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Specifications
Voltage Rating:
50V
Capacitance:
100pF
Tolerance:
±20%
Mfr. Part #:
HLCC10050G
Package:
SMD,0.4x0.4mm
Key Attributes
Model Number:
HLCC10050G
Product Description
Product Overview
The HLCC10050G is a chip capacitor designed for bonding processes. It is suitable for applications requiring conductive adhesive H20E and a baking process at 120 for 30 minutes. The capacitor features a specific plating for its upper and lower layers, with a recommendation for welding wire placement to prevent electrode detachment.
Product Attributes
- Brand: HenryTech
- Origin: Chengdu City, China
Technical Specifications
| Product Name | Part Number | Capacitance (pF) @1kHz,1Vrms,25, No DC Bias | Max Voltage (VDC) | Operating Temperature () | Type | Upper Layer Coating | Lower Layer Coating |
|---|---|---|---|---|---|---|---|
| Chip Capacitor | HLCC10050G | 10020% | 50 | -55 to +125 | Single sided, bottom edge | TiW-Pt-Au 0.5m Min | TiW-Au 4.0m Min |
Notes:
- Storage conditions: Temperature 20-25, Humidity 40%-60%.
- Suitable for bonding process with conductive adhesive H20E, baked at 120 for 30 minutes.
- The welding position of the welding wire should be 25m or further away from the electrode edge to avoid electrode detachment.
2504101957_HenryTech-HLCC10050G_C46641101.pdf
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