Product Overview
The CGA1206X7R684K500MT is a multilayer ceramic capacitor designed for a wide range of electronic applications. It offers stable performance across various temperatures and is built with high-quality dielectric ceramic, nickel inner electrodes, copper outer electrodes, and tin plating. This capacitor is suitable for applications requiring reliable capacitance and voltage ratings.
Product Attributes
- Brand: CGA
- Origin: Not specified
- Material: Dielectric ceramic, Nickel (inner electrode), Copper (outer electrode), Nickel layer, Tin layer
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Model | Type | Capacitance | Tolerance | Rated Voltage | Temperature Characteristic | Dimensions (L*W*T) | Packaging |
|---|---|---|---|---|---|---|---|
| CGA1206X7R684K500MT | X7R | 680nF | ±10% | 50Vdc | X7R (±15% from -55 to +125) | 3.2mm*1.6mm*0.85mm | 3,000 pcs/reel (180mm) |
Specifications and Test Methods
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384 |
|---|---|---|
| Appearance | No defects or abnormalities. | Visual (microscope) inspection of the product. |
| Dimension | Conforms to specifications. | Check physical dimensions with a micrometer. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | C0G: 250% RV (RV50V), 200% RV (50VRV250V), 150% RV (250VRV500V), 130% RV (500VRV1000V); X7R/X5R/X6S: 250% RV (RV50V), 200% RV (50VRV250V), 150% RV (250VRV630V), 120% RV (630VRV1000V). Test time: 1 to 5 seconds. Max charging/discharging current: 50mA. |
| Insulation Resistance (I.R.) | C0G: 10 G or RC500F (whichever is smaller); X7R/X5R/X6S: 100.0 M | Test temperature: 25. Test points: Between terminals. Test voltage: IF500V: Rated Voltage, IF500V: 500V. Charging time: 1 minute. Max charging/discharging current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. C0G: C1000pF @ 1.0±0.1MHz, 0.5-5.0Vrms; C>1000pF @ 1.0±0.1KHz, 1.0±0.2Vrms. X7R/X5R/X6S: C10uF @ 120Hz±24Hz, 0.5V±0.1Vrms; C10uF @ 1.0±0.1KHz, 1.0±0.2Vrms. |
| Quality Factor / Dissipation Factor (D.F.) | C0G: Not specified; X7R/X5R/X6S: 10.0% | See Capacitance test method. |
| Temperature Characteristics of Capacitance | C0G: ±30ppm/; X5R: ±15%; X6S: ±22%; X7R: ±15% | Measured after 5 minutes at each specified temperature stage. Steps: 1. Reference temp (25±2), 2. Min operating temp (±3), 3. Reference temp (25±2), 4. Max operating temp (±2), 5. Reference temp (25±2). |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage, etc. | Capacitor soldered to test substrate. Force: 5N (0402:2.5N / 0201:1N). Time: 10±1 sec. Direction: Gradually apply force horizontally to the center of the specimen. |
| Substrate Bending Test | Appearance: No defects or abnormalities. Capacitance change: <Universal Series> X7R/X5R: ±10%; <High Capacitance Series> X7R/X5R: ±12.5%; C0G: ±1% or 0.5 pF (whichever is larger). | Capacitor reflow soldered on PCB, then bent 1mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temperature: 245±5C. Dwell time: 2±0.5s. Solder position: Until both ends are completely wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: C0G: ±2.5% or ±0.25 pF (whichever is larger); X7R/X5R/X6S: ±7.5%. Quality Factor/Dissipation Factor: Same as initial value. Insulation Resistance: Same as initial value. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temp for 24±2 hours. Solder bath method. Solder type: Sn-3.0Ag-0.5Cu. Test temperature: 260±5. Test time: 10±1s. Preheating temperature: 110 to 140. Preheating time: 1 minute. Post-treatment: Stand at room temp for 24±2 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: C0G: Not specified; X7R/X5R/X6S: ±15%. Quality Factor/Dissipation Factor: Same as initial value. Insulation Resistance: Same as initial value. | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temp for 24±2 hours. Temperature cycle: 5 cycles. Steps: 1. Min temp (±3) 30±3min, 2. Room temp 2~5min, 3. Max temp (±3) 30±3min, 4. Room temp 2~5min. Post-treatment: Stand at room temp for 24±2 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: ±12.5%. Quality Factor/Dissipation Factor (C0G): C30pF 350min, 10pF C 30pF 275+5/2*C min, 10pF 200+10*C min. Quality Factor/Dissipation Factor (X7R/X5R/X6S): 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is larger). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temp for 24±2 hours. Test temperature: 40±2. Test humidity: 90%RH to 95%RH. Test time: 500±24 hours. Test voltage: Rated voltage (not exceeding 630V). Max charging/discharging current: 50mA. Voltage conditioning: 1 hour at test temp/voltage, then 24±2 hours at ambient. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: ±15%. Quality Factor/Dissipation Factor (C0G): C30pF 350min, 10pF C 30pF 275+5/2*C min, 10pF 200+10*C min. Quality Factor/Dissipation Factor (X7R/X5R/X6S): 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is larger). Insulation Resistance: X7R: 1G or R.C10s; X5R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hour, then stand at room temp for 24±2 hours. Test temperature: Max operating temp ±3. Test time: 1000±12 hours. Test voltage (life): 100% R.V. Voltage conditioning: 1 hour at test temp/voltage, then 24±2 hours at ambient. |
Application Scenarios
The CGA1206X7R684K500MT is suitable for various applications, including but not limited to: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment (vehicles, trains, ships, etc.), traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and other applications with similar complexity and/or reliability requirements. It is recommended to contact the manufacturer for applications requiring particularly high reliability to prevent damage to third parties' life, body, or property.
Transportation and Storage
Transportation: Products are packaged to withstand modern transportation methods. Protect from rain, acid-alkali corrosion, and avoid heavy impact or forceful extrusion.
Storage: For optimal solderability, store for one year from the date of production. Do not open the tape reel until use. Once opened, use within three months. Storage temperature: 0~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer Ceramic Capacitors (MLCCs) may experience short circuits, open circuits, smoke, fire, or explosion under harsh operating conditions exceeding specified frequencies or external mechanical overpressure. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for any unclear matters.
Soldering Considerations:
- Solder Amount: Excessive solder can damage the capacitor due to terminal stress. Insufficient solder may lead to poor contact between the capacitor chip and the circuit.
- Recommended Solder Amount: Refer to specific recommendations for reflow, wave, and rework soldering.
- Recommended Soldering Temperature Curves: Follow guidelines for reflow and wave soldering, including peak temperature and time. For manual soldering, use caution to avoid localized heating, microcracks, or explosions. Recommended preheating, iron tip temperature, power, diameter, and soldering time are provided. Ensure the iron tip does not directly contact the ceramic body.
2405281634_HRE-CGA1206X7R684K500MT_C22440595.pdf
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