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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Load Capacitance:
15pF
Operating Temperature:
-
Frequency:
40MHz
Mfr. Part #:
X2B040000BF1H-HZ
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B040000BF1H-HZ
Product Description
Product Overview
The HSX221SA is a quartz crystal unit manufactured by HARMONY ELECTRONICS CORP. Designed for various product applications, this crystal operates at a nominal frequency of 40.000MHz. It features a holder type HSX221SA and is built to withstand a range of environmental and mechanical stresses, making it suitable for demanding applications. The product is available with specifications for taping and reeling, adhering to industry standards for automated assembly.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Product Type: Quartz Crystal Unit
- Model/Part Number: HSX221SA / X2B040000BF1H-HZ
- Country of Origin: TAIWAN
- Manufacturing Locations: TAIWAN FACTORY, THAILAND FACTORY, CHINA FACTORY
- Moisture Sensitivity Level: Level 1
- Certifications: ROHS Compliant, Green Product
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 40.000000 MHz |
| Holder Type | HSX221SA |
| Frequency Tolerance | +/-10 ppm at 25°C +/-3°C |
| Equivalent Resistance | 30 ohms Max. / SERIES |
| Storage Temperature Range | -40 °C To +85 °C |
| Operable Temperature Range | -30 °C To +85 °C |
| Temperature Drift | +/-10ppm (-30 °C To +85 °C) |
| Loading Capacitance (CL) | 15.0 pF |
| Drive Level | 10 µW (100µW Max.) |
| Shunt Capacitance | 2.0 pF Max. |
| Insulation Resistance | More than 500M ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Circuit Measurement | HP/E5100A, S&A 250B |
| Shock Test (Dropping) | 120 cm height, 3 times on Concrete floor. Frequency variation < +/-5 ppm, Resistance variation < +/- 15 % or 2 ohms max. |
| Aging | Less than +/- 3 ppm/Year |
| Holder Type | HSX221SA Seam type |
| Dimensions | Refer to page 4 |
| Emboss Carrier Tape & Reel | Refer to pages 6 and 7 |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Carrier Tape Material | PS Conductive |
| Top Tape Material | Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N (Pulling direction 165° to 180°, Speed 300mm/min) |
| Mechanical Endurance (Drop) | 120 cm height, 3 times on Concrete floor |
| Mechanical Endurance (Vibration) | 10-55Hz, Sine Wave, 0.8mm amplitude, 2 hours per axis (X, Y, Z) |
| Sealing Tightness | Leak Rate 1.0x10-8 Pa-m3/sec. Max. (Helium leak detector) |
| Solderability | 245°C+/-5°C for 3+/-0.5 sec. |
| Substrate Bending | 3 mm bend, hold for 5 ±1 sec. (0.5 mm/sec pressure speed) |
| Adhesion | 5N pressure for 10±1 sec. |
| Body Strength | 10N pressure for 10±1 sec. (R0.5 pressure jig) |
| Environmental Performance (Humidity) | 60 °C +/- 2 °C, 90~95% RH, 240 hours |
| Environmental Performance (Low Temp Storage) | -40 °C +/-2 °C, 240 hours |
| Environmental Performance (High Temp Storage) | +85 °C +/-2 °C, 240 hours |
| Environmental Performance (Temp Cycles) | -40 °C (30min) <> +85 °C (30min), 25 cycles |
| Soldering Reflow Condition | Preheat: 160~180 °C (120sec), Primary heat: 220 °C (60sec), Peak: 260 °C (10sec) Max. |
| Soldering Iron Condition | Bit temp.: 350°C max., Time: 3sec max. per terminal |
2410121327_HELE-X2B040000BF1H-HZ_C136062.pdf
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