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Specifications
Voltage Rating:
6.3V
Capacitance:
47uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
CGA0603X5R476M6R3JT
Package:
0603
Key Attributes
Model Number:
CGA0603X5R476M6R3JT
Product Description
Product Overview
The CGA0603X5R476M6R3JT is a multilayer chip ceramic capacitor (MLCC) designed for various electronic applications. It offers stable performance with an X5R temperature characteristic, a capacitance of 47uF, and a rated voltage of 6.3Vdc. This product is suitable for applications requiring reliable capacitance and is available in tape and reel packaging.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ceramic dielectric, Nickel inner electrode, Copper outer electrode
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Model | Dimensions (mm) L*W*T | Capacitance | Capacitance Tolerance | Rated Voltage | Temperature Characteristic | Temperature Range | Capacitance Change Rate | Packaging | Packaging Quantity |
| CGA0603X5R476M6R3JT | 1.60*0.80*0.80 | 47uF | 20% | 6.3Vdc | X5R | -55~+85 | 15% | 180mm Reel | 4,000 |
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimension | Conforms to specifications. | Physical dimensions checked with a micrometer. |
| Capacitance | Within specified tolerance. | Measured at 1.00.2Vrms, 1.00.1MHz (for C10uF) or 120Hz24Hz (for C10uF). |
| Insulation Resistance (I.R.) | 10 G or R.C 500F (whichever is smaller). | Measured at rated voltage (500V: 1 minute; >500V: 500V 1 minute). |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | Applied voltage: 130% RV (RV50V), 250% RV (50VRV250V), 200% RV (250VRV500V), 150% RV (500VRV630V), 120% RV (630VRV1000V). Duration: 1 minute. Max current: 50mA. Test temperature: 25. |
| Temperature Characteristics of Capacitance | X5R: 15% | Measured at specified temperature steps after thermal equilibrium. Reference temperature: 252. Minimum operating temperature: 3. Maximum operating temperature: 2. |
| Adhesive Strength of Termination | No termination peeling, ceramic breakage, etc. | Capacitor soldered on test substrate. Force: 5N (0402: 2.5N / 0201: 1N). Duration: 101s. Applied in horizontal direction to P.C. board. |
| Substrate Bending Test | Appearance: No defects or abnormalities. | Capacitor reflow soldered on P.C. board, then bent 1mm. C/C |
| Solderability | 95% of terminations should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu. Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temperature: 2455C. Dwell time: 20.5s. Immersion depth: Until both ends are fully wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R/X6S: 7.5%. C0G: Within 2.5% or 0.25pF (whichever is larger). Q/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Solder bath method: Solder type Sn-3.0Ag-0.5Cu. Test temperature: 2605C. Test time: 101s. Preheating temperature: 110 to 140. Preheating time: 1 minute. Post-treatment: Stand at room temperature for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 15%. Q/DF: Same as initial. Insulation Resistance: Same as initial. | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Temperature cycle: 5 cycles. Steps: Minimum temp 3 (303min), Room temp (2-5min), Maximum temp 3 (303min), Room temp (2-5min). Post-treatment: Stand at room temperature for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 12.5%. Q/DF: X7R/X5R/X6S: 7% or 2x initial value (for 16V), 5% or 2x initial value (for 25V) (whichever is larger). Insulation Resistance: 500M or R.C 5s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Test temperature: 402. Test humidity: 90%RH to 95%RH. Test time: 50024 hours. Test voltage: Rated voltage (not exceeding 630V). Charge/discharge current: Max 50mA. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 15%. Q/DF: X7R/X5R/X6S: 7% or 2x initial value (for 16V), 5% or 2x initial value (for 25V) (whichever is larger). Insulation Resistance: X7R: 1G or R.C10s. X5R: 1G or R.C 50s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Test temperature: Maximum operating temperature 3. Test time: 100012 hours. Test voltage (life): 100% R.V. Charge/discharge current: Max 50mA. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions. |
Application Scenarios
This capacitor is suitable for various electronic applications, including but not limited to:
- Aircraft equipment
- Aerospace equipment
- Submarine equipment
- Power plant control equipment
- Medical equipment
- Transportation equipment (vehicles, trains, ships, etc.)
- Traffic signal equipment
- Disaster prevention/crime prevention equipment
- Data processing equipment
- Applications with similar complexity and/or reliability requirements.
Usage Precautions
When using multilayer chip ceramic capacitors (MLCCs) in harsh operating environments exceeding specified frequencies or under external mechanical overpressure, there is a risk of short circuits, open circuits, smoke, fire, or even explosion. Always adhere to the specifications provided in this document. If anything is unclear, please contact the technical, quality control, or production department.
Soldering Precautions:
- Solder Amount: Too much solder can damage the capacitor due to excessive terminal pressure. Too little solder may result in poor contact between the capacitor chip and the circuit.
- Recommended Solder Amount: Refer to the detailed recommendations for reflow soldering, wave soldering, and soldering iron rework.
- Recommended Soldering Temperature Curves: Follow the recommended temperature profiles for reflow and wave soldering.
- Hand Soldering: Exercise caution to avoid localized uneven heating, which can cause micro-cracks or localized explosions in the ceramic body. Pay close attention to the selection and temperature control of the soldering iron tip.
Transportation and Storage
Transportation: Packaged products are suitable for modern transportation. Protect from rain, acid/alkali corrosion, and avoid heavy impact or severe squeezing.
Storage:
- Shelf life for good solderability: One year from the date of production.
- Do not unpack the tape until ready for use. Once unpacked, use within three months.
- Storage Temperature: 0~35
- Storage Relative Humidity: <70%
2504301636_HRE-CGA0603X5R476M6R3JT_C6119831.pdf
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