Multilayer Ceramic Capacitor CGA0805X7R102K500KT
This product specification applies to multilayer ceramic chip capacitors. The CGA0805X7R102K500KT is an 0805-sized capacitor with X7R temperature characteristics, a capacitance of 1nF, and a rated voltage of 50Vdc. It is designed for surface mounting and is supplied in tape and reel packaging.
Product Attributes
- Brand: CGA
- Model: CGA0805X7R102K500KT
- Packaging: Tape and Reel (180mm diameter)
- Material: Ceramic dielectric, Nickel inner electrode, Copper outer electrode, Tin layer
- Color: Not specified
- Certifications: Referenced standards: JIS C 5101, IEC60384
Technical Specifications
| Parameter | Specification | Test Method (Reference Standard) |
|---|---|---|
| Dimensions (mm) | Length: 2.000.20, Width: 1.250.10, Thickness: 0.850.10, Electrode thickness: 0.20-0.70 | Visual (Microscope) Inspection, Micrometer |
| Temperature Characteristics | X7R: 15% within -55 to +125 | JIS C 5101, IEC60384 |
| Capacitance | 1nF | JIS C 5101, IEC60384 |
| Capacitance Tolerance | 10% | JIS C 5101, IEC60384 |
| Rated Voltage | 50Vdc | JIS C 5101, IEC60384 |
| Packaging Quantity | 4,000 pcs per 180mm reel | - |
| Appearance | No defects or abnormalities | Visual (Microscope) Inspection |
| Voltage Proof | 250% RV (for RV50V) | JIS C 5101, IEC60384 |
| Insulation Resistance (I.R.) | 4G (at 25, 1 minute charge) | JIS C 5101, IEC60384 |
| Quality Factor / Dissipation Factor (D.F.) | X7R/X5R: 3.5% (for C103), 5.0% (for 104C>103), 10% (for 104>C106) | JIS C 5101, IEC60384 |
| Adhesive Strength of Termination | No termination peeling, ceramic breakage | 5 N force, 101 sec duration |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C | 1 mm bending |
| Solderability | 95% of terminals uniformly and continuously soldered | Sn-3.0Ag-0.5Cu solder, 2455C, 20.5s |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: 7.5% (X7R/X5R) | 2605C, 101s |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: 7.5% (X7R/X5R) | 5 cycles (-55 to +125) |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: 12.5% (X5R/X7R) | 402, 90%-95%RH, 50024 hours, Rated Voltage |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: 12.5% (X5R/X7R) | Max. Operating Temp., 100012 hours, 100% R.V. |
Application Restrictions
Contact manufacturer for applications requiring high reliability, including but not limited to: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and similar applications.
Transportation and Storage Methods
Transportation:
Products are suitable for modern transportation. Protect from rain, acid/alkali corrosion, heavy impact, and strong compression.
Storage:
Shelf life for good solderability: One year from date of manufacture. Use within three months after unsealing the tape. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer ceramic chip capacitors (MLCCs) may experience short circuits, open circuits, smoking, burning, or even explosion under harsh operating conditions beyond specified frequencies or external mechanical overpressure. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for any unclear aspects.
Soldering Considerations:
Solder Amount: Excessive solder can damage the capacitor due to terminal pressure. Insufficient solder may lead to poor contact between the chip and the circuit.
Recommended Solder Amount: Refer to detailed recommendations for reflow, wave, and iron soldering.
Recommended Soldering Temperature Curves:
- Reflow Soldering: Peak temperature 230~250 (Pb-Sn), 240~260 (Lead-free); Peak time 3s~10s.
- Wave Soldering: Peak temperature 230~260 (Pb-Sn), 240~270 (Lead-free); Peak time within 3s.
- Manual Soldering: Use caution to avoid uneven local heating. Recommended preheating 130, iron tip temperature 350, iron tip diameter 1mm, soldering time 3s. Avoid direct contact of the iron tip with the ceramic body.
2509180925_HRE-CGA0805X7R102K500KT_C7503491.pdf
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