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quality Multilayer chip ceramic capacitor HRE CGA0402C0G5R0C500GT 0402 package 5 picofarads 50 volt rated component factory
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quality Multilayer chip ceramic capacitor HRE CGA0402C0G5R0C500GT 0402 package 5 picofarads 50 volt rated component factory
>
Specifications
Voltage Rating:
50V
Capacitance:
5pF
Temperature Coefficient:
C0G
Mfr. Part #:
CGA0402C0G5R0C500GT
Package:
0402
Key Attributes
Model Number: CGA0402C0G5R0C500GT
Product Description

Product Overview

This document specifies the requirements for multilayer chip ceramic capacitors (MLCCs). These capacitors are designed for various electronic applications and offer specific performance characteristics based on their material composition and electrical ratings.

Product Attributes

  • Brand: CGA (implied by product code)
  • Material: Dielectric ceramic, Nickel inner electrode, Copper outer electrode, Tin layer
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

ModelSize (mm)Length (mm)Width (mm)Thickness (mm)Capacitance (pF)Capacitance ToleranceRated Voltage (Vdc)Temperature CharacteristicTemperature Range ()Capacitance Change RatePackagingPackage QuantityDielectric MaterialInsulation Resistance (M)Dissipation Factor (D.F.)Voltage Proof (Vdc)
CGA0402C0G5R0C500GT04021.0+0.10/-0.100.50+0.10/-0.100.15-0.355.00.25pF50C0G-55 to +12530ppm/180mm Reel10,000C0G 10 G or RC 500F (whichever is smaller)10.0%250% RV (RV50V)
CGA0402C0G5R0C500GT04021.0+0.10/-0.100.50+0.10/-0.100.15-0.355.00.25pF50C0G-55 to +12530ppm/180mm Reel10,000C0G 10 G or RC 500F (whichever is smaller)10.0%200% RV (50VRV250V)
CGA0402C0G5R0C500GT04021.0+0.10/-0.100.50+0.10/-0.100.15-0.355.00.25pF50C0G-55 to +12530ppm/180mm Reel10,000C0G 10 G or RC 500F (whichever is smaller)10.0%150% RV (250VRV500V)
CGA0402C0G5R0C500GT04021.0+0.10/-0.100.50+0.10/-0.100.15-0.355.00.25pF50C0G-55 to +12530ppm/180mm Reel10,000C0G 10 G or RC 500F (whichever is smaller)10.0%150% RV (250VRV630V)
CGA0402C0G5R0C500GT04021.0+0.10/-0.100.50+0.10/-0.100.15-0.355.00.25pF50C0G-55 to +12530ppm/180mm Reel10,000C0G 10 G or RC 500F (whichever is smaller)10.0%130% RV (630VRV1000V)
Test ItemTest SpecificationTest Method (Reference Standard: JIS C 5101, IEC60384)MaterialCapacitance ChangeAction TimeAdhesive StrengthAppearanceDimensions
CapacitanceWithin specified tolerance.Capacitance MeasurementC0G1% or 0.5 pF (whichever is larger)101 secN/ANo defects or abnormalities.Conforms to specifications.
CapacitanceWithin specified tolerance.Capacitance MeasurementX7R/X5R10%101 secN/ANo defects or abnormalities.Conforms to specifications.
CapacitanceWithin specified tolerance.Capacitance MeasurementX6S22%101 secN/ANo defects or abnormalities.Conforms to specifications.
Temperature CharacteristicWithin 30ppm/Temperature Cycling TestC0G30ppm/N/AN/ANo defects or abnormalities.N/A
Substrate Bending TestNo terminal detachment, ceramic breakage, etc.Apply gradual force to the center of the specimen horizontally on the P.C. board.AllN/AN/A5N (0402:2.5N / 0201:1N)No defects or abnormalities.N/A
Adhesive Strength of TerminationNo terminal detachment, ceramic breakage, etc.Apply gradual force to the center of the specimen horizontally on the P.C. board.AllN/AN/A5N (0402:2.5N / 0201:1N)No defects or abnormalities.N/A
AppearanceNo defects or abnormalities.Visual (microscope) inspection of the product.AllN/AN/AN/ANo defects or abnormalities.Conforms to specifications.
DimensionsConforms to specifications.Check physical dimensions with a micrometer.AllN/AN/AN/ANo defects or abnormalities.Conforms to specifications.
Test ItemTest SpecificationTest MethodMaterialCapacitance ChangeInsulation ResistanceQuality Factor/Dissipation FactorSolderabilityResistance to Soldering HeatTemperature CycleAppearance
CapacitanceWithin 2.5% or 0.25pF, whichever is greater.Measurement after pre-treatment.C0G2.5% or 0.25pF 10 G or RC 500F (whichever is smaller)350min95% of terminals should be uniformly and continuously soldered.No cracks.No defects or abnormalities.No defects or abnormalities.
CapacitanceX7R/X5R:15%Measurement after pre-treatment.X7R/X5R15% 1 G or RC 50s (whichever is smaller) 7% or 2 times initial value (whichever is larger) for 16V; 5% or 2 times initial value (whichever is larger) for 25V95% of terminals should be uniformly and continuously soldered.No cracks.No defects or abnormalities.No defects or abnormalities.
Insulation ResistanceSame as initial value.Measurement after post-treatment.C0GN/A 10 G or RC 500F (whichever is smaller)350minN/AN/ANo defects or abnormalities.No defects or abnormalities.
Insulation ResistanceSame as initial value.Measurement after post-treatment.X7R/X5R/X6SN/A 1 G or RC 10s (X7R), 1 G or RC 50s (X5R) (whichever is smaller) 7% or 2 times initial value (whichever is larger) for 16V; 5% or 2 times initial value (whichever is larger) for 25VN/AN/ANo defects or abnormalities.No defects or abnormalities.
Quality Factor/Dissipation FactorSame as initial value.Measurement after post-treatment.C0GN/AN/A275+5/2*C minN/AN/ANo defects or abnormalities.No defects or abnormalities.
Quality Factor/Dissipation FactorSame as initial value.Measurement after post-treatment.X7R/X5R/X6SN/AN/A200+10*C minN/AN/ANo defects or abnormalities.No defects or abnormalities.
Solderability95% of terminals should be uniformly and continuously soldered.Solder bath method. Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder). Solder temperature: 2455C. Dwell time: 20.5s.AllN/AN/AN/A95% of terminals should be uniformly and continuously soldered.No cracks.No defects or abnormalities.No defects or abnormalities.
AppearanceNo defects or abnormalities.Visual inspection.AllN/AN/AN/AN/AN/ANo defects or abnormalities.No defects or abnormalities.

2408191625_HRE-CGA0402C0G5R0C500GT_C41361096.pdf

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