Product Overview
The Harmony Electronics HSX321S is a Quartz Crystal unit designed for electronic applications. It operates at a nominal frequency of 27.000000MHz and is built to meet stringent environmental and mechanical performance standards. This product is Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant, indicating a commitment to environmental responsibility.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX321S
- Sample Order Number: EOS-GA0302-1
- Harmony Electronics Part Number: X3S027000DK1H-V
- Release Date: 2016/11/01
- Version: 00
- MSL Level: 01
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- Country of Origin: Taiwan
Technical Specifications
| Item | Specification | Unit | Notes |
|---|---|---|---|
| Frequency (FL) | 27.000000 | MHz | |
| Mode of oscillation | Fundamental | ||
| Frequency tolerance | -20 to +20 | ppm | at 253 |
| Equivalent resistance (RR) | 60 | SERIES | |
| Storage temperature range | -40 to +85 | ||
| Operable temperature range | -40 to +85 | ||
| Temperature stability | -30 to +30 | ppm | -40 ~ +85 |
| Loading capacitance (CL) | 20.0 | pF | |
| Drive level (DL) | 10 to 100 | W | |
| Shunt Capacitance (C0) | 2.0 | pF | |
| Insulation resistance | 500 | M | at DC 100V |
| Aging | -3 to +3 | ppm/Year | |
| Circuit Measurement | Measured in HP/E5100A,S&A 250B | ||
| Dimensions (L x W x H) | 3.2 x 2.5 x 0.7 | mm | Tolerance: 0.1 |
| Carrier Tape Width | 8.0 | mm | Tolerance: 0.2 |
| Standard Packing Quantity | 3,000 | PCS / REEL |
Package & Handling
Emboss Carrier Tape & Reel: Carrier Tape Material: PS (Conductive), Top tape Material: PET. Joint of tape: Carrier-tape and top cover-tape should not be jointed. Release strength of cover tape: 0.1N to 0.7N (Pulling direction: 165 to 180, Speed: 300mm/min). Handling Suggestions: Reflow Conditions: Preheat 160~180 (120 sec), Primary heat 220 (60 sec), Peak 260 (10 sec) Max. Manual Solder iron: Bit temp. 350 max., Time: 3 sec max. per terminal. Cleansing Conditions: General cleaning solutions may be used, but testing is recommended. Ultrasonic cleaning is not recommended. Storage Conditions: Store in original packaging in a clean, dust-free environment out of direct sunlight. Recommended: Environmental Temperature: Max. +40, Maximum Relative Humidity: 80%.
Mechanical & Environmental Performance
Mechanical Performance: Shock: Dropping from 120 cm height 3 times on 30 mm Concrete Floor. Vibration: Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles, 2 hours each direction. Leakage Test: Leak Rate 1.0x10-9 Pa-m3/sec. Max. Solder ability: Dipping in solder bath at 245 5 for 3 0.5 sec after applying ROSIN Flux. Bending Strength: Apply pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Adhesion: Apply pressure of 5N for 101 sec vertically to the side of specimen attached to the circuit board. Body strength: Apply pressure of 10N for 101 sec to the center of body. Environmental Performance: Resistance of Soldering Heat: Performing as specified reflow conditions. Humidity: 602, RH 90~95%, duration of 240 hours. Storage in Low Temperature: -40 2, duration of 240 hours. Storage in High Temperature: +85 2, duration of 240 hours. Temperature cycles: -40 2 (30min) +85 2 (30min), 25 cycles.
2410121433_HELE-X3S027000DK1H-V_C254374.pdf
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