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Specifications
Voltage Rating:
16V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
CGA0603X5R106K160JT
Package:
0603
Key Attributes
Model Number:
CGA0603X5R106K160JT
Product Description
Product Overview
This specification applies to multilayer ceramic chip capacitors, specifically the CGA0603X5R106K160JT model. These capacitors are designed for general use with X5R temperature characteristics, offering a capacitance of 10F and a rated voltage of 16Vdc. They are supplied in tape and reel packaging.
Product Attributes
- Brand: CGA (implied from product code)
- Origin: Not specified
- Material: Ceramic dielectric, Nickel internal electrodes, Copper external electrodes, Tin plating
- Color: Not specified
- Certifications: JIS C 5101, IEC60384 (referenced for test methods)
Technical Specifications
| Model | Type | Capacitance | Tolerance | Rated Voltage | Temperature Characteristic | Dimensions (mm) (L*W*T) | Packaging Quantity (pcs) |
|---|---|---|---|---|---|---|---|
| CGA0603X5R106K160JT | Multilayer Ceramic Chip Capacitor | 10F | 10% | 16Vdc | X5R (15% from -55 to +85) | 1.600.20 * 0.800.20 * 0.800.20 | 4,000 (on 180mm reel) |
Test Specifications
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
|---|---|---|
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimensions | Conforms to specifications. | Micrometer inspection of physical dimensions. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | 250% RV for RV50V; 200% RV for 50VRV250V; 150% RV for 250VRV630V; 120% RV for 630VRV1000V. Test time: 1-5s. Max charging/discharging current: 50mA. |
| Insulation Resistance (I.R.) | 100M (for X7R/X5R) | Test temperature: 25. Test voltage: 500V: Rated Voltage; >500V: 500V. Charging time: 1 minute. Max charging/discharging current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. Frequency/Voltage dependent on capacitance value. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 1.00.1 KHz, 1.00.2Vrms; C>10F: 120Hz24Hz, 0.5V0.1Vrms. Specific values depend on capacitance range. | Specific values depend on capacitance range. |
| Temperature Characteristics of Capacitance | X5R: 15%; X7R: 15% | Measurement at specified temperature stages (-55 to +85) after thermal equilibrium. |
| Adhesive Strength of Termination | No termination peeling, ceramic breakage, etc. | Applied force: 5N (4,000: 2.5N / 0201: 1N). Duration: 101s. Direction: Horizontal to PCB. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C: | Capacitor reflow soldered on PCB, then bent 1mm. |
| Solderability | 95% of terminations should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu. Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temperature: 2455C. Dwell time: 20.5s. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then 242 hours at room temp. Solder bath method: Sn-3.0Ag-0.5Cu. Test temp: 2605C. Test time: 101s. Preheat temp: 110-140C. Preheat time: 1 minute. Post-treatment: 242 hours at room temp. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. Insulation Resistance: Same as initial. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then 242 hours at room temp. 5 cycles: -55 to +150. Dwell times specified. Post-treatment: 242 hours at room temp. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then 242 hours at room temp. Test temp: 402C. Test humidity: 90%-95%RH. Test time: 50024 hours. Test voltage: Rated voltage (up to 630V). Voltage conditioning applied. Post-treatment: 242 hours at ambient conditions. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then 242 hours at room temp. Test temp: Max operating temp 3C. Test time: 100012 hours. Test voltage: 100% R.V. Voltage conditioning applied. Post-treatment: 242 hours at ambient conditions. |
Packaging Specifications
| Size (mm) | Tape Type | Reel Size | Pcs/Reel | Box/Carton |
|---|---|---|---|---|
| 0603 | Paper Tape | 7" (180mm) | 4,000 | 5 Reels/Box, 12 Boxes/Carton |
Application Limitations
Contact manufacturer for high reliability applications, especially those where defects could cause direct damage to third-party life, body, or property. Examples include aircraft, aerospace, medical, transportation, and data processing equipment.
Transportation and Storage Methods
Transportation
Packaging is suitable for modern transportation. Protect from rain, corrosive substances, and avoid dropping or severe compression.
Storage
Recommended storage period for good solderability: 1 year from production date. Use within 3 months after unsealing the tape. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
In harsh environments or under excessive mechanical stress, MLCCs may short circuit, open circuit, smoke, burn, or explode. Adhere to specifications. Contact technical department for any uncertainties.
Soldering
- Solder Amount: Too much can damage the capacitor due to excessive terminal pressure. Too little can cause poor contact.
- Recommended Solder Amount: Refer to specific recommendations for reflow, wave, and rework soldering.
- Recommended Soldering Temperature Curve:
- Reflow Soldering: Peak temperature 240~260 for 3s~10s (lead-free).
- Wave Soldering: Peak temperature 240~270 for within 3s (lead-free).
- Hand Soldering: Use caution to avoid localized heating. Preheat 130, Iron tip temp 350, Iron power 20W, Iron tip diameter 1mm, Soldering time 3s. Iron tip should not directly contact the ceramic body.
2509180925_HRE-CGA0603X5R106K160JT_C6119834.pdf
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