Product Overview
The CGA0603X7R474K500JT is a multilayer ceramic capacitor (MLCC) designed for various electronic applications. It offers stable capacitance over a wide temperature range and is built with high-quality dielectric ceramic, nickel internal electrodes, copper external electrodes, and tin plating.
Product Attributes
- Brand: CGA
- Material: Dielectric Ceramic, Nickel (Internal Electrode), Copper (External Electrode), Tin (Plating)
Technical Specifications
| Model | Size (L*W*T mm) | Temperature Characteristic | Capacitance | Capacitance Tolerance | Rated Voltage | Thickness | Packaging |
| CGA0603X7R474K500JT | 1.600.20 * 0.800.20 * 0.800.20 | X7R | 470nF | 10% | 50Vdc | 0.20-0.65 | T 180mm Reel, 4,000 pcs |
| CGA0603X7R474K500JT | 0603 | X7R | 474 (470nF) | K (10%) | 500 (50Vdc) | T | T |
Specifications and Test Methods
| Test Item | Material | Specification | Test Voltage | Frequency | Test Temperature | Remarks |
| Appearance | - | No defects or abnormalities. | - | - | - | Visual (microscope) inspection. |
| Dimension | - | Conforms to specifications. | - | - | - | Micrometer inspection. |
| Capacitance | C0G | 10.0% | 1.00.2Vrms | 1.00.1MHz | 25 | - |
| Capacitance | X7R/X5R/X6S | 15% | 1.00.2Vrms | 1.00.1MHz | 25 | - |
| Capacitance | C0G | 1% or 0.5 pF (whichever is greater) | 0.5V0.1Vrms | 120Hz24Hz | 25 | |
| Capacitance | X7R/X5R | 10% | 0.5V0.1Vrms | 120Hz24Hz | 25 | |
| Capacitance | X7R/X5R | 12.5% | 0.5V0.1Vrms | 120Hz24Hz | 25 | |
| Insulation Resistance(I.R.) | C0G | 10 G or RC 500F (whichever is smaller) | RV50V: 300% RV; 50VRV250V: 200% RV; 250VRV500V: 150% RV | - | 25 | - |
| Insulation Resistance(I.R.) | X7R/X5R/X6S | 1 G or RC 10s (whichever is smaller) | RV50V: 300% RV; 50VRV250V: 200% RV; 250VRV500V: 150% RV | - | 25 | - |
| Insulation Resistance(I.R.) | X7R | 1G or R.C10s | 100% R.V. | - | Highest Operating Temp 3 | - |
| Insulation Resistance(I.R.) | X5R | 1G or R.C 50s | 100% R.V. | - | Highest Operating Temp 3 | - |
| Voltage proof | - | Withstand test voltage, no defects or abnormalities. | 130% RV (RV50V); 150% RV (50VRV250V); 200% RV (250VRV630V); 250% RV (630VRV1000V) | - | 25 | Between terminals |
| Temperature Characteristics of Capacitance | C0G | 30ppm/ | - | - | -55 to +125 | - |
| Temperature Characteristics of Capacitance | X5R | 15% | - | - | -55 to +125 | - |
| Temperature Characteristics of Capacitance | X6S | 22% | - | - | -55 to +125 | - |
| Temperature Characteristics of Capacitance | X7R | 15% | - | - | -55 to +125 | - |
| Adhesive Strength of Termination | - | No terminal detachment, ceramic breakage, etc. | 5N (0402:2.5N / 0201:1N) | - | - | Applied force in horizontal direction on the center of the specimen. |
| Substrate Bending test | - | Appearance: No defects or abnormalities. | - | - | - | Capacitor reflow soldered on PCB, then bent 1mm. |
| Solderability | - | 95% of the termination shall be uniformly and continuously wetted. | - | - | 2455C | Solder: Sn-3.0Ag-0.5Cu (Lead-free solder); Flux: Isopropyl alcohol Rosin 25% solid solution. |
| Resistance to Soldering Heat | C0G | 2.5% or 0.25pF (whichever is greater) | - | - | 2605 | Solder: Sn-3.0Ag-0.5Cu(Lead Free Solder) |
| Resistance to Soldering Heat | X7R/X5R/ X6S | 7.5% | - | - | 2605 | Solder: Sn-3.0Ag-0.5Cu(Lead Free Solder) |
| Temperature Cycle | C0G | - | - | - | 5 cycles | Appearance: No defects or abnormalities. |
| Temperature Cycle | X7R/X5R | 15% | - | - | 5 cycles | Appearance: No defects or abnormalities. |
| High Temperature High Humidity | X7R/X5R | 12.5% | Rated Voltage (not exceeding 630V) | - | 402, 90%RH to 95%RH | Test time: 50024 hours |
| Life | X7R/X5R | 15% | 100% R.V. | - | Highest Operating Temp 3 | Test time: 100012 hours |
Packaging Specifications
| Size | Tape Type | Reel Size | Packs per Box | Boxes per Case |
| 01005 | Paper Tape | 7" | 5 | 12 |
| 0201 | Paper Tape | 7" | 5 | 12 |
| 0402 | Paper Tape | 7" | 5 | 12 |
| 0603 | Paper Tape | 7" | 5 | 12 |
| 0805 | Paper Tape/Plastic Tape | 7" | 5 | 12 |
| 1206 | Paper Tape/Plastic Tape | 7" | 5 | 12 |
| 1210 | Plastic Tape | 7" | 5 | 12 |
Application Limitations
Contact manufacturer for applications requiring high reliability, especially those that could directly cause damage to third-party life, body, or property. Examples include: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and similar applications with high complexity or reliability requirements.
Transportation and Storage Methods
Transportation: Product packaging is suitable for modern transportation. Protect from rain, acid-alkali corrosion. Avoid heavy impact and strong extrusion.
Storage: Shelf life for good solderability is one year from the production date. Do not unpack the tape until ready for use. Once unpacked, use within three months. Storage Temperature: 0~35. Storage Relative Humidity: <70%.
Usage Precautions
MLCCs may experience short circuits, open circuits, smoke, fire, or explosion under harsh operating conditions beyond specified frequencies or excessive external mechanical forces. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for any unclear matters.
Soldering Recommendations
Solder Amount: Ensure appropriate solder amount to avoid damage from excessive pressure or poor contact from insufficient fixation.
Recommended Soldering Temperature Curves:
Reflow Soldering:
- Pb-Sn Soldering: Peak Temp 230~250, Peak Time 3s10s
- Lead-Free Soldering: Peak Temp 240~260, Peak Time 3s10s
Wave Soldering:
- Pb-Sn Soldering: Peak Temp 230~260, Peak Time within 3s
- Lead-Free Soldering: Peak Temp 240~270, Peak Time within 3s
Manual Soldering: Use caution to avoid uneven local heating, which can cause micro-cracks or local explosions. Select appropriate soldering iron tips and control tip temperature carefully.
2410300953_HRE-CGA0603X7R474K500JT_C42371693.pdf
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