Product Overview

The Harmony Electronics HSX530G is a Quartz Crystal designed for reliable electronic applications. It offers a nominal frequency of 25.000000MHz and is RoHS Compliant, HF-Halogen free, and REACH Compliant. This crystal is suitable for various electronic circuits requiring stable oscillation, with a wide operating temperature range and excellent frequency stability.

Product Attributes

• Brand: Harmony Electronics Corporation
• Product Type: Quartz Crystal
• Model: HSX530G
• Country of Origin: Taiwan
• Certifications: RoHS Compliant, HF-Halogen free, REACH Compliant
• MSL Level: 1
• Green Product: Pb free

Technical Specifications

Inside Structure Materials:

• Base: Ceramic (Al2O3)
• Cap: Ceramic (Al2O3)
• Crystal Blank: Quartz (SiO2), Rectangular At-Cut
• Electrode: Metal
• PAD: Metal (W) with Ni Plating (Au Plating)
• Connective Adhesive: Silver Powder (Ag)

Handling Suggestions:

• Reflow Condition: Preheat 160~180C (120 sec), Primary heat 220C (10020 sec), Peak 2605C (10 sec Max.). Recommended to solder within 2 times.
• Manual Solder Iron: Bit temp.: 350C max., Time: 3 sec max. per terminal, solder only once per terminal.
• Mounting: Suitable for most automated SMT processes. Avoid ultra-sonic processes. Minimize excessive shock. Ensure PCB warping does not affect the product.
• Cleansing: General cleaning solutions may be used. Ultrasonic cleaning is not recommended.
• Storage: Store in original packaging in a clean, dust-free environment, out of direct sunlight. Environmental Temperature: Max +40C, Max Relative Humidity: 80%.

Mechanical Performance:

• Shock: Dropping from 100 cm height, 3 times on 30 mm Concrete floor.
• Vibration: 10-55Hz, Sine Wave full amplitude of 0.8mm (X, Y, Z axes), 2 cycles, 2 hours per direction.
• Leakage Test: Leak Rate Max. 1.0x10 Pa-m/sec (Helium leak detector).
• Solderability: Dipping in solder bath at 245C 5C for 3 0.5 sec after applying ROSIN Flux.
• Bending Strength: Apply pressure to bent board to 3 mm (hold for 5 1 sec), Pressure speed: 0.5 mm/sec.
• Adhesion: Apply 5N pressure for 101 sec vertically to the side of specimen on circuit board.
• Body Strength: Apply 10N pressure for 101 sec to the center of body with R0.5 pressure jig.

Environmental Performance:

• Resistance of Soldering Heat: Per specified reflow conditions.
• Humidity: 60C 2C, RH 90~95% for 240 hours.
• Storage in Low Temperature: -40C 2C for 240 hours.
• Storage in High Temperature: +85C 2C for 240 hours.
• Thermal Shock: -55C 2C (30 min) +125C 2C (30 min), 25 cycles. Temperature increasing/reducing time 3 mins.

Factory Locations:

• Head Office/Taiwan Factory: Kaohsiung City, Taiwan
• China Factory: Shenzhen City, China
• Thailand Factory: Ratchaburi Province, Thailand

Contact Information:

• TEL: 886-2-26588883
• Email: contactus@hele.com.tw