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Specifications
Voltage Rating:
6.3V
Capacitance:
2.2uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
CGA0402X5R225M6R3GT
Package:
0402
Key Attributes
Model Number:
CGA0402X5R225M6R3GT
Product Description
Product Description
The CGA0402X5R225M6R3GT is a multilayer ceramic capacitor (MLCC) with X5R dielectric characteristics. It offers a capacitance of 2.2F and a rated voltage of 6.3Vdc. This capacitor is designed for surface mount applications and is supplied in tape and reel packaging.
Product Attributes
- Brand: CGA (implied by part number prefix)
- Material: Dielectric ceramic, Nickel inner electrode, Copper outer electrode
- Packaging: Tape and Reel (180mm diameter)
Technical Specifications
| Part Number | Size (mm) | Dielectric | Capacitance | Tolerance | Rated Voltage | Temperature Range | Capacitance Change Rate |
| CGA0402X5R225M6R3GT | 1.00 x 0.50 x 0.50 | X5R | 2.2F | 20% | 6.3Vdc | -55~+85 | 15% |
Specifications and Test Methods
| Test Item | Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Appearance | No defects or abnormalities. | Visual (microscope) inspection of the product. |
| Dimensions | Conforms to specifications. | Check physical dimensions of the equipment using a micrometer. |
| Voltage Proof | Withstand test voltage, no defects or abnormalities. | X7R/X5R RV50V: 250% RV; 50VRV250V: 200% RV; 250VRV630V: 150% RV; 630VRV1000V: 120% RV. Test time: 1 to 5 seconds. Charging/discharging current: Max 50mA. |
| Insulation Resistance (I.R.) | 100M | Test temperature: 25. Test point: Between terminals. Test voltage: 500V: Rated voltage; >500V: 500V. Charging time: 1 minute. Charging/discharging current: Max 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. Material: X7R/X5R. Capacitance: 2.2F. Frequency: 120Hz24Hz. Voltage: 0.5V0.1Vrms. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 5.0%; 104C103: 10%; C10F: 10%. | Material: X7R/X5R. C103: 3.5%; C10F: 120Hz24Hz, 0.5V0.1Vrms. 104C103: 5.0%; 104C106: 10%. C10F: 1.00.1 KHz, 1.00.2Vrms. C106: 15%. |
| Temperature Characteristics of Capacitance | X5R: 15%; X7R: 15% | Measure capacitance change at each specified temperature stage. Measurement of capacitance after each step reaches thermal equilibrium, following the steps shown in the table. Step 1: Reference Temperature: 25 2. Step 2: Lowest operating temperature: 3. Step 3: Reference Temperature: 25 2. Step 4: Highest operating temperature: 2. Step 5: Reference Temperature: 25 2. |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage, etc. | Mounting method: Solder capacitor on test substrate. Force: 5 N (0402: 2.5 N / 0201: 1 N). Application time: 101 seconds. Application direction: Gradually apply force in the horizontal direction of the P.C. board at the center of the specimen. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C: X7R/X5R: 10% (General series); 12.5% (High capacitance series). | Mounting method: Reflow solder capacitor on P.C. board and bend it by 1 mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (lead-free solder). Flux: Isopropyl alcohol Rosin 25% solid solution. Soldering temperature: 245 5C. Dwell time: 2 0.5s. Soldering position: Until both ends are completely wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance Change: X7R/X5R: 7.5%. Insulation Resistance: Same as initial value. Dielectric: X7R/X5R. | Pre-treatment: Heat treatment at 150 + 0/-10C for 1 hour, then stand at room temperature for 24 2 hours, then measure. Soldering bath method: Solder type: Sn-3.0Ag-0.5Cu (Lead Free Solder). Test temperature: 2605. Test time: 101s. Preheat temperature: 110 to 140. Preheat time: 1 minute. Post-treatment: Stand at room temperature for 242 hours, then measure. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance Change: X7R/X5R: 7.5%. Q Factor / Dissipation Factor: Same as initial value. Insulation Resistance: Same as initial value. | Mounting method: Solder capacitor on test substrate. Pre-treatment: Heat treatment at 150 + 0/-10C for 1 hour, then stand at room temperature for 24 2 hours, then measure. Temperature Cycle: 5 cycles. Step 1: Lowest temperature: 3, 30 3 min. Step 2: Room temperature, 2~5 min. Step 3: Highest temperature: 3, 30 3 min. Step 4: Room temperature, 2~5 min. Post-treatment: Stand at room temperature for 242 hours, then measure. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance Change: X5R/X7R: 12.5%. Q Factor / Dissipation Factor: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Mounting method: Reflow solder capacitor on P.C. board as shown in Appendix 2 before testing. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours, then measure. Test temperature: 40 2. Test humidity: 90%RH to 95%RH. Test time: 50024 hours. Test voltage: Rated voltage (not exceeding 630V). Charging/discharging current: Max 50mA. Voltage conditioning: After voltage conditioning the capacitor for 1 hour at the test temperature and voltage, place the capacitor in ambient conditions for 24 2 hours before measurement. Use this measured value as the initial value. |
| Life Test | Appearance: No defects or abnormalities. Capacitance Change: X5R/X7R: 12.5%. Q Factor / Dissipation Factor: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Mounting method: Solder capacitor on test substrate. Pre-treatment: Heat treatment at 150 + 0/-10C for 1 hour, then stand at room temperature for 24 2 hours, then measure. Test temperature: Highest operating temperature 3. Test time: 100012 hours. Test voltage (life): 100% R.V. Charging/discharging current: Max 50mA. Voltage conditioning: After voltage conditioning the capacitor for 1 hour at the test temperature and voltage, place the capacitor in ambient conditions for 24 2 hours before measurement. Use this measured value as the initial value. |
Packaging Information
| Part Number | Size (mm) | Tape Specification | Packaging Quantity | Reel Diameter |
| CGA0402X5R225M6R3GT | 1.00 x 0.50 x 0.50 | Paper Tape | 10,000 | 180mm |
Application Restrictions
Contact manufacturer before use in applications requiring high reliability, especially those that could directly cause damage to third-party life, body, or property. Examples include aircraft equipment, aerospace equipment, subsea equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and similar applications with high complexity and/or reliability requirements.
Transportation and Storage Methods
Transportation: Packaged products are suitable for modern transportation. Prevent rain, acid-alkali corrosion, heavy impact, and strong extrusion during transit.
Storage: To ensure solderability, the shelf life is one year from the date of manufacture. Do not open the tape packaging before use. Once opened, use within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer ceramic capacitors (MLCCs) may experience short circuits, open circuits, smoke, fire, or explosion if operated in harsh environments beyond the specified frequency or under excessive external mechanical force. Always adhere to the specifications in this approval sheet or related manuals. Contact the technical, quality control, or production department for any unclear issues.
- Soldering Amount: Excessive solder can damage the capacitor due to excessive pressure on the terminal. Insufficient solder can lead to poor contact between the capacitor chip and the circuit.
- Recommended Solder Amount: Refer to specific recommendations for reflow soldering, wave soldering, and iron repair.
- Recommended Soldering Temperature Curve: Refer to recommended temperature curves for reflow soldering, wave soldering, and manual soldering, noting specific peak temperatures, peak times, and preheating requirements for leaded and lead-free solders. Manual soldering requires careful operation to avoid local overheating, micro-cracks, or local explosions.
2509180925_HRE-CGA0402X5R225M6R3GT_C7503516.pdf
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