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Specifications
Voltage Rating:
630V
Capacitance:
22nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
CGA1206X7R223K631NT
Package:
1206
Key Attributes
Model Number:
CGA1206X7R223K631NT
Product Description
Product Overview
The CGA Series Multilayer Ceramic Chip Capacitors from Jiangsu Holy Ram Electronics Technology Limited are designed for mobile and general consumer devices. They offer various dielectric materials (X7R, X7S, X6S, X5R) with a wide operating temperature range and controlled capacitance change rates, ensuring reliable performance in diverse applications.
Product Attributes
- Brand: Jiangsu Holy Ram Electronics Technology Limited
- Product Series: CGA
- Application: Mobile Devices & General Consumer Devices
- Certifications: Lead-free certification, Halogen-free
- Polarity: Non-polar
Technical Specifications
| Material | Temperature Range | Capacitance Change Rate | Standard Compliance |
| X7R | -55--125 | 15% | IEC60384 |
| X7S | -55--125 | 22% | IEC60384 |
| X6S | -55--105 | 22% | IEC60384 |
| X5R | -55--85 | 15% | IEC60384 |
| Test Item | Specification | Test Method (Reference Standard) |
| Appearance | No defects or abnormalities. | Visual (Microscope) inspection. |
| Dimension | Conforms to specifications. | Physical dimension check with micrometer. |
| Voltage Proof | Withstand test voltage without defects. | 150% RV for RV250V; 120% RV for 250VRV630V; 150% RV for 630VRV1000V (X7R/X7S/X5R/X6S) |
| Insulation Resistance (I.R.) | Meets initial specification value. | Test Temperature: 25; Test Voltage: Rated Voltage; Charge Time: 1 minute. |
| Capacitance | Within specified tolerance. | Measurement Temperature: 25; Frequency: 120Hz24Hz (C>10uF) or 1.00.1KHz (C10uF); Voltage: 0.5V0.1Vrms (C>10uF) or 1.00.2Vrms (C10uF). |
| Q Factor / Dissipation Factor (D.F.) | Meets initial specification value. | As per Capacitance measurement. |
| Temperature Characteristics of Capacitance | Capacitance change within limits per material. | Measured at specified temperature stages after thermal equilibrium. X7R: 15%; X7S: 22%; X5R: 15%; X6S: 22%. |
| Adhesive Strength of Termination | No termination peeling or ceramic breakage. | Applied Force: 5N (0402:2.5N / 0201:1N); Duration: 101 sec. |
| Substrate Bending Test | Appearance: No defects. C/C: | Capacitor reflow soldered on PCB, then bent 1mm. |
| Solderability | 95% of terminations uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu; Flux: Isopropyl alcohol Rosin 25%; Temp: 2455C; Time: 20.5s. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance/Q Factor/DF/Insulation Resistance/Voltage Proof: Meet initial specifications. | Pre-treatment: 150C for 1 hr. Solder Bath Temp: 2605C; Time: 101s. |
| Temperature Cycle | Appearance: No defects. Capacitance/Q Factor/DF/Insulation Resistance: Meet initial specifications. | 5 cycles of temperature extremes (-55C to 125C or 85C/105C) and dwell times. |
| High Temperature High Humidity (Load) | Appearance: No defects. Capacitance/Q Factor/DF/Insulation Resistance: Meet initial specifications. | Test Temp: 402C; Humidity: 90%-95%RH; Time: 50024 hrs; Test Voltage: Rated Voltage (630V). |
| Life Test | Appearance: No defects. Capacitance/Q Factor/DF/Insulation Resistance: Meet initial specifications. | Test Temp: Max operating temp; Time: 100012 hrs; Test Voltage: 100% R.V. |
2404021521_HRE-CGA1206X7R223K631NT_C22374887.pdf
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