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Specifications
Normal temperature Frequency Tolerance:
±50ppm
Frequency Stability:
±50ppm
Load Capacitance:
20pF
Operating Temperature:
-20℃~+70℃
Frequency:
8MHz
Mfr. Part #:
X5H008000IK1H-H
Package:
SMD5032-2P
Key Attributes
Model Number:
X5H008000IK1H-H
Product Description
Product Overview
The Harmony Electronics HSX530G Quartz Crystal is a high-quality electronic component designed for precise frequency generation. Compliant with RoHS, HF-Halogen free, and REACH standards, this crystal is suitable for various electronic applications. It features a nominal frequency of 8.000000MHz and is manufactured with advanced materials and processes ensuring reliability and performance. The product is available in tape and reel packaging for automated SMT processes.
Product Attributes
- Brand: Harmony Electronics Corp.
- Model: HSX530G
- Country of Origin: Taiwan
- Certifications: RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 1
- Product Type: Quartz Crystal
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | 8.000000 | MHz | 8.000000 | |||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | at 253 | -50 | +50 | ||
| Equivalent resistance (RR) | SERIES | 100 | ||||
| Storage temperature range | -40 | +85 | ||||
| Operable temperature range | -20 | +70 | ||||
| Temperature stability | ppm | -20 ~ +70 | -50 | +50 | ||
| Loading capacitance (CL) | 20.0 | pF | 20.0 | |||
| Drive level (DL) | W | 10 | 300 | |||
| Shunt Capacitance (C0) | 7.0 | pF | 7.0 | |||
| Insulation resistance | 500 | M | at DC 100V | |||
| Aging | ppm/Year | -5 | +5 | |||
| Dimensions (L x W) | 2.0 x 1.6 | mm | Max. | |||
| Dimensions (Height) | 0.8 | mm | Max. | |||
| Dimensions (Width) | 2.6 | mm | Max. | |||
| Dimensions (Length) | 3.8 | mm | Max. | |||
| Dimensions (Terminal Width) | 1.4 | mm | Max. | |||
| Dimensions (Terminal Length) | 1.1 | mm | Max. | |||
| Inside Structure (Base) | Ceramic | Al2O3 | ||||
| Inside Structure (Cap) | Ceramic | Al2O3 | ||||
| Inside Structure (Crystal Blank) | Quartz | SiO2, Rectangular At-Cut | ||||
| Inside Structure (Electrode) | Metal | |||||
| Inside Structure (PAD) | Metal | W Ni Plating Au Plating | ||||
| Inside Structure (Connective Adhesive) | Silver Powder | Ag | ||||
| Carrier Tape Width | 8.0 | mm | 0.1 | |||
| Carrier Tape Pitch | 4.0 | mm | 0.1 | |||
| Carrier Tape Pocket Depth | 1.55 | mm | 0.05 | |||
| Carrier Tape Pocket Width | 3.6 | mm | 0.1 | |||
| Carrier Tape Wall Thickness | 0.30 | mm | 0.05 | |||
| Carrier Tape Overall Width | 12.0 | mm | 0.2 | |||
| Carrier Tape Component Height | 2.0 | mm | 0.05 | |||
| Carrier Tape Component Length | 5.4 | mm | 0.1 | |||
| Top Cover Tape Width | 5.5 | mm | 0.05 | |||
| Reel Diameter | 180 | mm | +0/-3 | |||
| Reel Hub Diameter | 13.2 | mm | 0.5 | |||
| Reel Width | 13 | mm | 0.5 | |||
| Reel Spool Width | 3.0 | mm | 0.2 | |||
| Standard Packing Quantity | 1,000 | PCS / REEL | ||||
| One reel quantity | 1000 / 3000 | pcs | ||||
| Shock Test | Dropping from 100 cm height 3 times on 30 mm Concrete floor. | Refer to: JIS C 60068-2-32 | A | |||
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | Refer to: JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 | A | |||
| Leakage Test | Leak Rate 1.0x10-9 Pa-m3/sec. Max. | Measured by Helium leak detector. Refer to: JIS C 60068-2-17 | --- | |||
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | Refer to: JIS C 60068-2-20/ JIS C 60068-2-58 | B | |||
| Bending Strength | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | Refer to: EIAJ ET-7403/ JIS C 60068-2-21 | A | |||
| Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | Refer to: EIAJ ET-7403 JIS C 60068-2-21 | C | |||
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | Refer to: EIAJ ET-7403 JIS C 60068-2-21 | C | |||
| Resistance of Soldering Heat | Performing as the following reflow: | Refer to: JIS C 60068-2-58 | A | |||
| Humidity Test | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-3 | A | |||
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-1 | A | |||
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-2 | A | |||
| Thermal shock | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 0025 | A | |||
| Specifications code (A) | FREQ. DRIFT: 5 ppm Max, RESISTANCE DRIFT: 15% or 2 | |||||
| Specifications code (B) | More than 90% of lead shall be covered by new solder. | |||||
| Specifications code (C) | FREQ. DRIFT: 15 ppm Max, RESISTANCE DRIFT: 25% or 10 |
2410121447_HELE-X5H008000IK1H-H_C254395.pdf
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