Product Overview
The HSX221SA Quartz Crystal from HARMONY ELECTRONICS CORP. is a high-quality frequency control component designed for reliable performance. Manufactured in Taiwan, Thailand, and China, this crystal operates at a nominal frequency of 16.000MHz with a tight frequency tolerance of +/-10 ppm at 25C. It is suitable for applications requiring stable oscillation, featuring a fundamental mode of oscillation and a low equivalent resistance. The compact HSX221SA is designed for surface-mount applications and is supplied in embossed carrier tape and reel packaging, adhering to industry standards for automated assembly.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Product Type: Quartz Crystal
- Model: HSX221SA
- Nominal Frequency: 16.000MHz
- Country of Origin: TAIWAN, THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
- RoHS Compliant: Yes
Technical Specifications
| Specification | Details |
|---|---|
| Frequency | 16.000000MHz |
| Holder Type | HSX221SA |
| Frequency Tolerance | +/-10 ppm at 25C +/-3C |
| Equivalent Resistance | 60 Ohms Max. / SERIES |
| Storage Temperature Range | -40C To +85C |
| Operable Temperature Range | -20C To +70C |
| Temperature Drift | +/-10ppm (-20C To +70C) |
| Loading Capacitance (CL) | 9.0 pF |
| Drive Level | 10 W (100W Max.) |
| Shunt Capacitance | 2.0 pF Max. |
| Insulation Resistance | More than 500M ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Circuit Measurement | HP/E5100A, S&A 250B |
| Shock Test Variation (Frequency) | Less than +/-5 ppm |
| Shock Test Variation (Resistance) | Less than +/-15 % or 2ohms max. |
| Aging | Less than +/- 3 ppm/Year |
| Holder Type | HSX221SA Seam type |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Carrier Tape Material | PS Conductive |
| Top Tape Material | Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N |
| Vibration Frequency | 10-55Hz, Sine Wave, 0.8mm amplitude (X, Y, Z axes) |
| Sealing Tightness Leak Rate | 1.0x10-8 Pa-m/sec. Max. |
| Solderability Bath Temperature | 245C +/-5C |
| Solderability Time | 3 +/-0.5 sec. |
| Substrate Bending Pressure | 3 mm hold for 5 1 sec |
| Adhesion Pressure | 5N for 101 sec |
| Body Strength Pressure | 10N for 101sec |
| Humidity Test Duration | 240 hours |
| Low Temperature Storage Duration | 240 hours (-40C +/-2C) |
| High Temperature Storage Duration | 240 hours (+85C +/-2C) |
| Temperature Cycles | -40C (30min) +85C (30min), 25 cycles |
| Soldering Iron Bit Temperature | 350C max. |
| Soldering Iron Time | 3 sec max. |
| Reflow Preheat Temperature | 160~180 deg.C |
| Reflow Preheat Time | 120sec. |
| Reflow Primary Heat Temperature | 220 deg.C |
| Reflow Primary Heat Time | 60sec. |
| Reflow Peak Temperature | 260 deg.C Max. |
| Reflow Peak Time | 10sec. Max. |
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