Product Overview
The CGA1206X7R104K500KT is a multilayer chip ceramic capacitor designed for various electronic applications. It offers stable performance across a wide temperature range with specific capacitance and voltage ratings.
Product Attributes
- Brand: CGA
- Material: Dielectric Ceramic, Nickel (internal electrode), Copper (external electrode), Tin (plating)
Technical Specifications
| Model | Size (mm) | Temperature Characteristic | Capacitance | Capacitance Tolerance | Rated Voltage | Thickness (mm) | Packaging |
| CGA1206X7R104K500KT | 1206 (3.2*1.6) | X7R | 100nF | 10% | 50Vdc | 0.85+0.10/-0.10 | 4,000 pcs (180mm Reel) |
Specifications and Test Methods
| Test Item | Test Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimension | Conforms to specifications. | Micrometer inspection of physical dimensions. |
| Voltage Proof | Withstand test voltage, no defects or abnormalities. | See table for test voltages based on material and rated voltage. Test time: 1-5s. |
| Insulation Resistance (I.R.) | C0G: 10 G or RC 500F (whichever is smaller); X7R/X5R/X6S: 100.0 Mohm | Test temperature: 25. Test points: between terminals. Test voltage: IF500V: Rated Voltage; IF500V: 500V. Charging time: 1 minute. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. See table for capacitance, frequency, and voltage based on material. |
| Q Factor / Dissipation Factor (D.F.) | C0G: 1.00.1 MHz (C1000pF), 1.00.1 KHz (C>1000pF); X7R/X5R/X6S: 10.0% (C>10uF), 1.00.1 KHz (C10uF) | See table for measurement frequency and voltage based on material. |
| Temperature Characteristics of Capacitance | C0G: 30ppm/; X5R: 15%; X6S: 22%; X7R: 15% | Measure capacitance change at specified temperature stages after thermal equilibrium. Steps: Reference temp (252), Min operating temp (3), Reference temp (252), Max operating temp (2), Reference temp (252). |
| Adhesive Strength of Termination | No termination detachment, ceramic breakage. | Weld capacitor to test substrate. Force: 5N (0402:2.5N / 0201:1N). Duration: 101s. Application direction: gradual force applied horizontally to the PC board at the center of the specimen. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C: | Weld capacitor on PC board and bend 1mm. |
| Solderability | 95% of terminations should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temperature: 2455 C. Dwell time: 20.5s. Solder position: until both ends are completely wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: C0G: within 2.5% or 0.25pF (whichever is greater); X7R/X5R/X6S: 7.5%. Q Factor / Dissipation Factor: Same as initial value. Insulation Resistance: Same as initial value. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat at 150+0/-10 C for 1 hour, then stand at room temp for 242 hours. Solder bath method. Solder type: Sn-3.0Ag-0.5Cu. Test temp: 2605. Test time: 101s. Preheating temp: 110 to 140. Preheating time: 1 minute. Post-treatment: Stand at room temp for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: COG; X7R/X5R:15%; X7R/X5R/X6S. Q Factor / Dissipation Factor: Same as initial value. Insulation Resistance: Same as initial value. | Pre-treatment: Heat at 150+0/-10 C for 1 hour, then stand at room temp for 242 hours. Temperature cycle: 5 cycles. Steps: Min temp (3) 303min, Room temp 2~5min, Max temp (3) 303min, Room temp 2~5min. Post-treatment: Stand at room temp for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R:12.5%. Q Factor / Dissipation Factor: (COG) C30pF 350min, 10pFC30pF 275+5/2*C min, 10pF 200+10*C min; (X7R/X5R/X6S) 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: 500M or R.C 5s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temp for 242 hours. Test temp: 402. Test humidity: 90% RH to 95% RH. Test time: 50024 hours. Test voltage: Rated voltage (not exceeding 630V). Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R:15%. Q Factor / Dissipation Factor: (C0G) C30pF 350min, 10pFC30pF 275+5/2*C min, 10pF 200+10*C min; (X7R/X5R/X6S) 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: X7R: 1G or R.C10s; X5R: 1G or R.C 50s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10 C for 1 hour, then stand at room temp for 242 hours. Test temp: Max operating temp 3. Test time: 100012 hours. Test voltage (life): 100% R.V. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions. |
Packaging Specifications
| Size Code | Size (mm) | Tape Specification | Quantity per Reel | Material |
| 01005 | 0.40*0.20 | Paper Tape | 20,000 | Paper |
| 0201 | 0.60*0.30 | Paper Tape | 15,000 | Paper |
| 0402 | 1.00*0.50 | Paper Tape | 10,000 | Paper |
| 0603 | 1.60*0.80 | Paper Tape | 4,000 | Paper |
| 0805 | 2.00*1.25 | Paper Tape | 4,000 | Paper |
| 0805 | 2.00*1.25 | Plastic Tape | 2,000 | Plastic |
| 1206 | 3.20*1.60 | Paper Tape | 4,000 | Paper |
| 1206 | 3.20*1.60 | Plastic Tape | 2,000 | Plastic |
| 1206 | 3.20*1.60 | Plastic Tape | 2,000 | Plastic |
| 1210 | 3.20*2.50 | Plastic Tape | 3,000 | Plastic |
| 1210 | 3.20*2.50 | Plastic Tape | 2,000 | Plastic |
| 1210 | 3.20*2.50 | Plastic Tape | 1,000 | Plastic |
| 1210 | 3.20*2.50 | Plastic Tape | 1,000 | Plastic |
Application Restrictions
Contact manufacturer for applications requiring high reliability, especially those that could directly cause damage to third-party life, body, or property. Examples include: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and similar applications with high complexity and/or reliability requirements.
Transportation and Storage Methods
Transportation: Packaged products are suitable for modern transportation. Protect from rain and corrosive substances. Avoid heavy dropping and forceful compression.
Storage: Shelf life for good solderability is one year from the date of manufacture. Do not open tape reels before use. Once opened, products should be used within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer chip ceramic capacitors (MLCCs) may experience short circuits, open circuits, smoke, fire, or explosion under harsh operating environments exceeding specified frequencies, or under external mechanical overpressure. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for clarification.
Soldering Recommendations
Solder Amount: A. Excessive solder can damage the capacitor due to excessive terminal pressure. B. Insufficient solder may lead to poor contact between the capacitor chip and the circuit.
Recommended Solder Amount: See document for details on reflow soldering, wave soldering, and soldering iron rework.
Recommended Soldering Temperature Curve: See document for details on reflow soldering and wave soldering.
2410300953_HRE-CGA1206X7R104K500KT_C42371678.pdf
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