Product Overview
The Harmony Electronics HSX321S is a quartz crystal unit designed for various product applications. It offers a stable frequency of 25.000MHz with a frequency tolerance of +/-10 ppm at 25C. This component is built with a durable alumina ceramic base and a Fe-Ni-Co lid, ensuring reliable performance across a wide operating temperature range of -20C to +75C. The HSX321S is suitable for automatic insertion and is compliant with RoHS standards.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Type: Quartz Crystal Unit
- Country of Origin: TAIWAN
- Manufacturing Locations: THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
- Certifications: ROHS Compliant
Technical Specifications
| Specification | Details |
|---|---|
| Frequency | 25.000000MHz |
| Holder Type | HSX321S |
| Frequency Tolerance | +/-10 ppm at 25C +/-3C |
| Equivalent Resistance | 80 ohms Max. / SERIES |
| Storage Temperature Range | -40C To +125C |
| Operable Temperature Range | -20C To +75C |
| Temperature Drift | +/-10 ppm (-20C To +75C) |
| Loading Capacitance (CL) | 10.0 pF |
| Drive Level | 10 W (100W Max) |
| Shunt Capacitance | 2.0 pF Max |
| Insulation Resistance | More than 500M ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Test (Drop) | 120 cm height, 3 times on Concrete floor; Frequency variation < +/-5 ppm, Resistance variation < +/-15% or 2 ohms max. |
| Aging | Less than +/-3 ppm/Year |
| Holder Type | HSX321S Seam type |
| Base Material | Alumina Ceramic (Al2O3) |
| Lid Material | Fe-Ni-Co |
| Adhesive | Silver Conductive Silicon Resin |
| Cover Ring Material | Fe-Ni-Co Alloy |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Carrier Tape Material | PS Conductive |
| Top Tape Material | Polyester |
| Mechanical Performance - Vibration | 10-55Hz, Sine Wave, 0.8mm amplitude (X, Y, Z axes), 120 min per direction |
| Mechanical Performance - Sealing Tightness | Leak Rate 1.0x10-8 Pa-m/sec. Max. (Helium leak detector) |
| Mechanical Performance - Solderability | Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec. after applying ROSIN Flux |
| Mechanical Performance - Substrate Bending | Board bent to 3 mm, held for 5 1 sec (Pressure speed: 0.5 mm/sec) |
| Mechanical Performance - Adhesion | Pressure: 5N for 10+/-1 sec |
| Mechanical Performance - Body Strength | Pressure: 10N for 10+/-1 sec |
| Environmental Performance - Humidity | 60C +/-2C, 90~95% RH, 240 hours |
| Environmental Performance - Low Temperature Storage | -40C +/-2C, 240 hours |
| Environmental Performance - High Temperature Storage | +85C +/-2C, 240 hours |
| Environmental Performance - Temperature Cycles | -40C +/-2C (30min) +85C +/-2C (30min), 25 cycles |
| Soldering Profile (Reflow) | Preheat: 160~180C (120sec), Primary heat: 220C (60sec), Peak: 260C (10sec Max.) |
| Soldering Iron Temperature | 350C max., Time: 3 sec max. per terminal |
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