Product Overview
The CGA0402X5R475M160GT is a multilayer ceramic capacitor (MLCC) designed for general-purpose applications. It features an X5R temperature characteristic, a capacitance of 4.7F, and a rated voltage of 16Vdc. This product is suitable for various electronic circuits requiring stable capacitance performance.
Product Attributes
- Brand: CGA (Implied from product code)
- Origin: Not specified
- Material: Ceramic Dielectric, Nickel Inner Electrode, Copper Outer Electrode
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Product Code | Size (mm) | Capacitance | Tolerance | Rated Voltage (Vdc) | Temperature Characteristic | Thickness (mm) |
|---|---|---|---|---|---|---|
| CGA0402X5R475M160GT | 1.00 x 0.50 | 4.7F | 20% | 16 | X5R | 0.50+0.20/-0.05 |
Specifications and Test Methods
| Test Item | Specification | Test Method (Reference Standard) |
|---|---|---|
| Appearance | No defects or abnormalities. | Visual (Microscope) Inspection. |
| Dimension | Conforms to specifications. | Micrometer inspection of physical dimensions. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | X7R/X5R: 250% RV (for RV50V), 200% RV (for 50VRV250V), 150% RV (for 250VRV630V), 120% RV (for 630VRV1000V). Test time: 1-5 seconds. Max charging/discharging current: 50mA. |
| Insulation Resistance (I.R.) | 100M | Test Temperature: 25. Between terminals. Test Voltage: 50V: Rated Voltage; >50V: 500V. Charging time: 1 minute. Max charging/discharging current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement Temperature: 25. Frequency/Voltage varies by capacitance range. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 3.5% (1.00.1 KHz, 1.00.2Vrms); 104C103: 5.0%; 104C106: 10%; C106: 15% (120Hz24Hz, 0.5V0.1Vrms). | N/A |
| Temperature Characteristics of Capacitance | X5R: 15% | Measurement at specified temperature stages after thermal equilibrium. Steps: 25, lowest operating temp, 25, highest operating temp, 25. |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage, etc. | Welded to test substrate. Force: 5N (0.3N for 0402). Time: 101 sec. Direction: Horizontal to PCB center. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C | Reflow soldered on PCB, then bent 1mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu. Flux: IPA Rosin 25%. Temp: 2455C. Time: 20.5s. Immersion: until both ends are fully wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat at 150+0/-10C for 1 hr, then rest 242 hrs at room temp. Solder bath method: Temp 2605C, Time 101s. Preheating: 110-140C for 1 min. Post-treatment: Rest 242 hrs at room temp. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. Insulation Resistance: Same as initial. | Pre-treatment: Heat at 150+0/-10C for 1 hr, then rest 242 hrs at room temp. 5 cycles: Low temp (-403C, 303 min), Room temp (2-5 min), High temp (1503C, 303 min), Room temp (2-5 min). Post-treatment: Rest 242 hrs at room temp. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial (whichever is greater); 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: 500M or RC5s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hr, then rest 242 hrs at room temp. Test Temp: 402C. Humidity: 90%-95%RH. Time: 50024 hrs. Test Voltage: Rated voltage (630V). Voltage conditioning: 1 hr at test temp/voltage, then 242 hrs at ambient before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial (whichever is greater); 25V: 5% or 2x initial (whichever is greater). Insulation Resistance: X5R/X7R: 1G or RC50s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hr, then rest 242 hrs at room temp. Test Temp: Max operating temp 3C. Time: 100012 hrs. Test Voltage: 100% R.V. Voltage conditioning: 1 hr at test temp/voltage, then 242 hrs at ambient before measurement. |
Packaging
| Packaging Type | Quantity per Reel (180mm) | Reel Size | Units per Box | Boxes per Case |
|---|---|---|---|---|
| Tape and Reel (Paper Tape) | 10,000 | 180mm (7") | 5 | 12 |
Application Restrictions
Contact manufacturer for applications requiring high reliability, especially in the following areas: Aircraft equipment, Aerospace equipment, Submarine equipment, Power plant control equipment, Medical equipment, Transportation equipment (vehicles, trains, ships, etc.), Traffic signal equipment, Disaster prevention/Crime prevention equipment, Data processing equipment, and applications with similar complexity and/or reliability requirements.
Transportation and Storage Methods
Transportation: Product packaging is suitable for modern transportation. Protect from rain, acid/alkali corrosion, and avoid dropping or severe compression.
Storage: To ensure good solderability, the shelf life is one year from the production date. Do not unpack the tape until ready for use. Once unpacked, use within three months. Storage Temperature: 0 ~35. Storage Relative Humidity: <70%.
Usage Precautions
MLCCs may experience short circuits, open circuits, smoke, fire, or explosion under harsh operating conditions exceeding specified frequencies or external mechanical stress. Always adhere to the specifications in this document. For unclear points, contact the technical, quality control, or production department.
Soldering:
- Solder Amount: Excessive solder can damage the capacitor due to excessive terminal pressure. Insufficient solder may lead to poor contact between the capacitor chip and the circuit.
- Recommended Solder Amount: Refer to specific recommendations for reflow soldering, wave soldering, and manual rework.
- Recommended Soldering Temperature Curves:
- Reflow Soldering: Peak Temp: 230~250 (Pb-Sn), 240~260 (Lead-free). Peak Time: 3s~10s.
- Wave Soldering: Peak Temp: 230~260 (Pb-Sn), 240~270 (Lead-free). Peak Time: Within 3s.
- Manual Soldering: Use caution to avoid uneven heating causing micro-cracks or explosions. Select appropriate soldering iron tip and control tip temperature carefully. Preheat: 130. Tip Temp: 350. Power: 20W. Tip Diameter: Recommended 1mm. Time: 3s. Solder Paste Amount: 1/2 capacitor height. Avoid direct contact of soldering iron tip with ceramic body.
2509180925_HRE-CGA0402X5R475M160GT_C6119786.pdf
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