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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Load Capacitance:
9pF
Operating Temperature:
-30℃~+85℃
Equivalent Series Resistance(ESR):
50Ω
Frequency:
26MHz
Mfr. Part #:
X3S026000B91H-NZ
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S026000B91H-NZ
Product Description
Harmony Electronics Corp. HSX321S Quartz Crystal
Product Overview
The Harmony Electronics Corp. HSX321S is a quartz crystal unit designed for electronic applications requiring precise frequency control. It operates at a nominal frequency of 26.000MHz with a tight frequency tolerance of +/-10 ppm at 25C. This crystal unit is suitable for a wide range of products and applications where stable oscillation is critical. The HSX321S features a compact holder type and is built to withstand various environmental and mechanical stresses.
Product Attributes
- Brand: Harmony Electronics Corp.
- Model: HSX321S
- Country of Origin: TAIWAN
- Manufacturing Locations: THAILAND FACTORY, SHENZHEN FACTORY
- Holder Type: HSX321S
- Oscillation Mode: Fundamental
- Marking: Laser marking (Logo, Nominal Frequency, Manufactured year & month, Manufacturing Lot No.)
Technical Specifications
| Specification | Value | Notes |
|---|---|---|
| Nominal Frequency | 26.000000MHz | |
| Frequency Tolerance | +/-10 ppm | at 25C +/-3C |
| Equivalent Resistance | 60 ohms Max. | /SERIES |
| Storage Temperature Range | -40C To +85C | |
| Operable Temperature Range | -30C To +85C | |
| Temperature Drift | +/-10 ppm | -30C To +85C |
| Loading Capacitance (CL) | 9.0 pF | |
| Drive Level | 10 uW | (100uW Max) |
| Shunt Capacitance | 2.0 pF Max | |
| Insulation Resistance | More than 500M ohms | at DC 100V |
| Shock Test | Frequency variation < +/-5 ppm; Resistance variation < +/-15% or 2ohms max. | Dropping from 50 cm height 3 times on firm wood |
| Aging | Less than +/-2 ppm/Year | |
| Holder Type | HSX321S | Seam type |
| Carrier Tape Dimensions | W1: 9.3+/-0.3 mm, W2: 11.3+/-1.0 mm | |
| Reel Dimensions | Diameter: 180+0/-3 mm, Inner Width: 9.3+/-0.3 mm | |
| Storage Condition | Temperature: +40C Max., Relative Humidity: 80% Max. | |
| Standard Packing Quantity | 3,000 PCS / REEL | |
| Tape Material | Carrier tape: PS, Top tape: Polyester | |
| Cover Tape Release Strength | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min |
| Mechanical Performance (Natural Drop) | Frequency variation < +/-5ppm, Equivalent resistance < specification | Drop 3 times from 50cm onto hard wooden board |
| Mechanical Performance (Vibration) | Frequency variation < +/-5ppm, Equivalent resistance < specification | 10-55Hz, 0.8mm amplitude, 2 hours per axis (X, Y, Z) |
| Mechanical Performance (Sealing Tightness) | Leak Rate: 1.0x10-8 Pa-m3/sec. Max. | Fine Leakage (Helium leak detector) |
| Mechanical Performance (Solder ability) | >90% of lead covered by new solder | Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec. |
| Environmental Performance (Humidity) | Frequency variation < +/-5ppm, Equivalent resistance < specification | 60C, 90~95% RH for 240 hours |
| Environmental Performance (Storage in Low Temperature) | Frequency variation < +/-5ppm, Equivalent resistance < specification | -40C +/-2C for 240 hours |
| Environmental Performance (Storage in High Temperature) | Frequency variation < +/-5ppm, Equivalent resistance < specification | +85C +/-2C for 240 hours |
| Environmental Performance (Temperature Cycles) | Frequency variation < +/-5ppm, Equivalent resistance < specification | -40C +85C (30min each), 25 cycles |
| Soldering Condition (Reflow) | Preheat: 160~180C (120sec), Primary heat: 220C (60sec), Peak: 260C (10sec Max.) | Max. 2 times |
| Soldering Condition (Solder Iron) | Bit temp.: 350C max., Time: 3sec max. | Each terminal solder 1 time max. |
| Inside Structure Materials | Base: Alumina Ceramic, Lid: Fe-Ni-Co, Crystal Blank: Quartz | |
| Environmental Workload Chemical Substance Components | Si, Au, Co, Mo, Ag, Cu, Cr, Al, Mn, W, Ni, Fe | (Refer to page 14 for detailed percentages) |
2410121322_HELE-X3S026000B91H-NZ_C133481.pdf
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