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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±15ppm
Load Capacitance:
9pF
Operating Temperature:
-20℃~+80℃
Frequency:
38.4MHz
Mfr. Part #:
X3S038400B91H-HU
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S038400B91H-HU
Product Description
Product Overview
The HSX321S Quartz Crystal from HARMONY ELECTRONICS CORP. is a high-performance crystal unit designed for various electronic applications. It offers precise frequency control with a nominal frequency of 38.400000MHz and a frequency tolerance of +/-10 ppm at 25C. This crystal unit features a robust construction suitable for demanding environments, as indicated by its mechanical and environmental performance specifications. It is designed for automatic insertion and is compatible with lead-free soldering processes.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Type: Quartz Crystal Unit
- Country of Origin: TAIWAN
- Manufacturing Locations: THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 38.400000MHz |
| Holder Type | HSX321S |
| Frequency Tolerance | +/-10 ppm at 25C +/-3C |
| Equivalent Resistance | 40 ohms Max. / SERIES |
| Storage Temperature Range | -40C To +85C |
| Operable Temperature Range | -20C To +80C |
| Temperature Drift | +/-15 ppm (-20C To +80C) |
| Loading Capacitance (CL) | 9.0 pF |
| Drive Level | 10 W (300W Max.) |
| Shunt Capacitance | 2.0 pF Max. |
| Insulation Resistance | More than 500M ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Test (Dropping) | Frequency Variation: Less than +/-5 ppm; Resistance Variation: Less than +/-15% or 2ohms max. (120 cm height, 3 times on Concrete floor) |
| Aging | Less than +/-3 ppm/Year |
| Holder Type | HSX321S Seam type |
| Carrier Tape Material | PS Conductive |
| Top Tape Material | Polyester |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Storage Condition | Temperature: +40C Max., Relative Humidity: 80% Max. |
| Cover Tape Release Strength | 0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min) |
| Mechanical Performance - Natural Drop | Frequency Variation: Less than +/-5 ppm; Resistance Variation: Less than +/-15% or 2 (120cm height, 3 times on Concrete floor) |
| Mechanical Performance - Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. |
| Mechanical Performance - Sealing Tightness | Leak Rate 1.0x10 Pam/sec. Max. (Measured by Helium leak detector) |
| Mechanical Performance - Solder ability | After applying ROSIN Flux, dipping in solder bath at 245C+/-5C for 3+/-0.5 sec. |
| Mechanical Performance - Substrate Bending | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec (Pressure speed :0.5 mm / sec) |
| Mechanical Performance - Adhesion | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure : 5N for 101 sec |
| Mechanical Performance - Body Strength | Apply pressure to the center of body with the R0.5 pressure jig. Pressure :10N for 101sec |
| Environmental Performance - Humidity | 60C +/-2C, RH 90~95%, Duration of 240 hours. |
| Environmental Performance - Storage in Low Temperature | -40C +/-2C, Duration of 240 hours. |
| Environmental Performance - Storage in High Temperature | +85C +/-2C, Duration of 240 hours. |
| Environmental Performance - Temperature Cycles | -40C +/-2C (30min) +85C +/-2C (30min), 25 cycles. |
| Soldering Condition (Reflow) | Preheat: 160~180 deg.C (120sec), Primary heat: 220 deg.C (60sec), Peak: 260 deg.C (10sec. Max.) |
| Soldering Condition (Solder Iron) | Bit temp.: 350 max., Time: 3sec max. |
2410121322_HELE-X3S038400B91H-HU_C254376.pdf
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