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Quality Quartz Crystal Frequency Control HELE X2B032000BC1H-HZ 32 MHz Pb Free RoHS Compliant for Electronics factory
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Quality Quartz Crystal Frequency Control HELE X2B032000BC1H-HZ 32 MHz Pb Free RoHS Compliant for Electronics factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±12ppm
Load Capacitance:
12pF
Operating Temperature:
-30℃~+85℃
Frequency:
32MHz
Mfr. Part #:
X2B032000BC1H-HZ
Package:
SMD2520-4P
Key Attributes
Model Number: X2B032000BC1H-HZ
Product Description

Product Overview

The Harmony Electronics HSX221SA is a Quartz Crystal designed for reliable frequency control. It operates at a nominal frequency of 32.000000MHz and is suitable for a wide range of electronic applications. This product is Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant, emphasizing its commitment to environmental standards. It is manufactured in Taiwan.

Product Attributes

  • Brand: Harmony Electronics Corporation
  • Product Type: Quartz Crystal
  • Model: HSX221SA
  • Country of Origin: Taiwan
  • Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
  • MSL Level: 1

Technical Specifications

Item Electrical Spec. Unit Notes Min Type Max
Frequency (FL) Frequency MHz 32.000000
Mode of oscillation Mode of oscillation Fundamental
Frequency tolerance Frequency tolerance ppm at 253 -10 +10
Equivalent resistance (RR) Equivalent resistance SERIES 50
Storage temperature range Storage temperature range -40 +125
Operable temperature range Operable temperature range -30 +85
Temperature stability Temperature stability ppm -30 ~ +85 -12 +12
Loading capacitance (CL) Loading capacitance pF 12.0
Drive level (DL) Drive level W 10 100
Shunt Capacitance (C0) Shunt Capacitance pF 2.0
Insulation resistance Insulation resistance M at DC 100V 500
Aging Aging ppm/Year -3 +3
Circuit Measured in HP/E5100A,S&A 250B
Dimensions (L x W) mm 2.0 x 2.5
Dimensions (Height) mm Max 1.15
Dimensions (Lead Pitch) mm 0.7
Pin Connections Pin 1,2 Crystal; Pin 3,4 GND/Lid
Carrier Tape Width mm 8.0
Carrier Tape Pitch mm 4.0
Reel Quantity pcs Standard Packing 3000
Shock Test Shock Dropping from 120 cm height 3 times on 30 mm Concrete floor. A
Vibration Test Vibration Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. A
Leakage Test Leak Rate Pa-m3/sec. Max. Measured by Helium leak detector. 1.0x10-9
Solder ability Test After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. B
Bending Strength Test Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. A
Adhesion Test Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. C
Body Strength Test Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec C
Resistance of Soldering Heat Test Performing as the following reflow. A
Humidity Test Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. A
Storage in Low Temperature Test -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. A
Storage in High Temperature Test +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. A
Thermal shock Test -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. A
Specifications Code A FREQ. DRIFT ppm Max 5
Specifications Code A RESISTANCE DRIFT 15 or 2
Specifications Code B % More than 90% of lead shall be covered by new solder.
Specifications Code C FREQ. DRIFT ppm Max 15
Specifications Code C RESISTANCE DRIFT 25 or 10

2410121447_HELE-X2B032000BC1H-HZ_C254337.pdf

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