Product Overview
The CGA0201X5R225M6R3ET is a multilayer ceramic capacitor (MLCC) with X5R temperature characteristics. It offers a capacitance of 2.2F and a rated voltage of 6.3Vdc. Designed for surface mounting, this component is suitable for various electronic applications requiring stable capacitance over a wide temperature range.
Product Attributes
- Brand: CGA
- Type: Multilayer Chip Ceramic Capacitor
- Temperature Characteristic: X5R
- Packaging: Tape & Reel (180mm diameter)
Technical Specifications
| Part Number | Dimensions (mm) | Capacitance | Rated Voltage | Temperature Characteristic | Tolerance | Thickness | Packaging Quantity |
| CGA0201X5R225M6R3ET | 0.60 x 0.30 | 2.2F | 6.3Vdc | X5R | 20% | 0.30 | 15,000 |
Specifications and Test Methods
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimensions | Conforms to specifications. | Check physical dimensions with a micrometer. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | X7R/X5R: 250% RV (RV50V), 200% RV (50VRV250V), 150% RV (250VRV630V), 120% RV (630VRV1000V). Test time: 1-5s. Max charge/discharge current: 50mA. |
| Insulation Resistance (I.R.) | 100M | Test Temp: 25. Between terminals. Test Voltage: 500V: Rated Voltage; >500V: 500V. Charge time: 1 min. Max charge/discharge current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement Temp: 25. Frequency/Voltage as per material. |
| Q factor / Dissipation Factor (D.F.) | C10F: 3.5% (120Hz24Hz, 0.5V0.1Vrms); 104C103: 5.0%; 104C106: 10%; C10F: 5.0% (1.00.1 KHz, 1.00.2Vrms); C106: 15%. | As per material. |
| Temperature Characteristics of Capacitance | X5R: 15% | Measured at specified temperature steps after thermal equilibrium. Steps: 25, lowest operating temp, 25, highest operating temp, 25. |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage, etc. | Weld capacitor to test board. Force: 1N (for 0201). Time: 101s. Direction: Horizontal to PC board. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C | Solder capacitor on PC board, bend 1mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temp: 2455C. Dwell time: 20.5s. Solder position: until both ends are fully wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R: 7.5%. Q factor/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat at 150+0/-10C for 1 hr, then stand at room temp for 242 hrs. Solder bath method: Solder type: Sn-3.0Ag-0.5Cu. Test temp: 2605C. Test time: 101s. Preheating temp: 110-140C. Preheating time: 1 min. Post-treatment: Stand at room temp for 242 hrs. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 7.5%. Q factor/DF: Same as initial. Insulation Resistance: Same as initial. | Pre-treatment: Heat at 150+0/-10C for 1 hr, then stand at room temp for 242 hrs. 5 cycles: Step 1: Min temp (303 min). Step 2: Room temp (2-5 min). Step 3: Max temp (303 min). Step 4: Room temp (2-5 min). Post-treatment: Stand at room temp for 242 hrs. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q factor/DF: 16V: 7% or 2x initial; 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hr, then stand at room temp for 242 hrs. Test temp: 402C. Test humidity: 90%-95%RH. Test time: 50024 hrs. Test voltage: Rated voltage (630V). Max charge/discharge current: 50mA. Voltage conditioning: 1 hr at test temp/voltage, then 242 hrs in ambient conditions before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q factor/DF: 16V: 7% or 2x initial; 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hr, then stand at room temp for 242 hrs. Test temp: Max operating temp. Test time: 100012 hrs. Test voltage: 100% R.V. Max charge/discharge current: 50mA. Voltage conditioning: 1 hr at test temp/voltage, then 242 hrs in ambient conditions before measurement. |
Packaging Information
| Size (mm) | Tape Type | Reel Size | Pans/Box | Boxes/Carton |
| 0201 | Paper Tape | 7" | 5 | 12 |
Reel Tape Usage Instructions: Upper tape (film) should be peeled off at a speed of 30010mm/min at an angle of 165~180. Peel strength: 0.1N0.7N (10g.f peel force 70g.f).
Application Limitations
Contact manufacturer before use in applications requiring high reliability, such as: aircraft equipment, aerospace equipment, underwater equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and similar applications with high complexity and/or reliability requirements.
Transportation and Storage Methods
Transportation: Packaged products are suitable for modern transportation. Prevent rain, acid/alkali corrosion, heavy dropping, and strong extrusion during transport.
Storage: Shelf life for good solderability is one year from the production date. Do not open the tape before use. Once opened, use within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
In harsh operating environments exceeding specified frequencies or under external mechanical overpressure, MLCCs may short circuit, open circuit, smoke, burn, or explode. Always follow the specifications. Consult the technical, quality control, or production department for any uncertainties.
Soldering Considerations:
- Solder Amount: Too much solder can damage the capacitor due to excessive terminal pressure. Too little solder may cause poor contact between the capacitor chip and the circuit.
- Recommended Solder Amount: Refer to specific recommendations for reflow soldering, wave soldering, and rework.
- Recommended Soldering Temperature Curve:
- Reflow Soldering: Peak temp: 230~250 (Pb-Sn), 240~260 (Lead-free). Peak time: 3s~10s.
- Wave Soldering: Peak temp: 230~260 (Pb-Sn), 240~270 (Lead-free). Peak time: Within 3s.
- Hand Soldering: Use caution to avoid uneven heating causing micro-cracks or localized explosions. Use appropriate tip size ( 20W, 1mm tip diameter), tip temperature ( 350), preheating ( 130), and soldering time ( 3s). Ensure the soldering iron tip does not directly contact the ceramic body.
2509180925_HRE-CGA0201X5R225M6R3ET_C6119760.pdf
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