Multilayer Ceramic Chip Capacitor CGA0805X7R105K500MT
This product specification applies to multilayer ceramic chip capacitors. The CGA0805X7R105K500MT is a 0805-sized capacitor with X7R dielectric, offering a capacitance of 1F and a rated voltage of 50Vdc. It is designed for general-purpose applications and is supplied in tape and reel packaging.
Product Attributes
- Brand: CGA
- Origin: Not specified
- Material: Ceramic dielectric, Nickel inner electrode, Copper outer electrode
- Color: Not specified
- Certifications: JIS C 5101, IEC60384
Technical Specifications
| Part Number | Dimensions (mm) L*W*T | Dielectric | Capacitance | Tolerance | Rated Voltage | Temperature Range | Capacitance Change Rate | Packaging | Quantity per Reel |
| CGA0805X7R105K500MT | 2.000.20 * 1.250.20 * 1.250.20 | X7R | 1F | 10% | 50Vdc | -55~+125 | 15% | Plastic Tape Reel (180mm) | 3,000 |
Test Specifications
| Test Item | Specification | Test Method (Reference Standard) |
| Appearance | No defects or abnormalities. | Visual (Microscope) inspection. |
| Dimension | Conforms to specifications. | Micrometer inspection of physical dimensions. |
| Voltage Proof | Withstands test voltage without defects or abnormalities. | X7R/X5R: RV50V: 250% RV; 50VRV250V: 200% RV; 250VRV630V: 150% RV; 630VRV1000V: 120% RV. Test time: 1 to 5 seconds. Max charge/discharge current: 50mA. |
| Insulation Resistance (I.R.) | 100M | Test temperature: 25. Between terminals. Test voltage: 500V: Rated voltage; >500V: 500V. Charge time: 1 minute. Max charge/discharge current: 50mA. |
| Capacitance | Within specified tolerance. | Measurement temperature: 25. Material: X7R/X5R. Capacitance: 1F. Frequency: 120Hz24Hz. Voltage: 0.5V0.1Vrms. |
| Q Factor / Dissipation Factor (D.F.) | C10F: 3.5%; 10FC100F: 5.0%; 100FC1000F: 10%; C1000F: 15%. | Measurement temperature: 25. Material: X7R/X5R. Frequency: 1.00.1 KHz (C10F), 120Hz24Hz (C>10F). Voltage: 1.00.2Vrms (C10F), 0.5V0.1Vrms (C>10F). |
| Temperature Characteristics of Capacitance | X7R: 15% | Measurement steps at specified temperatures: 1. 252, 2. Lowest operating temp 3, 3. 252, 4. Highest operating temp 2, 5. 252. Measurement after 5 minutes at each stage. |
| Adhesive Strength of Termination | No terminal peeling, ceramic breakage, etc. | Capacitor soldered to test substrate. Force: 5 N (101 sec). Application direction: Gradually apply force horizontally to the center of the specimen. |
| Substrate Bending Test | Appearance: No defects or abnormalities. C/C: X7R/X5R: 10% (General Series), 12.5% (High Capacitance Series). | Capacitor reflow soldered on PCB, then bent 1 mm. |
| Solderability | 95% of terminals shall be uniformly and continuously soldered. | Solder: Sn-3.0Ag-0.5Cu (Lead-free). Flux: Isopropyl alcohol Rosin 25% solid solution. Solder temperature: 2455C. Dwell time: 20.5s. Solder position: Until both ends are completely wetted. |
| Resistance to Soldering Heat | Appearance: No cracks. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. Insulation Resistance: Same as initial. Voltage Proof: No defects or abnormalities. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temp for 242 hours. Solder bath method: Solder: Sn-3.0Ag-0.5Cu. Test temp: 2605C. Test time: 101s. Preheating temp: 110 to 140. Preheating time: 1 minute. Post-treatment: Stand at room temp for 242 hours. |
| Temperature Cycle | Appearance: No defects or abnormalities. Capacitance change: X7R/X5R: 7.5%. Q/DF: Same as initial. Insulation Resistance: Same as initial. | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temp for 242 hours. Temperature cycle: 5 cycles. Steps: 1. Lowest temp 3 (303 min), 2. Room temp (2~5 min), 3. Highest temp 3 (303 min), 4. Room temp (2~5 min). Post-treatment: Stand at room temp for 242 hours. |
| High Temperature High Humidity (Load) | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temp for 242 hours. Test temp: 402. Test humidity: 90%RH to 95%RH. Test time: 50024 hours. Test voltage: Rated voltage (not exceeding 630V). Max charge/discharge current: 50mA. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions before measurement. |
| Life Test | Appearance: No defects or abnormalities. Capacitance change: X5R/X7R: 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller). | Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temp for 242 hours. Test temp: Highest operating temp 3. Test time: 100012 hours. Test voltage: 100% R.V. Max charge/discharge current: 50mA. Voltage conditioning: 1 hour at test temp and voltage, then 242 hours at ambient conditions before measurement. |
Application Restrictions
Contact manufacturer before using in the following applications due to high reliability requirements to prevent damage to life, body, or property:
- Aircraft equipment
- Aerospace equipment
- Submarine equipment
- Power plant control equipment
- Medical equipment
- Transportation equipment (vehicles, trains, ships, etc.)
- Traffic signal equipment
- Disaster prevention/crime prevention equipment
- Data processing equipment
- Applications with similar complexity and/or reliability requirements.
Transportation and Storage Methods
Transportation: Packaged products are suitable for modern transportation. Prevent rain, acid-alkali corrosion, heavy impact, and strong extrusion during transit.
Storage: Shelf life for good solderability is one year from the production date. Do not unpack the tape until use. Once unpacked, use within three months. Storage temperature: 0 ~35. Storage relative humidity: <70%.
Usage Precautions
Multilayer Ceramic Chip Capacitors (MLCCs) may experience short circuits, open circuits, smoke, fire, or explosion under harsh operating conditions exceeding specified frequencies or external mechanical overpressure. Always adhere to the specifications in this document. Contact the technical, quality control, or production department for any unclear points.
1. Solder Amount During Welding:
- A. Excessive solder can damage the capacitor due to excessive pressure on the terminal.
- B. Insufficient solder can lead to poor contact between the capacitor chip and the circuit due to insufficient fixing force.
2. Recommended Solder Amount:
- A. Optimal solder amount for reflow soldering.
- B. Optimal solder amount for wave soldering.
- C. Optimal solder amount for iron rework.
3. Recommended Soldering Temperature Curve:
- Reflow Soldering:
- Pb-Sn Solder: Peak Temperature 230 ~250, Peak Time 3s10s.
- Lead-free Solder: Peak Temperature 240 ~260, Peak Time 3s10s.
- Wave Soldering:
- Pb-Sn Solder: Peak Temperature 230 ~260, Peak Time within 3s.
- Lead-free Solder: Peak Temperature 240 ~270, Peak Time within 3s.
Manual Soldering: Manual soldering can cause micro-cracks or local explosions due to uneven local heating. Use caution with iron tip selection and temperature control. Preheating: 130. Iron tip temperature: 350. Iron power: 20W. Iron tip diameter: Recommended 1 mm. Soldering time: 3s. Solder paste amount: 1/2 capacitor height. Caution: Do not let the iron tip directly touch the ceramic body.
2509171619_HRE-CGA0805X7R105K500MT_C6119929.pdf
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