Product Overview
This specification applies to the CGA1206X5R476M250NT multilayer ceramic chip capacitor. It is designed for various electronic applications requiring stable capacitance and reliable performance.
Product Attributes
- Brand: CGA
- Material: Ceramic Dielectric, Nickel (Internal Electrode), Copper (External Electrode), Tin (Plating)
- Temperature Characteristics: X5R
- Packaging: Tape Reel (180mm diameter)
Technical Specifications
| Part Number | Size (L*W) | Capacitance | Tolerance | Voltage | Thickness | Temperature Range | Capacitance Change |
|---|---|---|---|---|---|---|---|
| CGA1206X5R476M250NT | 1206 (3.2x2.5mm) | 47uF | M (20%) | 25Vdc | 1.6mm | -55 to +85 | 15% |
Specifications and Test Methods
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384 |
|---|---|---|
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimension | Conforms to specifications. | Micrometer inspection of physical dimensions. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | See document for specific voltage ratings based on RV. Test time: 1-5 seconds. |
| Insulation Resistance (I.R.) | C0G: 10 G or RC500F (whichever is smaller). X7R/X5R/X6S: 100.0 M. | Test temperature: 25. Test points: Between terminals. Test voltage: Based on IF. Charge time: 1 minute. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. See document for frequency and voltage for different dielectrics. |
| Q factor / Dissipation Factor (D.F.) | C0G: 10.0%. X7R/X5R/X6S: See document for values based on capacitance. | See document for frequency and voltage. |
| Temperature Characteristics of Capacitance | C0G: Within 30ppm/. X5R: 15%. X6S: 22%. X7R: 15%. | Measured at specified temperature stages after thermal equilibrium. |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage. | Capacitor soldered to test substrate. Force: 5N. Duration: 101 seconds. Applied direction: Horizontal force. |
| Substrate Bending Test | Appearance: No defects or abnormalities. | Capacitor reflow soldered on PCB, then bent 1mm. Capacitance change: See document for values based on series and dielectric. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temperature: 2455C. Dwell time: 20.5s. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: C0G: Within 2.5% or 0.25pF (whichever is larger). X7R/X5R/X6S: 7.5%. Q factor/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat at 150+0/-10C for 1 hour, then condition at room temp for 242 hours. Solder bath method. Solder type: Sn-3.0Ag-0.5Cu. Test temperature: 2605. Test time: 101s. Preheating temperature: 110 to 140. Preheating time: 1 minute. Post-treatment: Condition at room temp for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R/X6S: 15%. Q factor/DF: Same as initial. Insulation Resistance: Same as initial. | Pre-treatment: Heat at 150+0/-10C for 1 hour, then condition at room temp for 242 hours. Temperature cycle: 5 cycles. Steps: Low temp, room temp, high temp, room temp. Duration: See document. Post-treatment: Condition at room temp for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 12.5%. Q factor/DF: See document for values based on dielectric. Insulation Resistance: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hour, then condition at room temp for 242 hours. Test temperature: 402. Test humidity: 90%RH to 95%RH. Test time: 50024 hours. Test voltage: Rated voltage (not exceeding 630V). Voltage conditioning: 1 hour at test temp/voltage, then 242 hours at ambient. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 15%. Q factor/DF: See document for values based on dielectric. Insulation Resistance: X7R: 1G or R.C10s. X5R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat at 150+0/-10C for 1 hour, then condition at room temp for 242 hours. Test temperature: Highest operating temp 3. Test time: 100012 hours. Test voltage (life): 100% R.V. Voltage conditioning: 1 hour at test temp/voltage, then 242 hours at ambient. |
Packaging
| Packaging Method | Quantity (pcs) |
|---|---|
| Tape Reel (180mm diameter) | 2,000 |
Application Restrictions
Contact manufacturer for applications requiring high reliability, especially those that could directly cause damage to third-party life, body, or property. This includes but is not limited to: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and applications with similar complexity or reliability requirements.
Transportation and Storage Methods
Transportation: The product packaging is suitable for modern transportation. Protect from rain, acid-alkali corrosion, and avoid heavy impact or strong compression.
Storage: Ensure product solderability for a shelf life of one year from the date of manufacture. Do not open the tape reel before use. Once opened, use within three months. Storage temperature: 0~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer ceramic chip capacitors (MLCCs) may experience short circuits, open circuits, smoke, fire, or explosion if operated beyond the specified frequencies or subjected to external mechanical overpressure. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for any unclear matters.
Soldering Precautions
Solder Amount: Ensure appropriate solder amount to avoid capacitor damage due to excessive terminal pressure or poor contact due to insufficient solder.
Recommended Solder Amount: Refer to the document for optimal solder amounts for reflow soldering, wave soldering, and rework with a soldering iron.
Recommended Soldering Temperature Curves: Refer to the document for recommended temperature profiles for reflow soldering, wave soldering, and hand soldering, including peak temperature, peak time, preheating, iron tip temperature, power, diameter, and soldering time.
2402291546_HRE-CGA1206X5R476M250NT_C6119973.pdf
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