Product Overview
This document specifies the requirements for the CGA1206X5R226M250NT multilayer ceramic capacitor. It details the product's construction, electrical characteristics, dimensions, testing methods, packaging, and handling precautions.
Product Attributes
- Brand: CGA (implied from model number)
- Material: Dielectric Ceramic, Nickel (inner electrode), Copper (outer electrode), Nickel layer, Tin layer
- Certifications: None explicitly mentioned.
Technical Specifications
| Model | Type | Capacitance | Tolerance | Rated Voltage | Temperature Characteristic | Temperature Range | Capacitance Change Rate | Dimensions (L x W x T) | Thickness | Packaging | Packaging Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|
| CGA1206X5R226M250NT | Multilayer Ceramic Capacitor | 22uF | 20% | 25Vdc | X5R | -55 to +85 | 15% | 3.2+0.20/-0.20 x 1.60+0.20/-0.20 x 1.60+0.20/-0.20 | 0.30-0.80 | T 180mm Reel | 2,000 |
Detailed Specifications and Test Methods
| Item | Description | Material | Specification/Method |
|---|---|---|---|
| Appearance | Visual (microscope) inspection | - | No defects or abnormalities. |
| Dimensions | Physical dimensions check | - | Conforms to specifications. |
| Insulation Resistance (I.R.) | Test Voltage depends on Rated Voltage (RV) | - | 10 G or RC 500F (whichever is smaller) |
| Voltage Proof | Withstand test voltage | - | No defects or abnormalities. |
| Capacitance | Capacitance measurement | C0G | Within specified tolerance. |
| Capacitance | Capacitance measurement | X7R/X5R/X6S | Within specified tolerance. |
| Temperature Characteristics | Capacitance change at specified temperatures | C0G | 30ppm/ |
| Temperature Characteristics | Capacitance change at specified temperatures | X5R | 15% |
| Temperature Characteristics | Capacitance change at specified temperatures | X6S | 22% |
| Temperature Characteristics | Capacitance change at specified temperatures | X7R | 15% |
| Adhesive Strength of Termination | Push test | - | No termination peel-off, ceramic breakage. |
| Substrate Bending Test | Bending test | - | Appearance: No defects or abnormalities. |
| Solderability | Soldering test | - | 95% of terminations uniformly and continuously soldered. |
| Resistance to Soldering Heat | Appearance after pre-treatment and measurement | - | No cracks. |
| Resistance to Soldering Heat | Capacitance change | C0G | Within 2.5% or 0.25 pF (whichever is greater). |
| Resistance to Soldering Heat | Capacitance change | X7R/X5R/X6S | 7.5% |
| Resistance to Soldering Heat | Quality Factor/Dissipation Factor | - | Same as initial value. |
| Resistance to Soldering Heat | Insulation Resistance | - | Same as initial value. |
| Resistance to Soldering Heat | Voltage Proof | - | No defects or abnormalities. |
| Temperature Cycle | Appearance after temperature cycling | - | No defects or abnormalities. |
| Temperature Cycle | Capacitance change | COG | 1% or 0.5 pF (whichever is greater). |
| Temperature Cycle | Capacitance change | X7R/X5R | 10% |
| Temperature Cycle | Capacitance change | X7R/X5R | 12.5% |
| Temperature Cycle | Quality Factor/Dissipation Factor | - | Same as initial value. |
| Temperature Cycle | Insulation Resistance | - | Same as initial value. |
| High Temperature High Humidity (Load) | Appearance after test | - | No defects or abnormalities. |
| High Temperature High Humidity (Load) | Capacitance change | X7R/X5R | 12.5% |
| High Temperature High Humidity (Load) | Quality Factor/Dissipation Factor | COG | 350 min (C30pF), 275+5/2*C min (10pFC30pF), 200+10*C min (10pF) |
| High Temperature High Humidity (Load) | Quality Factor/Dissipation Factor | X7R/X5R/X6S | 7% or 2x initial value ( 16V), 5% or 2x initial value ( 25V) (whichever is greater). |
| High Temperature High Humidity (Load) | Insulation Resistance | - | 500M or R.C 5s (whichever is smaller). |
| Life Test | Appearance after test | - | No defects or abnormalities. |
| Life Test | Capacitance change | X7R/X5R | 15% |
| Life Test | Quality Factor/Dissipation Factor | C0G | 350 min (C30pF), 275+5/2*C min (10pFC30pF), 200+10*C min (10pF) |
| Life Test | Quality Factor/Dissipation Factor | X7R/X5R/X6S | 7% or 2x initial value ( 16V), 5% or 2x initial value ( 25V) (whichever is greater). |
| Life Test | Insulation Resistance | X7R | 1G or R.C10s |
| Life Test | Insulation Resistance | X5R | 1G or R.C 50s (whichever is smaller). |
Packaging Specifications
| Size | Tape Type | Reel Size | Packs per Box | Boxes per Case |
|---|---|---|---|---|
| 01005 | Paper Tape | 7" | 5 | 12 |
| 0201 | Paper Tape | 7" | 5 | 12 |
| 0402 | Paper Tape | 7" | 5 | 12 |
| 0603 | Paper Tape | 7" | 5 | 12 |
| 0805 | Paper Tape/Plastic Tape | 7" | 5 | 12 |
| 1206 | Paper Tape/Plastic Tape | 7" | 5 | 12 |
| 1210 | Plastic Tape | 7" | 5 | 12 |
Application Restrictions
Contact manufacturer for applications requiring high reliability, especially those involving potential direct damage to third-party life, body, or property. Examples include aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and applications with similar complexity or reliability requirements.
Transportation and Storage Methods
Transportation: Products are suitable for modern transportation. Protect from rain, acid/alkali corrosion, and avoid heavy impact or extrusion. Storage: Shelf life for good solderability is one year from the production date. Use within three months after unsealing the tape. Storage temperature: 0~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer ceramic capacitors (MLCCs) may experience short circuits, open circuits, smoking, burning, or explosion under harsh operating conditions exceeding specified frequencies or external mechanical overpressure. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for any uncertainties.
Soldering Guidelines
Solder Amount: Ensure appropriate solder amount to avoid capacitor damage (too much) or poor contact (too little). Recommended Solder Amount: Refer to guidelines for reflow soldering, wave soldering, and iron soldering (rework). Recommended Soldering Temperature Curves: Refer to diagrams for reflow soldering and wave soldering. Manual Soldering: Exercise caution to prevent localized uneven heating, which can cause micro-cracks or localized explosions. Select appropriate soldering iron tips and control tip temperature carefully.
2506101115_HRE-CGA1206X5R226M250NT_C6119968.pdf
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