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Specifications
Load Capacitance:
-
Operating Temperature:
-
Frequency:
-
Mfr. Part #:
X2C038400BA1H-HZ
Package:
SMD2016-4P
Key Attributes
Model Number:
X2C038400BA1H-HZ
Product Description
Product Overview
The HSX211S Quartz Crystal from Harmony Electronics Corporation is a high-performance frequency control component designed for various electronic applications. It offers precise frequency stability and reliability, adhering to stringent environmental and mechanical standards. This product is Pb-free, RoHS compliant, HF-Halogen free, and REACH compliant, making it an environmentally conscious choice for modern electronics manufacturing.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX211S
- Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 1
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 38.400000 | MHz | |
| Frequency (FL) | 38.400000 | MHz | |
| Mode of Oscillation | Fundamental | ||
| Frequency Tolerance | -10 to +10 | ppm | at 253 |
| Equivalent Resistance (RR) | 50 | SERIES | |
| Storage Temperature Range | -40 to +105 | ||
| Operable Temperature Range | -30 to +85 | ||
| Temperature Stability | -10 to +10 | ppm | -30~ +85 |
| Loading Capacitance (CL) | 10.0 | pF | |
| Drive Level (DL) | 10 to 100 | W | |
| Shunt Capacitance (C0) | 2.0 | pF | |
| Insulation Resistance | 500 | M | at DC 100V |
| Aging | -3 to +3 | ppm/Year | |
| Circuit Measurement | Measured in HP/E5100A,S&A 250B | ||
| Dimensions (Length x Width) | 1.65 x 2.05 | mm | |
| Dimensions (Height) | 0.7 | mm | |
| Land Pattern Layout (Length x Width) | 1.1 x 1.4 | mm | |
| Pin Connections | #1 Crystal, #2 Crystal, #3 GND/Lid, #4 GND/Lid | ||
| Inside Structure - Base Material | Ceramic Al2O3 | ||
| Inside Structure - Lid Material | Metal Fe- Ni Co Ni Plating | ||
| Inside Structure - Kovar Material | Metal Fe- Ni -Co | ||
| Inside Structure - Crystal Blank Material | Quartz SiO2 Rectangular At-Cut | ||
| Inside Structure - Electrode Material | Metal | ||
| Inside Structure - PAD Material | Metal W Ni Plating Au Plating | ||
| Inside Structure - Connective Adhesive | Silver Powder Ag | ||
| Carrier Tape Width | 8.0 | mm | 0.2 |
| Carrier Tape Pitch | 4.0 | mm | 0.1 |
| Reel Quantity | 1000 or 3000 | pcs | |
| Standard Packing Quantity | 3000 | PCS / REEL | |
| Shock Test | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | Refer to: JIS C 60068-2-32 | |
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | Refer to: JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 | |
| Leakage Test Leak Rate | 1.0x10-9 | Pa-m3/sec. Max. | Measured by Helium leak detector. Refer to: JIS C 60068-2-17 |
| Solder ability | Dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | Refer to: JIS C 60068-2-20/ JIS C 60068-2-58 | |
| Bending Strength Test | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | Refer to: EIAJ ET-7403/ JIS C 60068-2-21 | |
| Adhesion Test | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | Refer to: EIAJ ET-7403/ JIS C 60068-2-21 | |
| Body Strength Test | Apply pressure to the center of body with the R0.5 pressure jig. pressure : 5N for 101sec | Refer to: EIAJ ET-7403 JIS C 60068-2-21 | |
| Resistance of Soldering Heat | Performing as the following reflow | Refer to: JIS C 60068-2-58 | |
| Humidity Test | Temperature 602, RH 90~95%, duration of 240 hours. | Back to room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-3 | |
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. | Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-1 | |
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. | Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-2 | |
| Thermal Shock Test | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. Temperature Increasing/reducing time3mins. | Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 0025 |
2411121056_HELE-X2C038400BA1H-HZ_C254271.pdf
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