Product Overview
The CGA0402X5R105K100GT is a multilayer ceramic capacitor designed for various electronic applications. It offers stable capacitance characteristics over a wide temperature range, making it suitable for demanding environments.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ceramic dielectric, Nickel internal electrode, Copper external electrode
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part Number | Capacitance | Voltage | Temperature Characteristic | Tolerance | Dimensions (mm) (L*W*T) | Packaging |
|---|---|---|---|---|---|---|
| CGA0402X5R105K100GT | 1F | 10Vdc | X5R | 10% | 1.00+0.20/-0.05 * 0.50+0.20/-0.05 * 0.50+0.20/-0.05 | 10,000 pcs (180mm reel) |
Specifications and Test Methods
| No. | Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
|---|---|---|---|
| 1 | Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| 2 | Dimension | Conforms to specifications. | Micrometer inspection of physical dimensions. |
| 3 | Voltage Proof | Withstand test voltage without defects or abnormalities. | X7R/X5R: 250% RV (RV50V), 200% RV (50VRV250V), 150% RV (250VRV630V), 120% RV (630VRV1000V). Test time: 1-5s. Max current: 50mA. |
| 4 | Insulation Resistance (I.R.) | 100M (X7R/X5R) | Test temp: 25. Test voltage: 500V: Rated voltage; >500V: 500V. Charge time: 1 min. Max current: 50mA. |
| 5 | Capacitance | Within specified tolerance. | Measurement temp: 25. |
| 6 | Q Factor / Dissipation Factor (D.F.) | C10F: 3.5% (1.00.1 KHz, 1.00.2Vrms); 104C103: 5.0%; C104106: 10%; C106: 15%. | Frequency: 120Hz24Hz (for C>10uF), 1.00.1 KHz (for C10uF). Voltage: 0.5V0.1Vrms (for C>10uF), 1.00.2Vrms (for C10uF). |
| 7 | Temperature Characteristics of Capacitance | X5R: 15%; X7R: 15% | Steps: 1. 252; 2. Lowest operating temp 3; 3. 252; 4. Highest operating temp 2; 5. 252. Measurement after 5 min at each stage. |
| 8 | Adhesive Strength of Termination | No terminal peeling, ceramic breakage. | Method: Solder capacitor to test board. Force: 5 N (0402: 2.5 N). Time: 101s. Direction: Horizontal to PC board center. |
| 9 | Substrate Bending Test | Appearance: No defects or abnormalities. C/C: X7R/X5R: 10% (General series), 12.5% (High capacitance series). | Method: Solder capacitor to PC board, bend 1 mm. |
| 10 | Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Temp: 2455C. Time: 20.5s. Immersion: Until both ends are fully wetted. |
| 11 | Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. IR: Same as initial. Voltage proof: No defects or abnormalities. | Pre-treatment: Heat at 150+0/-10C for 1 hr, then condition at room temp for 242 hrs. Solder bath method: Sn-3.0Ag-0.5Cu, 2605C, 101s. Preheat: 110-140C for 1 min. Post-treatment: Condition at room temp for 242 hrs. |
| 12 | Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. IR: Same as initial. | Pre-treatment: Heat at 150+0/-10C for 1 hr, then condition at room temp for 242 hrs. Cycle: 5 cycles. Steps: 1. Lowest temp 3 (303 min); 2. Room temp (2-5 min); 3. Highest temp 3 (303 min); 4. Room temp (2-5 min). Post-treatment: Condition at room temp for 242 hrs. |
| 13 | High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial; 25V: 5% or 2x initial (whichever is greater). IR: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hr, then condition at room temp for 242 hrs. Test temp: 402. Humidity: 90%-95%RH. Time: 50024 hrs. Test voltage: Rated voltage (630V). Max current: 50mA. Voltage conditioning: 1 hr at test temp/voltage, then 242 hrs at ambient before measurement. |
| 14 | Life Test | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial; 25V: 5% or 2x initial (whichever is greater). IR: X5R/X7R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hr, then condition at room temp for 242 hrs. Test temp: Highest operating temp 3. Time: 100012 hrs. Test voltage: 100% R.V. Max current: 50mA. Voltage conditioning: 1 hr at test temp/voltage, then 242 hrs at ambient before measurement. |
Packaging Information
| Size (mm) | Tape Type | Reel Size | Reels/Box | Boxes/Case |
|---|---|---|---|---|
