Product Overview
The HLCC10100G is a chip capacitor designed for bonding processes, featuring a capacitance of 10pF and a maximum voltage rating of 100VDC. It operates within a temperature range of -55 to +125 and is suitable for applications requiring conductive adhesive bonding at 120 for 30 minutes. The design emphasizes reliable electrode connection, with welding positions recommended to be 25m or further from the electrode edge to prevent detachment.
Product Attributes
- Brand: HenryTech ()
- Origin: Chengdu City, China
- Storage Conditions: Temperature 20-25, Humidity 40%-60%
- Usage: Suitable for bonding process with conductive adhesive H20E, 120 baking for 30 minutes.
- Note: Welding position of welding wire should be 25m or further away from the electrode edge to avoid electrode detachment.
Technical Specifications
| Product Name | Part Number | Capacitance (pF) @1kHz,1Vrms,25, No DC Bias | Max Voltage (VDC) | Operating Temperature () | Type | Upper Layer Coating | Lower Layer Coating |
| Chip Capacitor | HLCC10100G | 1010% | 100 | -55+125 | Single sided, bottom edge | TiW-Au 2.5m Min | TiW-Pt-Au 2.5m Min |
Contact Information
Tel: +86-28-85589664
E-mail: mr_li@henglitaitech.com
Web: www.hltchips.com
Address: No.198 Tianqin East Street, Gaoxin West District, Chengdu City
2504101957_HenryTech-HLCC10100G_C46641102.pdf
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