Product Overview
The CGA0201X5R105M100ET is a multilayer ceramic capacitor designed for various electronic applications. It features a 0201 package size, X5R temperature characteristic, a capacitance of 1F, and a rated voltage of 10Vdc. This capacitor is suitable for applications requiring stable capacitance over a specific temperature range.
Product Attributes
- Brand: CGA (implied from product code)
- Material: Ceramic dielectric, Nickel inner electrode, Copper outer electrode
- Packaging: Tape and Reel (180mm)
Technical Specifications
| Part Number | Size (mm) | Capacitance | Tolerance | Rated Voltage | Temperature Characteristic | Temperature Range | Capacitance Change Rate |
|---|---|---|---|---|---|---|---|
| CGA0201X5R105M100ET | 0.60 x 0.30 x 0.30 | 1F | 20% | 10Vdc | X5R | -55~+85 | 15% |
| Test Item | Test Specification | Test Method (Reference Standard) |
|---|---|---|
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimension | Conforms to specifications. | Micrometer inspection of physical dimensions. |
| Voltage Proof | Withstand test voltage without defects. | X7R/X5R: 250% RV (RV50V), 200% RV (50VRV250V), etc. Test time: 1-5s. |
| Insulation Resistance (I.R.) | 100M | Test temp: 25. Test voltage 500V: Rated voltage; >500V: 500V. Charge time: 1 min. |
| Capacitance | Within specified tolerance. | Measurement temp: 25. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 5.0%; 10FC100F: 10%; C100F: 15% | 1.00.1 KHz, 1.00.2Vrms. |
| Temperature Characteristics of Capacitance | X5R: 15% | Measurement at specified temperature steps after thermal equilibrium. |
| Adhesive Strength of Termination | No terminal detachment, ceramic breakage. | Applied force: 1N (for 0201). Test time: 101s. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C | Capacitor reflow soldered on PCB, bent 1mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu. Flux: IPA Rosin 25%. Solder temp: 2455C. Dwell time: 20.5s. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: 7.5%. Q/DF: Same as initial. Insulation resistance: Same as initial. Voltage proof: No defects. | Preheat: 110-140C for 1 min. Solder bath temp: 2605C. Dwell time: 101s. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: 7.5%. Q/DF: Same as initial. Insulation resistance: Same as initial. | 5 cycles of temperature steps (-55C to +150C). |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: 12.5%. Q/DF: 7% or 2x initial (for 16V), 5% or 2x initial (for 25V). Insulation resistance: 500M or R.C5s (whichever is smaller). | Test temp: 402C. Humidity: 90%-95%RH. Test time: 50024 hours. Test voltage: Rated voltage. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: 12.5%. Q/DF: 7% or 2x initial (for 16V), 5% or 2x initial (for 25V). Insulation resistance: 1G or R.C50s (whichever is smaller). | Test temp: Max operating temp. Test time: 100012 hours. Test voltage: 100% R.V. |
2509180925_HRE-CGA0201X5R105M100ET_C6119758.pdf
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