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Specifications
Voltage Rating:
25V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
CGA0805X5R106K250MT
Package:
0805
Key Attributes
Model Number:
CGA0805X5R106K250MT
Product Description
Product Overview
The CGA0805X5R106K250MT is a multilayer ceramic capacitor (MLCC) with an X5R temperature characteristic, offering a capacitance of 10F and a rated voltage of 25Vdc. It is designed for various electronic applications and is supplied in tape and reel packaging.
Product Attributes
- Brand: CGA (implied by product code)
- Origin: China (implied by language of datasheet)
- Material: Ceramic dielectric, Nickel inner electrode, Copper outer electrode, Tin layer
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Model | Size (mm) | Temperature Characteristic | Capacitance | Capacitance Tolerance | Rated Voltage | Thickness (mm) | Packaging | Quantity per Reel |
|---|---|---|---|---|---|---|---|---|
| CGA0805X5R106K250MT | 2.000.20 (L) x 1.250.20 (W) | X5R | 10F | 10% | 25Vdc | 0.20-0.70 | Plastic Tape (7" Reel) | 2,000 |
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
|---|---|---|
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimension | Compliant with specifications. | Micrometer measurement. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. (X7R/X5R: 250% RV for RV50V, 200% RV for 50VRV250V, etc.) Test Time: 1-5s. Max Charge/Discharge Current: 50mA. | - |
| Insulation Resistance (I.R.) | 100M (X7R/X5R) | Test Temperature: 25. Test Voltage: 500V: Rated Voltage, >500V: 500V. Charge Time: 1 minute. Max Charge/Discharge Current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement Temperature: 25. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 3.5% (1.00.1 KHz, 1.00.2Vrms); C>10F: 5.0% (120Hz24Hz, 0.5V0.1Vrms) for 10C>10; 10% for 10>C10; 15% for C>10. | - |
| Temperature Characteristics of Capacitance | X5R: 15% | Steps: Reference Temp (252), Min Operating Temp (3), Reference Temp (252), Max Operating Temp (2), Reference Temp (252). Measurement after 5 minutes at each stage. |
| Adhesive Strength of Termination | No termination peeling, ceramic breakage. | Welded to test substrate. Force: 5 N (101s). Application Direction: Gradual push in horizontal direction. |
| Substrate Bending Test | Appearance: No defects or abnormalities. Capacitance Change: | Reflow soldered onto PCB, bent 1mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (Lead Free). Flux: Isopropyl alcohol Rosin 25% solid solution. Solder Temp: 2455C. Dwell Time: 20.5s. Solder Position: Until both ends are fully wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance Change: 7.5% (X7R/X5R). Q/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. Solder Bath Method: Solder Temp: 2605C. Dwell Time: 101s. Preheating Temp: 110-140C. Preheating Time: 1 minute. Post-treatment: Rest at room temp for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance Change: 7.5% (X7R/X5R). Q/DF: Same as initial. Insulation Resistance: Same as initial. | Welded to test substrate. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. 5 cycles: Min Temp (3) 303 min, Room Temp (2-5 min), Max Temp (3) 303 min, Room Temp (2-5 min). Post-treatment: Rest at room temp for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance Change: 12.5% (X5R/X7R). Q/DF: 16V: 7% or 2x initial; 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Reflow soldered onto PCB. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. Test Temp: 402. Test Humidity: 90%-95%RH. Test Time: 50024 hours. Test Voltage: Rated voltage (630V). Max Charge/Discharge Current: 50mA. Voltage Conditioning: 1 hour at test temp/voltage, then 242 hours at ambient conditions before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance Change: 12.5% (X5R/X7R). Q/DF: 16V: 7% or 2x initial; 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Welded to test substrate. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then rest at room temp for 242 hours. Test Temp: Max operating temp 3. Test Time: 100012 hours. Test Voltage (life): 100% R.V. Max Charge/Discharge Current: 50mA. Voltage Conditioning: 1 hour at test temp/voltage, then 242 hours at ambient conditions before measurement. |
| Size (mm) | Tape Type | Reel Size (7") | Packs/Box | Boxes/Carton |
|---|---|---|---|---|
| 0805 | Paper/Plastic | Yes | 5 | 12 |
| Carrier Tape Type | P1 (mm) | P0 (mm) | P2 (mm) | A (mm) | B (mm) | W (mm) | E (mm) | F (mm) | D (mm) | T1 (max) | T2 (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Plastic Tape | 4 0.1 | 4 0.1 | 2 0.05 | 1.450.2 | 2.3 0.2 | 8 0.2 | 1.750.1 | 3.5 0.05 | 1.5 (+0.1/-0.0) | 2.5 | 0.305 0.1 |
| Reel Size | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | G (mm) | T (mm) |
|---|---|---|---|---|---|---|---|
| 7" Reel (1782.0) | 2.0 0.5 | 13 1.0 | 21 0.8 | 50 or greater | 10 1.0 | 13 1.0 | - |
Application Restrictions: Not recommended for applications with high reliability requirements where defects could cause direct damage to third-party life, body, or property, including aircraft, aerospace, underwater, power plant control, medical, transportation, disaster prevention, data processing, and similar applications.
Transportation & Storage:
- Transportation: Protect from rain, acid-alkali corrosion; avoid dropping and strong pressure.
- Storage: Shelf life for solderability: 1 year from production date. Use within 3 months after unsealing the tape. Storage Temperature: 0 ~35. Storage Relative Humidity: <70%.
Usage Precautions: In harsh environments or under excessive mechanical stress, MLCCs may short circuit, open circuit, smoke, burn, or explode. Refer to specifications and contact technical support for any uncertainties. Ensure proper solder amount (avoiding excessive or insufficient solder) and follow recommended temperature curves for reflow, wave, and hand soldering to prevent damage.
2509180925_HRE-CGA0805X5R106K250MT_C6119887.pdf
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