| 0402 | Paper Tape | 7" | 5 | 12 |
Carrier Tape Dimensions
| Dimension | 0402 (1005) |
|---|---|
| P1 | 2.000.05 |
| P0 | 4.000.10 |
| P2 | 2.000.05 |
| A | 0.620.05 |
| B | 1.120.05 |
| W | 8.000.30 |
| E | 1.750.10 |
| F | 3.500.05 |
| D | 1.50 +0.10/-0.03 |
| t | 0.600.05 |
Plastic Tape Dimensions
| Dimension | 0603 (1608) | 0805 (2012) | 1206 (3216) | 1210 (3225) |
|---|---|---|---|---|
| P1 | 4 0.1 | 4 0.1 | 4 0.1 | 4 0.1 |
| P0 | 4 0.1 | 4 0.1 | 4 0.1 | 4 0.1 |
| P2 | 2 0.05 | 2 0.05 | 2 0.05 | 2 0.05 |
| A | 1.2 0.2 | 1.450.2 | 1.9 0.2 | 2.8 0.2 |
| B | 2.0 0.2 | 2.3 0.2 | 3.5 0.2 | 3.6 0.2 |
| W | 8 0.3 | 8 0.2 | 8 0.2 | 8 0.2 |
| E | 1.750.1 | 1.750.1 | 1.750.1 | 1.750.1 |
| F | 3.5 0.05 | 3.5 0.05 | 3.5 0.05 | 3.5 0.05 |
| D | 1.5 ( +0. 1/-0.0) | 1.5 ( +0. 1/-0.0) | 1.5 ( +0. 1/-0.0) | 1.5 ( +0. 1/-0.0) |
| T1 | 1.4 max | 2.5 max. | 2.5 max. | 2.5 max. |
| T2 | 0.25 0.1 | 0.305 0.1 | 0.30 0.1 | 0.30 0.1 |
Reel Dimensions
| Dimension | 7" Reel |
|---|---|
| A (mm) | 178 2.0 |
| B (mm) | 2.0 0.5 |
| C (mm) | 13 1.0 |
| D (mm) | 21 0.8 |
| E (mm) | 50 or larger |
| G (mm) | 10 1.0 |
| T (mm) | 13 1.0 |
Packing Method and Specifications
Standard packaging uses 180mm (7") reels. Typically, 5 reels are packed in one box, and 12 boxes form a carton. Partial boxes are packed separately. Custom packaging is available upon request.
Carrier Tape Usage Instructions
When using the product, the cover tape should be peeled off at a speed of 30010mm/min at an angle of 165~180. The peel strength should be between 0.1N~0.7N (10g.f Peel Force 70g.f).
Application Restrictions
Contact us before using our products in the following applications, especially those requiring high reliability, to prevent defects that could directly cause damage to third-party life, body, or property:
- Aircraft equipment
- Aerospace equipment
- Submarine equipment
- Power plant control equipment
- Medical equipment
- Transportation equipment (vehicles, trains, ships, etc.)
- Traffic signal equipment
- Disaster prevention/crime prevention equipment
- Data processing equipment
- Applications with complexity and/or reliability requirements similar to the above.
Transportation and Storage Methods
1. Transportation: Packaged products are suitable for modern transportation. Protect from rain, acid/alkali corrosion, and avoid heavy impact or strong compression during transit.
2. Storage: To ensure good solderability, the shelf life is one year from the production date. Do not unpack the carrier tape until ready for use. Once unpacked, use within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer Ceramic Capacitors (MLCCs) may experience short circuits, open circuits, or even smoke, fire, or explosion if operated in harsh environments beyond the specified frequency range or under excessive external mechanical force. Always refer to the specifications and contact our technical, quality control, or production departments for any unclear matters.
- Solder Amount during Soldering:
A. Excessive solder can cause damage due to excessive pressure on the capacitor terminals.
B. Insufficient solder can lead to poor contact between the capacitor chip and the circuit. - Recommended Solder Amount:
A. Optimal solder amount for reflow soldering.
B. Optimal solder amount for wave soldering.
C. Optimal solder amount for iron rework. - Recommended Soldering Temperature Curve:
Reflow Soldering:- Solder Type: Pb-Sn Soldering | Lead-Free Soldering
- Peak Temperature: 230 ~250 | 240 ~260
- Peak Time: 3s10s | 3s10s
- Solder Type: Pb-Sn Soldering | Lead-Free Soldering
- Peak Temperature: 230 ~260 | 240 ~270
- Peak Time: Within 3s | Within 3s
- Preheating: 130
- Soldering Iron Tip Temperature: 350
- Soldering Iron Power: 20W
- Soldering Iron Tip Diameter: Recommended 1 mm
- Soldering Time: 3s
- Solder Paste Amount: 1/2 capacitor height
- Caution: Do not let the soldering iron tip directly touch the ceramic body.
2509180925_HRE-CGA0402X5R105K100GT_C7503520.pdf
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