Product Overview
This specification applies to the CGA0805X7R224K500MT multilayer ceramic capacitor. It is designed for various electronic applications requiring stable capacitance and reliable performance across a wide temperature range.
Product Attributes
- Brand: CGA
- Origin: Not specified
- Material: Ceramic dielectric, Nickel inner electrode, Copper outer electrode, Tin layer
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Model | Size (mm) | Temperature Characteristic | Capacitance | Capacitance Tolerance | Rated Voltage (Vdc) | Thickness (mm) | Packaging |
| CGA0805X7R224K500MT | 2.000.20 x 1.250.20 | X7R (15% from -55 to +125) | 220nF | 10% | 50 | 1.250.20 | 3,000 pcs/180mm Reel (Plastic Tape) |
Key Test Specifications
| Test Item | Specification | Test Conditions |
| Appearance | No defects or abnormalities. | Visual (microscope) inspection. |
| Dimension | Conforms to specifications. | Micrometer measurement. |
| Voltage Proof | Withstand test voltage without defects. | X7R/X5R: 250% RV (for RV50V), 200% RV (for 50VRV250V), etc. Test time: 1-5s. |
| Insulation Resistance (I.R.) | 100M | X7R/X5R. Test temp: 25. Test voltage: 500V: Rated Voltage, >500V: 500V. Charge time: 1 min. |
| Capacitance | Within specified tolerance. | Measurement temp: 25. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 3.5% (1kHz, 1.00.2Vrms); 104C103: 5.0%; 104C106: 10%; C>106: 15% (120Hz24Hz, 0.50.1Vrms). | X7R/X5R. |
| Temperature Characteristics of Capacitance | X7R: 15% | Steps: -55, +25, +125. |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage. | Force: 5 N. Time: 101s. Applied horizontally. |
| Substrate Bending Test | Appearance: No defects. C/C: 10% (General Series), 12.5% (High Capacitance Series). | Bending: 1 mm. |
| Solderability | 95% of terminals uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu. Temp: 2455C. Time: 20.5s. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: 7.5% (X7R/X5R). D.F./Q, I.R., Voltage Proof: As initial values or no defects. | Pre-treatment: 1hr at 150+0/-10C, then 242h at room temp. Solder bath: 2605C, 101s. Preheating: 110-140C, 1 min. |
| Temperature Cycle | Appearance: No defects. Capacitance change: 7.5% (X7R/X5R). D.F./Q, I.R.: As initial values. | 5 cycles. Temp: -55 to +125. Dwell time: 303 min at each extreme. Pre-treatment: 1hr at 150+0/-10C, then 242h at room temp. |
| High Temperature High Humidity (Load) | Appearance: No defects. Capacitance change: 12.5% (X5R/X7R). D.F./Q: 16V: 7% or 2x initial; 25V: 5% or 2x initial. I.R.: 500M or R.C5s. | Test temp: 402C. Humidity: 90-95%RH. Test time: 50024h. Test voltage: Rated voltage. Pre-treatment: 1hr at 150+0/-10C, then 242h at room temp. |
| Life Test | Appearance: No defects. Capacitance change: 12.5% (X5R/X7R). D.F./Q: 16V: 7% or 2x initial; 25V: 5% or 2x initial. I.R.: 1G or R.C50s. | Test temp: Max operating temp. Test time: 100012h. Test voltage: 100% R.V. Pre-treatment: 1hr at 150+0/-10C, then 242h at room temp. |
Packaging Specifications
| Size (mm) | Tape Type | Reel Size | Pcs/Reel | Tapes/Box | Boxes/Carton |
| 0805 | Paper/Plastic | 7" | 4,000 (Paper) / 3,000-2,000 (Plastic) | 5 | 12 |
Application Restrictions
Not recommended for use in applications requiring extremely high reliability without prior consultation, including but not limited to: aircraft, aerospace, submarine, power plant control, medical, transportation, disaster prevention, data processing, and similar complex/critical applications.
Transportation and Storage
Transportation: Protect from rain, acid/alkali corrosion, avoid dropping and severe extrusion.
Storage: Shelf life: 1 year from production date. Use within 3 months after unsealing tape. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Improper use in harsh environments or under excessive mechanical stress may lead to short circuits, open circuits, smoke, fire, or explosion. Adhere to specifications. Consult technical department for any unclear points. Pay attention to solder amount and temperature profiles during soldering.
2509180925_HRE-CGA0805X7R224K500MT_C6119934.pdf
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