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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Operating Temperature:
-20℃~+70℃
Load Capacitance:
10pF
Frequency:
38.4MHz
Mfr. Part #:
X2B038400BA1H-U
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B038400BA1H-U
Product Description
Product Overview
The Harmony Electronics HSX221SA is a high-quality Quartz Crystal Unit designed for reliable performance in various electronic applications. This product is Pb-free, RoHS compliant, HF-Halogen free, and REACH compliant, ensuring adherence to environmental and safety standards. It offers stable frequency characteristics and is suitable for use in automated SMT processes, provided that sampling is conducted prior to mass production to verify process compatibility. The crystal unit is built with durable ceramic and metal components, ensuring longevity and performance integrity.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX221SA
- Part Number: X2B038400BA1H-U
- Sample P/N: EOS-H10150-1
- Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 01
- Green Product: Yes
Technical Specifications
| Item | Electrical Spec. | Unit | Min | Type | Max | Notes |
|---|---|---|---|---|---|---|
| Frequency (FL) | 38.400000 | MHz | 38.400000 | |||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | -10 | +10 ppm | at 253 | |||
| Equivalent resistance (RR) | 60 | SERIES | ||||
| Storage temperature range | -40 | +85 | ||||
| Operable temperature range | -20 | +70 | ||||
| Temperature stability | -10 | +10 ppm | -20 ~ +70 | |||
| Loading capacitance (CL) | pF | 10.0 | ||||
| Drive level (DL) | W | 10 | 100 | |||
| Shunt Capacitance (C0) | pF | 2.0 | ||||
| Insulation resistance | M | 500 | at DC 100V | |||
| Aging | -3 | +3 ppm/Year | ||||
| Circuit Measurement | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions (L x W x H) | 2.0 x 2.0 x 0.7 | mm | (See Dimension Diagram) | |||
| Carrier Tape Width | 8.0 | mm | (See Emboss Carrier Tape & Reel Diagram) | |||
| Reel Quantity | pcs/reel | 3000 | Standard Packing Quantity | |||
| Shock Test | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | |||||
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 120 mins to each direction. | |||||
| Leakage Test | Pa-m/sec. Max. | 1.0x10-9 | Measured by Helium leak detector. | |||
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | |||||
| Bending Strength | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | |||||
| Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | |||||
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :5N for 101sec | |||||
| Resistance of Soldering Heat | Performing as the following reflow: | |||||
| Humidity Test | , RH | 602 | 90~95% | duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | ||
| Storage in Low Temperature | -402 | duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | ||||
| Storage in High Temperature | +852 | duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | ||||
| Temperature cycles | -402 (30min) | +852 (30min) | 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. |
2409291004_HELE-X2B038400BA1H-U_C254307.pdf
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