CGA0402X5R105K160GT Multilayer Ceramic Capacitor
This product specification applies to multilayer ceramic chip capacitors. The CGA0402X5R105K160GT is a 0402-sized capacitor with X5R temperature characteristics, a capacitance of 1F, and a rated voltage of 16Vdc. It is designed for various electronic applications requiring reliable capacitance performance.
Product Attributes
- Brand: CGA
- Origin: Not specified
- Material: Dielectric ceramic, Nickel inner electrode, Copper outer electrode
- Color: Not specified
- Certifications: JIS C 5101, IEC60384 (referenced for test methods)
Technical Specifications
| Model | Size (mm) | Temperature Characteristic | Capacitance | Capacitance Tolerance | Rated Voltage | Thickness | Packaging |
| CGA0402X5R105K160GT | 1.00+0.20/-0.05 (L) x 0.50+0.20/-0.05 (W) | X5R (15% from -55 to +85) | 1F | 10% | 16Vdc | 0.50+0.20/-0.05 | 10,000 pcs/reel (180mm) |
| Test Item | Test Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimension | Complies with specifications. | Micrometer measurement. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | X7R/X5R: 250% RV (for RV50V) up to 120% RV (for 630V |
| Insulation Resistance (I.R.) | 100M (for X7R/X5R) | Test temperature: 25. Between terminals. Test voltage: 500V: Rated voltage; >500V: 500V. Charging time: 1 minute. Max charging/discharging current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. Frequency and voltage vary by capacitance value. |
| Q factor / Dissipation Factor (D.F.) | C10F: 3.5% (1.00.1 KHz, 1.00.2Vrms). 10F | N/A |
| Temperature Characteristics of Capacitance | X5R: 15% | Measured at specified temperature stages after thermal equilibrium. Steps: 252, lowest operating temp 3, 252, highest operating temp 2, 252. Measurement after 5 minutes at each stage. |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage, etc. | Capacitor soldered to test substrate. Force: 5N (2.5N for 0402). Time: 101s. Direction: Horizontal to PC board center. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C: | Capacitor reflow soldered on PC board, then bent 1mm. |
| Solderability | 95% of the terminations shall be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (Lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temp: 2455C. Dwell time: 20.5s. Solder position: Until both ends are completely wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial value. Insulation Resistance: Same as initial value. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then room temp for 242 hours. Solder bath method: Sn-3.0Ag-0.5Cu. Test temp: 2605C. Test time: 101s. Preheating temp: 110-140C. Preheating time: 1 minute. Post-treatment: Room temp for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial value. Insulation Resistance: Same as initial value. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then room temp for 242 hours. 5 cycles: Low temp (3) for 303 min, Room temp (2-5 min), High temp (3) for 303 min, Room temp (2-5 min). Post-treatment: Room temp for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then room temp for 242 hours. Test temp: 402. Test humidity: 90%-95%RH. Test time: 50024 hours. Test voltage: Rated voltage (630V). Voltage conditioning: 1 hour at test temp/voltage, then 242 hours at ambient conditions before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then room temp for 242 hours. Test temp: Highest operating temp 3. Test time: 100012 hours. Test voltage: 100% R.V. Voltage conditioning: 1 hour at test temp/voltage, then 242 hours at ambient conditions before measurement. |
Packaging Specifications
Tape and reel packaging is the most common method. A 180mm (7") reel can contain 10,000 capacitors. Packaging can be customized upon request.
Carrier Tape Dimensions (for 0402 size):
P1: 4.000.10, P0: 4.000.10, P2: 2.000.05, A: 0.620.05, B: 1.120.05, W: 8.000.30, E: 1.750.10, F: 3.500.05, D: 1.50 +0.10/-0.03, t: 0.600.05
Reel Dimensions: 7" Reel 1782.0, Hub: 2.00.5, Inner Diameter: 131.0, Outer Diameter: 210.8, Flange Diameter: 50 or larger, Width: 101.0, Thickness: 131.0
Packaging Method: Standard packaging uses 180mm (7") reels. 5 reels are packed per box, and 12 boxes per carton. Partial boxes are packed separately. Custom packaging is available.
Embossed Carrier Tape Usage Instructions: Upper tape (film) should be peeled off at a speed of 30010mm/min at an angle of 165~180. Peeling strength should be between 0.1N0.7N (10g.f peeling force 70g.f).
Application Restrictions
Contact manufacturer before using in applications requiring high reliability, especially those that could cause direct damage to third-party life, body, or property. This includes, but is not limited to: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment (vehicles, trains, ships, etc.), traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and applications with similar complexity or reliability requirements.
Transportation and Storage Methods
Transportation: Packaged products are suitable for modern transportation. Protect from rain, acid/alkali corrosion. Avoid heavy impact and forceful extrusion.
Storage: To ensure good solderability, the shelf life is one year from the date of manufacture. Do not open the carrier tape until use. Once opened, products should be used within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer Ceramic Chip Capacitors (MLCCs) may experience short circuits, open circuits, smoking, burning, or even explosion under harsh operating conditions exceeding specified frequencies or external mechanical overpressure. Always follow the specifications in this document. Contact the technical, quality control, or production department for any unclear points.
1. Solder Amount during Soldering:
- A. Excessive solder can damage the capacitor due to excessive pressure on the terminal.
- B. Insufficient solder may lead to poor contact between the capacitor chip and the circuit.
2. Recommended Solder Amount: (Specific recommendations for reflow, wave, and iron soldering are detailed in the original document but not provided in extractable format here.)
3. Recommended Soldering Temperature Curve:
- Reflow Soldering:
- Pb-Sn Solder: Peak Temp 230~250, Peak Time 3s~10s.
- Lead-free Solder: Peak Temp 240~260, Peak Time 3s~10s.
- Wave Soldering:
- Pb-Sn Solder: Peak Temp 230~260, Peak Time within 3s.
- Lead-free Solder: Peak Temp 240~270, Peak Time within 3s.
- Manual Soldering: Use caution to avoid uneven local heating, which can cause micro-cracks or local explosions. Select appropriate soldering iron tip and control tip temperature carefully.
- Preheating: 130
- Iron Tip Temperature: 350
- Iron Power: 20W
- Iron Tip Diameter: Recommended 1mm
- Soldering Time: 3s
- Solder Paste Amount: 1/2 capacitor height
- Caution: Iron tip should not directly contact the ceramic body.
2509180925_HRE-CGA0402X5R105K160GT_C6119792.pdf
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