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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Load Capacitance:
15pF
Operating Temperature:
-30℃~+85℃
Frequency:
40MHz
Mfr. Part #:
X3S040000BF1H-Z
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S040000BF1H-Z
Product Description
HSX321S Quartz Crystal Specification
The HSX321S is a quartz crystal unit manufactured by Harmony Electronics Corp., designed for various product applications. This specification document outlines the technical details, performance characteristics, and handling guidelines for the HSX321S model.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Country of Origin: TAIWAN
- Manufacturing Factories: THAILAND, SHENZHEN
- Specification Number: X3S040000BF1H-Z Rev. 0
- Date Issued: 2011/12/08
Technical Specifications
| Item | Specification | Details |
|---|---|---|
| Frequency | 40.000000MHz | |
| Holder Type | HSX321S | Seam type |
| Frequency Tolerance | +/-10 ppm | at 25C +/-3C |
| Equivalent Resistance | 20 ohms Max. | /SERIES |
| Storage Temperature Range | -40C To +85C | |
| Operable Temperature Range | -30C To +85C | |
| Temperature Drift | +/-10ppm | -30C To +85C |
| Loading Capacitance (CL) | 15.0 pF | |
| Drive Level | 10 uW | (100uW Max) |
| Shunt Capacitance | 2.0 pF Max | |
| Insulation Resistance | More than 500M ohms | at DC 100V |
| Mode of Oscillation | Fundamental | |
| Circuit Measurement | Measured in HP/E5100A, S&A 250B | |
| Shocking | Frequency: less than +/-5 ppm Resistance: less than +/- 15 % or 2ohms max. | Dropping from 50 cm height 3 times on firm wood |
| Aging | Less than +/-5 ppm/Year | |
| Inside Structure - Base | Alumina Ceramic (Al2O3) | Metallized Pad: W Ni Plating Au Plating (Supplier: Kyocera NTK) |
| Inside Structure - Lid | Fe-Ni-Co | |
| Inside Structure - Crystal Enclosure Seal | Seal Seam | |
| Inside Structure - Crystal Blank | Rectangular At-Cut Quartz Crystal Blank | |
| Inside Structure - Adhesive | Silver Conductive Silicon Resin | Adhesive bonding: upper & lower bonding/lower bonding only |
| Inside Structure - PAD | Alumina Ceramic (W. Ni. Au) | |
| Inside Structure - Cover Ring | Fe-Ni-Co Alloy | |
| Carrier Tape Dimensions | (Refer to page 6) | |
| Reel Dimensions | Diameter: 180+/-3 mm Inner Width: 9.3+/-0.3 mm Outer Width: 11.3+/-1.0 mm Out Line Diameter: 60.5+/-0.5 mm Flange F1: 3.0+0.5/-0 Flange F2: 4.0+0.5/-0 Width F3: 5.0+0.5/-0 Center Core slit Position q: 120deg Spindle Diameter C: 13.2+/-0.5 mm HUB Key Ditch Width E: 3.0+/-0.2 mm | (UNIT: mm) |
| Storage Condition | Temperature: +40C Max. Relative Humidity: 80% Max. | |
| Standard Packing Quantity | 3,000 PCS / REEL | |
| Material of Tape | Carrier tape: PS Top tape: Polyester | |
| Label Contents | Sticks label for every reel. | |
| Taping Dimension - Leader | Cover-tape length in leader > 400 mm (including empty embossed area) | |
| Taping Dimension - Terminal | > 40 mm empty embossed area sealed by cover-tape | |
| Joint of Tape | Carrier-tape and top cover-tape should not be jointed. | |
| Release Strength of Cover Tape | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min. (Other standards based on JIS C 0806-1990) |
| Mechanical Performance - Natural Drop | Frequency variation +/-5ppm, Equivalent resistance specification | Drop 3 times from 50cm onto min. 30mm thickness hard wooden board. |
| Mechanical Performance - Vibration | Frequency variation +/-5ppm, Equivalent resistance specification | 10-55Hz, Sine Wave, full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. |
| Mechanical Performance - Sealing Tightness | Leak Rate 1.0x10-8 Pa-m/sec. Max. | Measured by Helium leak detector (Fine Leakage). |
| Mechanical Performance - Solderability | More than 90% of lead shall be covered by new solder. | Apply ROSIN Flux, dip in solder bath at 245C+/-5C for 3+/-0.5 sec. |
| Environmental Performance - Humidity | Frequency variation +/-5ppm, Equivalent resistance specification | 60C +/-2C, RH 90~95%, Duration of 240 hours. Check after returning to room temperature (1-2 hours). |
| Environmental Performance - Storage in Low Temperature | Frequency variation +/-5ppm, Equivalent resistance specification | -40C +/-2C, Duration of 240 hours. Check after returning to room temperature (1-2 hours). |
| Environmental Performance - Storage in High Temperature | Frequency variation +/-5ppm, Equivalent resistance specification | +85C +/-2C, Duration of 240 hours. Check after returning to room temperature (1-2 hours). |
| Environmental Performance - Temperature Cycles | Frequency variation +/-5ppm, Equivalent resistance specification | -40C +/-2C (30min) +85C +/-2C (30min), 25 cycles. Check after returning to room temperature (1-2 hours). |
| Soldering - Reflow Condition | Max. 2 times soldering | Proposed reflow condition (Refer to page 11) |
| Soldering - Solder Iron | Bit temp.: 350C max., Time: 3 sec max. | Each terminal solder 1 time max. |
| Mounting | Designed for automatic insertion | Trial with insertion machine recommended. Pay attention to board warp. |
| Cleaning | Avoid cleaning liquids that corrode Nickel. | Ultra-sonic cleaning possible, check on your board. |
| Storage | Keep away from high temperature and high humidity. | No direct sunlight, no dew. |
| Environmental Workload Chemical Substance Components List | (See page 14 for detailed list and percentages) |
Note: Marking specification includes Logo, Nominal Frequency (integer only), and Manufactured Year & Month. Refer to Table-1 and Table-2 for coding.
2410121317_HELE-X3S040000BF1H-Z_C133482.pdf
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