Product Overview
The CGA0603X5R106M100JT is a multilayer ceramic capacitor designed for various electronic applications. It features X5R temperature characteristics, a capacitance of 10F, and a rated voltage of 10Vdc. This capacitor is suitable for use in a wide range of electronic circuits where stable capacitance and reliable performance are required.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ceramic dielectric, Nickel internal electrodes, Copper external electrodes
- Color: Not specified
- Certifications: JIS C 5101, IEC60384 (referenced for test methods)
Technical Specifications
| Part Number | Type | Size (mm) | Capacitance | Tolerance | Rated Voltage (Vdc) | Temperature Characteristic | Temperature Range () | Capacitance Change Rate | Packaging | Quantity per Reel |
| CGA0603X5R106M100JT | Multilayer Ceramic Capacitor | 0603 (1.600.20 x 0.800.20) | 10F | 20% | 10 | X5R | -55 to +85 | 15% | Tape Reel (180mm) | 4,000 |
Dimensions
| Component | Length (mm) | Width (mm) | Thickness (mm) | Lead/Termination (mm) |
| Dielectric Ceramic | 1.600.20 | 0.800.20 | 0.800.20 | 0.20-0.65 |
Electrical Characteristics
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Voltage Proof | No defects or abnormalities under test voltage. (250% RV for RV50V) | Test time: 1 to 5 seconds. Charge/discharge current: Max 50mA. |
| Insulation Resistance (I.R.) | 100M | Test temperature: 25. Test voltage: 500V: Rated voltage; >500V: 500V. Charge time: 1 minute. Charge/discharge current: Max 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. Frequency: 120Hz24Hz. Voltage: 0.5V0.1Vrms. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 5.0% (104C>103), 10% (104>C106). C>10F: 7.5% (for 16V), 5% (for 25V) or 2x initial value (whichever is greater). | Frequency: 1.00.1 KHz. Voltage: 1.00.2Vrms. |
| Temperature Characteristics of Capacitance | X5R: 15% | Steps: 1 (252), 2 (Lowest operating temp 3), 3 (252), 4 (Highest operating temp 2), 5 (252). Measurement after thermal equilibrium. |
Mechanical and Environmental Tests
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage, etc. | Mounting method: Soldered onto test substrate. Force: 5 N. Duration: 101s. Application direction: Horizontal to P.C. board. |
| Substrate Bending Test | Appearance: No defects or abnormalities. | Mounting method: Reflow soldered onto P.C. board, then bent 1 mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Soldering temperature: 2455C. Dwell time: 20.5s. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: 7.5% (X7R/X5R). Q/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. Solder bath method: Sn-3.0Ag-0.5Cu. Test temperature: 2605C. Test time: 101s. Preheating temperature: 110C to 140C. Preheating time: 1 minute. Post-treatment: Rest at room temp for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: 7.5% (X7R/X5R). Q/DF: Same as initial. Insulation Resistance: Same as initial. | Mounting method: Soldered onto test substrate. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. Temperature Cycle: 5 cycles. Steps: Lowest temp (303 min), Room temp (2-5 min), Highest temp (303 min), Room temp (2-5 min). Post-treatment: Rest at room temp for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: 12.5% (X5R/X7R). Q/DF: 7% or 2x initial value (whichever is greater) for 16V; 5% or 2x initial value (whichever is greater) for 25V. Insulation Resistance: 500M or RC5s (whichever is smaller). | Mounting method: Reflow soldered onto P.C. board. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. Test temperature: 402C. Test humidity: 90%RH to 95%RH. Test time: 50024 hours. Test voltage: Rated voltage (not exceeding 630V). Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: 12.5% (X5R/X7R). Q/DF: 7% or 2x initial value (whichever is greater) for 16V; 5% or 2x initial value (whichever is greater) for 25V. Insulation Resistance: 1G or RC50s (whichever is smaller) for X5R/X7R. | Mounting method: Soldered onto test substrate. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. Test temperature: Highest operating temp 3C. Test time: 100012 hours. Test voltage (life): 100% R.V. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions before measurement. |
Packaging Information
| Packaging Type | Reel Diameter (mm) | Quantity per Reel | Material |
| Tape Reel | 180 | 4,000 | Paper Tape |
Application Restrictions
Contact manufacturer for applications requiring high reliability, especially in critical systems such as aircraft, aerospace, power plants, medical devices, transportation, disaster prevention, and data processing equipment. Similar applications with high complexity or reliability demands also require consultation.
Transportation and Storage Methods
Transportation: Products are suitable for modern transportation. Protect from rain, acid/alkali corrosion, and avoid dropping or strong compression.
Storage: Shelf life for good solderability is one year from the production date. Once the tape is opened, products should be used within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer ceramic capacitors (MLCCs) may experience short circuits, open circuits, smoke, fire, or explosion under harsh operating conditions exceeding specified frequencies or external mechanical stress. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for any unclear points.
Soldering:
- Solder Quantity: Excessive solder can damage the capacitor due to terminal pressure. Insufficient solder may cause poor contact.
- Recommended Solder Quantity: Refer to specific recommendations for reflow, wave, and iron soldering.
- Recommended Soldering Temperature Curves: Refer to provided curves for reflow and wave soldering, specifying peak temperatures and times for Pb-Sn and lead-free solders.
- Hand Soldering: Requires careful operation to avoid uneven heating, which can cause micro-cracks or localized explosions. Use appropriate tip selection and temperature control. Preheat: 130C. Iron tip temperature: 350C. Iron power: 20W. Tip diameter: 1mm. Soldering time: 3s. Solder paste amount: 1/2 capacitor height. Caution: Iron tip should not directly contact the ceramic body.
2509180925_HRE-CGA0603X5R106M100JT_C6119823.pdf
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