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Specifications
Frequency Stability:
-50ppm~+30ppm
Voltage - Supply:
1.8V
Operating Temperature:
-40℃~+85℃
Frequency:
19.2MHz
Mfr. Part #:
S2H019200IECHE-T
Package:
SMD2520-4P
Key Attributes
Model Number:
S2H019200IECHE-T
Product Description
Product Overview
The HSO221S is a high-quality oscillator manufactured by HARMONY ELECTRONICS CORP. Designed for broad applications, this component offers precise frequency output and stable performance across various environmental conditions. It is suitable for integration into electronic devices requiring a reliable and accurate clock source, with a focus on industrial and commercial applications.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSO221S
- Country of Origin: TAIWAN
- Moisture Sensitivity Level: Level 1
Technical Specifications
| Item | Symbol | Value | Unit | Condition | Min | Typ | Max | Etc |
|---|---|---|---|---|---|---|---|---|
| 1. Type Name | ||||||||
| Type Name | HSO221S | |||||||
| 2. Output Frequency | ||||||||
| Output Frequency | 19.200000 | MHz | ||||||
| 3. Absolute Maximum Ratings | ||||||||
| Vdd terminal voltage | Vdd | -0.5 ~ 4.0 | V | |||||
| Input terminal voltage | Vcont | -0.5 ~ Vdd+0.5 | V | |||||
| Output terminal voltage | Vout | -0.5 ~ Vdd+0.5 | V | |||||
| Output terminal current | Iout | mA | 15 | |||||
| Storage temp. range | Tstr | -55 ~ 125 | deg.C | |||||
| 4. Electric Specifications | ||||||||
| Frequency Stability | f/F | ppm | 1.8+/- 0.09V, -40~85 | -50 | +30 | |||
| Operating temp. range | Topr | -40 | 25 | +85 | ||||
| Supply voltage | Vdd | V | 1.71 | 1.8 | 1.89 | |||
| Current consumption 1 (#1 pin: open or "H") | Idd1 | mA | Fig1,2, 1.8V, 25+/-3 | 7 | ||||
| Current consumption 2 (#1 pin: "L" level) | Idd2 | mA | Fig1,2, 1.8V, 25+/-3 | 0.01 | ||||
| Symmetry Duty | % | 40 | 50 | 60 | ||||
| Low level output voltage | Vol | V | 0.1xVdd | |||||
| High level output voltage | Voh | V | 0.9xVdd | |||||
| Rise & Fall time | Tr & Tf | ns | CL=15 pF | 10 | ||||
| Pin #1 options | YES | |||||||
| Output load | CL-MOS | 15 | pF | (Idd1, Idd2 test at No Load) | ||||
| Low level input current | Iil | uA | Fig3, 1.8V, 25+/-3 | 10 | ||||
| High Level input current | Iih | uA | Fig3, 1.8V, 25+/-3 | 10 | ||||
| Low level input voltage | Vil | V | Vddx0.3 | |||||
| High level input voltage | Vih | V | Vddx0.7 | |||||
| Output disable time | Tplz | ns | 150 | |||||
| Output enable time | Tpzl | ms | 10 | |||||
| Smart Up Time | ms | 10 | ||||||
| Aging | ppm/year | -3 | 3 | |||||
| 5. Dimensions | ||||||||
| Dimensions | 2.0 x 1.15 x 0.7 (approx.) | mm | (Refer to drawing) | |||||
| 6. Inside Structure | ||||||||
| Base Material | Alumina Ceramic (Al2O3) | |||||||
| IC | IC(Si. Al.) | |||||||
| Bonding Wire | Au | |||||||
| Crystal Blank | Rectangular At-Cut Quartz Crystal Blank | |||||||
| LID | Fe+Ni+Co | |||||||
| Adhesive | Silver Conductive Silicon Resin | |||||||
| 7. Mechanical Performance | ||||||||
| Natural Drop | Drop 3 times from 50cm onto hard wooden board | JIS C 60068-2-6 A | ||||||
| Vibration | 10-55Hz, 0.8mm amplitude, 2 hours per axis (X, Y, Z) | MIL-HDBK-781A 6.5.2 / JIS C 60068-2-6 A | ||||||
| Sealing Tightness (Leak Rate) | 1.0x10-8 Pa-m3/sec. Max. (Helium leak detector) | Fine Leakage | ||||||
| Sealing Tightness (Dipping Test) | No gas bubble observed after dipping in FC-40 at +125 deg.C for 5 minutes | |||||||
| Solder ability | Dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. after applying ROSIN Flux | JIS C 60068-2-20 B | ||||||
| 8. Environment Performance | ||||||||
| Humidity | 60+/-2, RH 90~95% for 240 hours | JIS C 60068-2-3 A | ||||||
| Storage in Low Temperature | -40deg.C +/-2deg.C for 240 hours | JIS C 60068-2-1 A | ||||||
| Storage in High Temperature | +85deg.C +/-2deg.C for 240 hours | JIS C 60068-2-2 A | ||||||
| Temperature cycles | -30deg.C (30min) +80deg.C (30min), 25 cycles | JIS C 0025 A | ||||||
| High Temperature Operation | +85deg.C +/-2deg.C, +1.8V Vdd for 240 hours | JIS C 60068-2-2 A | ||||||
| Performance after Environmental Tests | Frequency variation within +/-5ppm, Equivalent resistance within specification | A | ||||||
| Solderability after Environmental Tests | More than 90% of lead covered by new solder | B | ||||||
| 9. Supplement | ||||||||
| Soldering Cycles | Max. 2 times, follow proposed reflow condition | 9.1 | ||||||
| Solder Iron Temperature | Max. 350deg.C, Max. 3 sec. per terminal, Max. 1 time per terminal | 9.3 | ||||||
| Mounting Caution | Avoid Ultrasonic welding due to risk of internal damage | 9.4 | ||||||
| Cleaning Liquid Restriction | Do not use cleaning liquids that corrode Nickel | 9.5 | ||||||
| Handling Static Electricity | Handle with care as other C-MOS devices | 9.6 | ||||||
| By-pass Capacitor Recommendation | Recommend 0.01F ceramic chip capacitor between Vdd and GND | 9.7 | ||||||
| Storage Conditions | Keep away from high temperature, high humidity, direct sunlight, and dew | 9.8 | ||||||
| 10. Taping and Packing | ||||||||
| Quantity on Reel | 3,000 PCS/REEL | 10.4 | ||||||
| Storage Conditions (Taping/Packing) | Temperature +40deg.C Max., Humidity 80% Max. | 10.3 | ||||||
2409272301_HELE-S2H019200IECHE-T_C253924.pdf
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