Product Overview
Multilayer Chip Ceramic Capacitor (MLCC) designed for various electronic applications. Offers stable performance across a wide temperature range and reliable electrical characteristics.
Product Attributes
- Brand: CGA
- Material: Multi-layer chip ceramic capacitor
- Packaging: 180mm reel
Technical Specifications
| Model | Size (mm) | Capacitance | Capacitance Tolerance | Rated Voltage | Temperature Characteristic | Temperature Range | Thickness (mm) | Packaging Quantity |
| CGA0805X5R106K350MT | 0805 (2.000.20 x 1.250.20) | 10uF | 10% | 35Vdc | X5R | -55 to +85 | 0.2-0.7 | 2,000 |
Specifications and Test Methods
| Test Item | Material | Test Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Capacitance | C0G | Within specified tolerance. | Test Voltage: 0.5-5.0Vrms (C1000pF), 1.00.2Vrms (C>1000pF) |
| Capacitance | X7R/X5R/X6S | Within specified tolerance. | Test Voltage: 0.5V0.1Vrms (C10uF) |
| Insulation Resistance(I.R.) | C0G | 10 G or RC 500F (whichever is smaller) | Test Voltage: 250VRV630V (150% RV) |
| Insulation Resistance(I.R.) | X7R/X5R/X6S | 100.0 Mohm | Test Voltage: 630VRV1000V (120% RV) |
| Voltage proof | C0G | Withstand test voltage, no defects or abnormalities. | Test Time: 1 to 5 seconds |
| Voltage proof | X7R/X5R/X6S | Withstand test voltage, no defects or abnormalities. | Test Voltage: RV50V (300% RV), 50VRV250V (200% RV), 250VRV500V (150% RV) |
| Quality Factor / Dissipation Factor (D.F.) | C0G | 10 | Frequency: 1.00.1MHz |
| Quality Factor / Dissipation Factor (D.F.) | X7R/X5R/X6S | 10 | Frequency: 1.00.1KHz |
| Appearance | All | No defects or abnormalities. Visual (microscope) inspection. | - |
| Dimension | All | Conforms to specifications. Check physical dimensions with a micrometer. | - |
| Temperature Characteristics of Capacitance | C0G | 1% or 0.5 pF (whichever is greater) | Measurement temperature: 252, Test temperature: -55 to +125 |
| Temperature Characteristics of Capacitance | X7R/X5R | 10% (General Series), 12.5% (High Capacitance Series) | Measurement temperature: 252, Test temperature: -55 to +125 |
| Temperature Characteristics of Capacitance | X6S | 22% | Measurement temperature: 252, Test temperature: -55 to +105 |
| Temperature Characteristics of Capacitance | X5R | 15% | Measurement temperature: 252, Test temperature: -55 to +85 |
| Substrate Bending test | All | No terminal peeling, ceramic breakage, or other defects. Apply gradual force to the center of the specimen horizontally on the P.C. board. | Force: 5N (0402:2.5N / 0201:1N) |
| Adhesive Strength of Termination | All | No terminal peeling, ceramic breakage, or other defects. Solder capacitor on P.C. board and bend by 1mm. | - |
| Solderability | All | 95% of terminations should be uniformly and continuously soldered. Solder bath method. Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder). Solder temperature: 2455C. Duration: 20.5s. | - |
| Resistance to Soldering Heat | All | No cracks in appearance. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Test temperature: 2605C. Test time: 101s. |
| Temperature Cycle | All | No defects or abnormalities. Capacitance change within specified limits. | 5 cycles. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Test temperature: -55 to +125. |
| Insulation Resistance | All | Same as initial value. | Post-treatment: Stand at room temperature for 242 hours. |
| Capacitance | All | Same as initial value. | Post-treatment: Stand at room temperature for 242 hours. |
| Quality Factor / Dissipation Factor | All | Same as initial value. | Post-treatment: Stand at room temperature for 242 hours. |
| Life | X7R/X5R | Capacitance: 12.5%. Insulation Resistance: 1G or R.C50s (whichever is smaller). Quality Factor/Dissipation Factor: 7% or 2 times initial value (whichever is greater) for 16V; 5% or 2 times initial value (whichever is greater) for 25V. | Test Voltage: 100% R.V. Test time: 100012 hours. Test temperature: Maximum operating temperature 3. |
| Life | C0G | Capacitance: 2.5% or 0.25pF (whichever is greater). Insulation Resistance: 350min. Quality Factor/Dissipation Factor: 275+5/2*C min. | Test Voltage: 100% R.V. Test time: 100012 hours. Test temperature: Maximum operating temperature 3. |
| High Temperature High Humidity (Load) | X7R/X5R/X6S | Capacitance: 15%. Insulation Resistance: 1G or R.C10s (X7R), 1G or R.C50s (X5R) (whichever is smaller). Quality Factor/Dissipation Factor: 7% or 2 times initial value (whichever is greater) for 16V; 5% or 2 times initial value (whichever is greater) for 25V. | Test Voltage: Rated voltage (not exceeding 630V). Test time: 50024 hours. Test temperature: 402. Test humidity: 90%RH to 95%RH. |
| High Temperature High Humidity (Load) | C0G | Capacitance: 7.5%. Insulation Resistance: 200+10*C min. Quality Factor/Dissipation Factor: 350min. | Test Voltage: Rated voltage (not exceeding 630V). Test time: 50024 hours. Test temperature: 402. Test humidity: 90%RH to 95%RH. |
Packaging Specifications
| Size (mm) | Carrier Tape | Reel Size | Packs/Box | Boxes/Carton | Packaging Material |
| 01005 | Paper Tape | 7" | 10,000 | - | Paper Tape |
| 0201 | Paper Tape | 7" | 15,000 | - | Paper Tape |
| 0402 | Paper Tape | 7" | 20,000 | - | Paper Tape |
| 0603 | Paper Tape | 7" | 4,000 | - | Paper Tape |
| 0805 | Paper Tape/Plastic Tape | 7" | 2,000 | 5 | Paper Tape/Plastic Tape |
| 1206 | Paper Tape/Plastic Tape | 7" | 1,000 | 12 | Paper Tape/Plastic Tape |
| 1210 | Plastic Tape | 7" | 1,000 | 12 | Plastic Tape |
Usage Precautions
Storage temperature: 0~35. Storage relative humidity: <70%. Shelf life: One year from the date of production. Unopened tape packages should be used within three months after opening. Avoid harsh operating environments or external mechanical stress to prevent short circuits, open circuits, smoking, burning, or explosion. Contact technical support for any uncertainties. Application limitations apply to high-reliability applications such as aircraft, aerospace, medical, and transportation equipment.
Soldering Recommendations
Reflow Soldering: Peak temperature 230250 (Pb-Sn), 240260 (Lead Free). Peak time 3s10s. Ensure proper solder amount to avoid damage or poor contact. Avoid direct contact of soldering iron tip with the ceramic body during manual soldering.
2501031610_HRE-CGA0805X5R106K350MT_C6119888.pdf
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