CGA0603X7R103K500JT Multilayer Ceramic Capacitor
This product specification applies to CGA0603X7R103K500JT multilayer ceramic chip capacitors. These capacitors are designed for general-purpose applications and are suitable for various electronic circuits.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ceramic, Nickel, Copper, Tin
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Model | Type | Capacitance | Tolerance | Rated Voltage | Temperature Characteristics | Dimensions (mm) (L*W*T) | Packaging |
| CGA0603X7R103K500JT | 0603 X7R | 10nF | 10% | 50Vdc | X7R (15% from -55 to +125) | 1.600.20 * 0.800.20 * 0.800.20 | 180mm Reel, 4,000 pcs |
Performance and Test Methods
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Appearance | No defects or abnormalities. | Visual (microscope) inspection of product. |
| Dimensions | Conforms to specifications. | Check physical dimensions of equipment using a micrometer. |
| Voltage Proof | Withstand test voltage, no defects or abnormalities. | X7R/X5R RV50V: 250% RV; 50VRV250V: 200% RV; 250VRV630V: 150% RV; 630VRV1000V: 120% RV. Test time: 1 to 5 seconds. Max charging/discharging current: 50mA. |
| Insulation Resistance (I.R.) | X7R/X5R 4G | Test temperature: 25. Test points: Between terminals. Test voltage: 500V: Rated voltage; >500V: 500V. Charging time: 1 minute. Max charging/discharging current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. |
| Q factor / Dissipation Factor (D.F.) | C10F: 1.00.1 KHz, 1.00.2Vrms; C>10F: 120Hz24Hz, 0.5V0.1Vrms. X7R/X5R: C103: 3.5%; 104C103: 5.0%; 104C106: 10%; C106: 15%. | |
| Temperature Characteristics of Capacitance | X7R 15% | Measure capacitance change at each specified temperature stage. Steps: 1. Reference Temp (252), 2. Min Op Temp (3), 3. Reference Temp (252), 4. Max Op Temp (2), 5. Reference Temp (252). |
| Adhesive Strength of Termination | No terminal detachment, ceramic breakage, etc. | Mount capacitor on test substrate. Force: 5 N (0402: 2.5 N / 0201: 1 N). Duration: 101 sec. Direction: Apply force horizontally in the center of the specimen. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C | Reflow solder capacitor on PCB, then bend by 1 mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Soldering temp: 2455C. Dwell time: 20.5s. Solder position: Until both ends are completely wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R 7.5%. Q factor/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat treatment at 150 +0/-10C for 1 hour, then stand at room temp for 242 hours. Solder bath method: Solder type Sn-3.0Ag-0.5Cu. Test temp: 2605. Test time: 101s. Preheating temp: 110 to 140. Preheating time: 1 minute. Post-treatment: Stand at room temp for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R 7.5%. Q factor/DF: Same as initial. Insulation Resistance: Same as initial. | Pre-treatment: Heat treatment at 150 +0/-10C for 1 hour, then stand at room temp for 242 hours. Temperature cycle: 5 cycles. Steps: 1. Min Temp (3) 303 min, 2. Room Temp 2~5 min, 3. Max Temp (3) 303 min, 4. Room Temp 2~5 min. Post-treatment: Stand at room temp for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R 12.5%. Q factor/DF: (X7R/X5R) 16V: 7% or 2x initial (whichever is greater); 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temp for 242 hours. Test temp: 402. Test humidity: 90%RH to 95%RH. Test time: 50024 hours. Test voltage: Rated voltage (630V). Voltage conditioning: Apply voltage for 1 hour at test temp and voltage, then condition at ambient for 242 hours before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R 12.5%. Q factor/DF: (X5R/X7R) 16V: 7% or 2x initial (whichever is greater); 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temp for 242 hours. Test temp: Max operating temp 3. Test time: 100012 hours. Test voltage (life): 100% R.V. Voltage conditioning: Apply voltage for 1 hour at test temp and voltage, then condition at ambient for 242 hours before measurement. |
Packaging Specifications
| Size (mm) | Tape Type | Reel Size | Pcs/Reel | Reels/Box | Boxes/Carton |
| 0603 | Paper Tape | 7" | 4,000 | 5 | 12 |
Application Restrictions
Contact us before using our products in applications requiring high reliability, especially those that could directly cause damage to third-party life, body, or property, including but not limited to: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and applications with similar complexity and/or reliability requirements.
Transportation and Storage Methods
Transportation: Packaged products are suitable for modern transportation. Prevent rain and corrosive substances during transport. Avoid heavy dropping and forceful squeezing.
Storage: Guaranteed solderability for one year from the date of manufacture. Use within three months after unsealing the tape. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer ceramic chip capacitors (MLCCs) may experience short circuits, open circuits, smoke, fire, or explosion under harsh operating conditions beyond specified frequencies or external mechanical overpressure. Always refer to this specification and related documents. Contact our technical, quality control, or production departments for clarification.
1. Solder Amount: Excessive solder can damage the capacitor due to terminal pressure. Insufficient solder may lead to poor contact between the chip and the circuit.
2. Recommended Solder Amount: Refer to specific recommendations for reflow soldering, wave soldering, and iron rework.
3. Recommended Soldering Temperature Curve:
- Reflow Soldering: Peak temp 240 ~260, peak time 3s10s for lead-free solder.
- Wave Soldering: Peak temp 240 ~270, peak time within 3s for lead-free solder.
- Manual Soldering: Handle with care to avoid localized heating. Use a suitable iron tip and control tip temperature. Preheating 130, Tip Temp 350, Power 20W, Tip Diameter 1mm, Soldering Time 3s. Do not let the iron tip directly contact the ceramic body.
2509180925_HRE-CGA0603X7R103K500JT_C7503504.pdf
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