Product Overview
The CGA0603X5R106M160JT is a multilayer ceramic capacitor (MLCC) with an X5R temperature characteristic, offering a capacitance of 10F and a rated voltage of 16Vdc. Designed for surface mounting, it comes in a compact 0603 package size.
Product Attributes
- Brand: CGA (derived from product code)
- Material: Ceramic Dielectric, Nickel Inner Electrode, Copper Outer Electrode, Tin Layer
Technical Specifications
| Model | Size (mm) | Temperature Characteristic | Capacitance | Capacitance Tolerance | Rated Voltage | Thickness | Packaging | Temperature Range | Capacitance Change Rate |
| CGA0603X5R106M160JT | 1.600.20 x 0.800.20 | X5R | 10F | 20% | 16Vdc | 0.800.20 | 4,000 pcs/reel (180mm) | -55~+85 | 15% |
Specifications and Test Methods
| Test Item | Test Specification | Test Method (Reference Standard: JIS C 5101, IEC60384) |
| Appearance | No defects or abnormalities. | Visual (Microscope) Inspection. |
| Dimension | Conforms to specifications. | Check physical dimensions using a micrometer. |
| Voltage Proof | Withstand test voltage without defects or abnormalities. | RV50V: 250% RV; 50VRV250V: 200% RV; 250VRV630V: 150% RV; 630VRV1000V: 120% RV. Test time: 1 to 5 seconds. Max charging/discharging current: 50mA. |
| Insulation Resistance (I.R.) | 100M (for X7R/X5R) | Test temperature: 25. Between terminals. Test voltage: 500V: Rated voltage; >500V: 500V. Charging time: 1 minute. Max charging/discharging current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 10% (for X7R/X5R); C10F: 15% (for X7R/X5R) | Frequency: 120Hz24Hz, Voltage: 0.5V0.1Vrms (for C10F); Frequency: 1.00.1 KHz, Voltage: 1.00.2Vrms (for C10F). |
| Temperature Characteristics of Capacitance | X5R: 15%; X7R: 15% | Measure capacitance at specified temperature stages after thermal equilibrium. Steps: 1. 252, 2. Lowest operating temp 3, 3. 252, 4. Highest operating temp 2, 5. 252. Measurement after 5 minutes at each step. |
| Adhesive Strength of Termination | No terminal detachment, ceramic breakage, etc. | Capacitor soldered on test substrate. Force: 5 N (0402: 2.5 N / 0201: 1 N). Duration: 101 sec. Direction: Apply force horizontally along the center of the specimen. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C: | Capacitor reflow soldered on PCB, then bent 1 mm. |
| Solderability | 95% of terminals should be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5 Cu (lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Soldering temperature: 2455C. Dwell time: 20.5s. Soldering position: Until both ends are completely wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance Change: X7R/X5R: 7.5%. Q Factor/Dissipation Factor: Same as initial value. Insulation Resistance: Same as initial value. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat treatment at 150 +0/-10C for 1 hour, then stand at room temperature for 242 hours. Solder bath method: Solder type: Sn-3.0Ag-0.5Cu. Test temperature: 2605C. Test time: 101s. Preheating temperature: 110 to 140. Preheating time: 1 minute. Post-treatment: Stand at room temperature for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance Change: X7R/X5R: 7.5%. Q Factor/Dissipation Factor: Same as initial value. Insulation Resistance: Same as initial value. | Capacitor soldered on test substrate. Pre-treatment: Heat treatment at 150 +0/-10C for 1 hour, then stand at room temperature for 242 hours. Temperature cycle: 5 cycles. Steps: 1. Lowest temp 3 (303 min), 2. Room temp (2~5 min), 3. Highest temp 3 (303 min), 4. Room temp (2~5 min). Post-treatment: Stand at room temperature for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance Change: X5R/X7R: 12.5%. Q Factor/Dissipation Factor: (X7R/X5R) 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: 500M or R.C 5s (whichever is smaller). | Capacitor reflow soldered on PCB. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Test temperature: 402C. Test humidity: 90%RH to 95%RH. Test time: 50024 hours. Test voltage: Rated voltage (not exceeding 630V). Max charging/discharging current: 50mA. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours in ambient conditions before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance Change: X5R/X7R: 12.5%. Q Factor/Dissipation Factor: (X7R/X5R) 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Capacitor soldered on test substrate. Pre-treatment: Heat treatment at 150 +0/-10C for 1 hour, then stand at room temperature for 242 hours. Test temperature: Highest operating temperature 3. Test time: 100012 hours. Test voltage (life): 100% R.V. Max charging/discharging current: 50mA. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours in ambient conditions before measurement. |
Application Limitations
Contact manufacturer for applications requiring high reliability, especially those involving potential harm to third parties, including but not limited to: aircraft equipment, aerospace equipment, submarine equipment, power plant control equipment, medical equipment, transportation equipment (vehicles, trains, ships, etc.), traffic signal equipment, disaster prevention/crime prevention equipment, data processing equipment, and applications with similar complexity and/or reliability requirements.
Transportation and Storage Methods
Transportation
Packaged products are suitable for modern transportation. Protect from rain, acid/alkali corrosion, and avoid dropping or severe compression during transit.
Storage
Shelf life for good solderability: One year from the date of manufacture. Do not unpack the tape until ready for use. Once unpacked, use within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Operating MLCCs beyond specified frequencies or under excessive external mechanical stress may lead to short circuits, open circuits, smoke, fire, or explosion. Adhere to the specifications in this document. For any uncertainties, contact the technical, quality control, or production department.
Soldering
Solder Amount
- Excessive solder may damage the capacitor due to excessive pressure on the terminals.
- Insufficient solder may lead to poor contact between the capacitor chip and the circuit.
Recommended Solder Amount
- Reflow soldering
- Wave soldering
- Soldering for rework with a soldering iron
Recommended Soldering Temperature Curve
- Reflow Soldering:
- Pb-Sn Solder: Peak Temperature 230 ~250, Peak Time 3s10s
- Lead-Free Solder: Peak Temperature 240 ~260, Peak Time 3s10s
- Wave Soldering:
- Pb-Sn Solder: Peak Temperature 230 ~260, Peak Time within 3s
- Lead-Free Solder: Peak Temperature 240 ~270, Peak Time within 3s
- Manual Soldering:
- Preheating: 130
- Soldering Iron Tip Temperature: 350
- Soldering Iron Power: 20W
- Soldering Iron Tip Diameter: Recommended 1 mm
- Soldering Time: 3s
- Solder Paste Amount: 1/2 capacitor height
- Caution: Avoid direct contact of the soldering iron tip with the ceramic body.
2509180925_HRE-CGA0603X5R106M160JT_C6119814.pdf
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