: Max 50mA. Voltage Treatment: 1 hour at test temperature and voltage, then stand for 242 hours at ambient conditions before measurement. |
Packaging Specifications
| Size (mm) | Tape Specification | Packaging Quantity (pcs) | Reel Diameter |
|---|---|---|---|
| 0402 (1.00 x 0.50 x 0.50) | Paper Tape | 10,000 | 180mm (7") |
| 0603 (1.60 x 0.80 x 0.80) | Paper Tape | 4,000 | 180mm (7") |
| 0805 (2.00 x 1.25 x 0.60) | Paper Tape / Plastic Tape | 4,000 | 180mm (7") |
| 1206 (3.20 x 1.60 x 0.85) | Paper Tape / Plastic Tape | 4,000 | 180mm (7") |
| 1210 (3.20 x 2.50 x 1.25) | Plastic Tape | 3,000 | 180mm (7") |
Application Limitations
Contact manufacturer for applications requiring high reliability, especially those that could directly cause damage to third-party life, body, or property. Examples include aircraft equipment, aerospace equipment, medical equipment, transportation equipment, and complex or high-reliability systems.
Transportation and Storage Methods
- Transportation: Protect from rain, acid/alkali corrosion. Avoid heavy impact and forceful extrusion.
- Storage: Shelf life for good solderability is one year from the production date. Use within three months after unsealing the tape. Storage Temperature: 0~35. Storage Relative Humidity: <70%.
Usage Precautions
In harsh operating environments or under external mechanical overpressure exceeding specified limits, MLCCs may short circuit, open circuit, smoke, burn, or explode. Always follow the specifications provided. Contact the technical department for any uncertainties.
Soldering Recommendations
- Solder Amount: Ensure appropriate solder amount to avoid damage from excessive pressure or poor contact from insufficient fixation.
- Recommended Solder Amount: Refer to specific recommendations for reflow soldering, wave soldering, and rework.
- Recommended Soldering Temperature Curves:
- Reflow Soldering: Peak Temperature: 230~250 (Pb-Sn), 240~260 (Lead-free). Peak Time: 3s10s.
- Wave Soldering: Preheat: 130. Iron Tip Temperature: 350. Iron Power: 20W. Soldering Time: 3s.
- Manual Soldering: Handle with care to avoid localized uneven heating, which can cause micro-cracks or explosions. Select appropriate tip and control tip temperature carefully.
2504101957_HRE-CGA0402C0G240F500GT_C45359899.pdf
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