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Specifications
Normal temperature Frequency Tolerance:
±30ppm
Frequency Stability:
±30ppm
Operating Temperature:
-40℃~+85℃
Load Capacitance:
12pF
Frequency:
25MHz
Mfr. Part #:
X3S025000FC1H-HV
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S025000FC1H-HV
Product Description
Product Overview
The Harmony Electronics Corporation HSX321S Quartz Crystal is a high-performance electronic component designed for precise frequency generation. It operates at a nominal frequency of 25.000000MHz and is suitable for a wide range of electronic applications. This crystal is manufactured with Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant materials, ensuring environmental responsibility and safety. Its robust design and stable performance make it ideal for integration into various electronic devices.
Product Attributes
- Brand: H.ELE. (Harmony Electronics Corporation)
- Product Type: Quartz Crystal
- Model: HSX321S
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 01
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | Frequency | MHz | 25.000000 | |||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | at 253 | -30 | +30 | ||
| Equivalent resistance (RR) | Equivalent resistance | SERIES | 30 | |||
| Storage temperature range | -40 | +85 | ||||
| Operable temperature range | -40 | +85 | ||||
| Temperature stability | ppm | -40 ~ +85 | -30 | +30 | ||
| Loading capacitance (CL) | Loading capacitance | pF | 12.0 | |||
| Drive level (DL) | Drive level | W | 10 | 100 | ||
| Shunt Capacitance (C0) | Shunt Capacitance | pF | 2.0 | |||
| Insulation resistance | Insulation resistance | M | at DC 100V | 500 | ||
| Aging | Aging | ppm/Year | -3 | +3 | ||
| Circuit | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions (Unit: mm, Tolerance: 0.1) | ||||||
| Dimension 1 | Length | mm | 3.2 | 0.1 | ||
| Dimension 2 | Width | mm | 2.5 | 0.1 | ||
| Dimension 3 | Height | mm | 0.7 | 0.1 | ||
| Dimension 4 | Length | mm | 1.2 | |||
| Dimension 5 | Width | mm | 0.9 | |||
| Dimension 6 | Width | mm | 0.8 | |||
| Dimension 7 | Width | mm | 0.7 | |||
| Inside Structure | ||||||
| Component | Material | Note | ||||
| Base | Ceramic Al2O3 | |||||
| Lid | Metal Fe- Ni Co Ni Plating | |||||
| Kovar | Metal Fe- Ni -Co | |||||
| Crystal Blank | Quartz SiO2 | Rectangular At-Cut | ||||
| Electrode | Metal | |||||
| PAD Metal | W Ni Plating Au Plating | |||||
| Connective Adhesive | Silver Powder Ag | |||||
| Reflow Conditions | ||||||
| Stage | Temperature | Time | ||||
| Preheat | 160~180 deg.C | 120 sec. | ||||
| Primary heat | >=220 deg.C | 60~120 sec. | ||||
| Peak | 260 deg.C | 10 sec. Max. | ||||
| Emboss Carrier Tape & Reel | ||||||
| Carrier Tape Material | ||||||
| Carrier tape | PS Conductive | |||||
| Top tape | PET | |||||
| Standard Packing Quantity | 3,000PCS / REEL | |||||
| Mechanical Performance | ||||||
| Item | Test Methods | Specifications | Code | |||
| Shock | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | JIS C 60068-2-32 A | ||||
| Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | JIS C 60068-2-6 A | ||||
| Leakage Test | Measured by Helium leak detector. | Leak Rate 1.0x10-9 Pa-m3/sec. Max. | --- | |||
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | More than 90% of lead shall be covered by new solder. | JIS C 60068-2-20 B | |||
| Bending Strength | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | EIAJ ET-7403 A | ||||
| Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | EIAJ ET-7403 C | ||||
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | EIAJ ET-7403 C | ||||
| Environmental Performance | ||||||
| Item | Test Methods | Specifications | Code | |||
| Resistance of Soldering Heat | Performing as the following reflow: | A | ||||
| Humidity | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | FREQ. DRIFT: 5 ppm Max, RESISTANCE DRIFT: 15% or 2 | JIS C 60068-2-3 A | |||
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | JIS C 60068-2-1 A | ||||
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | JIS C 60068-2-2 A | ||||
| Temperature cycles | -40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | FREQ. DRIFT: 15 ppm Max, RESISTANCE DRIFT: 25% or 10 | JIS C 0025 A | |||
2410121447_HELE-X3S025000FC1H-HV_C254349.pdf
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