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Specifications
Normal temperature Frequency Tolerance:
±20ppm
Frequency Stability:
±50ppm
Load Capacitance:
20pF
Operating Temperature:
-10℃~+60℃
Frequency:
8MHz
Mfr. Part #:
X5H008000DK1H
Package:
SMD5032-2P
Key Attributes
Model Number:
X5H008000DK1H
Product Description
Product Overview
The Harmony Electronics HSX530G Quartz Crystal Unit is a high-performance electronic component designed for precise frequency generation. Compliant with RoHS and HF-Halogen standards, this crystal unit offers reliable operation within a specified temperature range and is suitable for various electronic applications. It features a nominal frequency of 8.000000MHz and is manufactured with quality materials to ensure performance and durability.
Product Attributes
- Brand: HARMONY ELECTRONICS CORPORATION
- Product Type: Quartz Crystal
- Model: HSX530G
- Green Product: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- Country of Origin: Taiwan
- Internal Connection: Defined by BASE suppliers
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | MHz | 8.000000 | ||||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | at 253 | -20 | +20 | ||
| Equivalent resistance (RR) | SERIES | 150 | ||||
| Storage temperature range | -40 | +90 | ||||
| Operable temperature range | -10 | +60 | ||||
| Temperature stability | ppm | -10 ~ +60 | -50 | +50 | ||
| Loading capacitance (CL) | pF | 20.0 | ||||
| Drive level (DL) | W | 10 | 300 | |||
| Shunt Capacitance (C0) | pF | 7.0 | ||||
| Insulation resistance | M | at DC 100V | 500 | |||
| Aging | ppm/Year | -5 | +5 | |||
| Circuit Measurement | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions (L x W) | mm | 2.0 x 1.4 | ||||
| Dimensions (Height) | mm | Max. | 0.8 | |||
| Dimensions (Overall L) | mm | 2.6 | ||||
| Dimensions (Overall W) | mm | 3.8 | ||||
| Dimensions (Lead Length) | mm | 2.4 | ||||
| Dimensions (Lead Pitch) | mm | 1.6 | ||||
| Dimensions (Pad L) | mm | 1.1 | ||||
| Dimensions (Pad W) | mm | 1.4 | ||||
| Inside Structure Component (Base) | Material | Ceramic Al2O3 | ||||
| Inside Structure Component (Cap) | Material | Ceramic Al2O3 | ||||
| Inside Structure Component (Crystal Blank) | Material | Quartz SiO2 Rectangular At-Cut | ||||
| Inside Structure Component (Electrode) | Material | Metal | ||||
| Inside Structure Component (PAD) | Material | Metal W Ni Plating Au Plating | ||||
| Inside Structure Component (Connective Adhesive) | Material | Silver Powder Ag | ||||
| Reel Quantity | PCS | 1000 / 3000 | ||||
| Standard Packing Quantity | PCS/REEL | 1,000 | ||||
| Mechanical Performance (Shock) | Test Methods | Dropping from 100 cm height 3 times onto 30 mm hard wooden board | JIS C 60068-2-6 A | |||
| Mechanical Performance (Vibration) | Test Methods | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6 A | |||
| Mechanical Performance (Leakage Test) | Leak Rate | Pa-m3/sec. | Measured by Helium leak detector. | 1.0x10-9 Max. | ||
| Mechanical Performance (Solder ability) | Test Methods | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | JIS C 60068-2-20 B | |||
| Mechanical Performance (Bending Strength) | Test Methods | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | EIAJ ET-7403 A | |||
| Mechanical Performance (Adhesion) | Test Methods | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | EIAJ ET-7403 A | |||
| Mechanical Performance (Body strength) | Test Methods | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | EIAJ ET-7403 A | |||
| Environmental Performance (Resistance of Soldering Heat) | Test Methods | Performing as the following reflow: | A | |||
| Environmental Performance (Humidity) | Test Methods | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | JIS C 60068-2-3 A | |||
| Environmental Performance (Storage in Low Temperature) | Test Methods | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | JIS C 60068-2-1 A | |||
| Environmental Performance (Storage in High Temperature) | Test Methods | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | JIS C 60068-2-2 A | |||
| Environmental Performance (Temperature cycles) | Test Methods | -40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | JIS C 0025 A | |||
| Specifications Code A | Frequency variation shall be within 5ppm and equivalent resistance shall be within 15% or 2 | |||||
| Specifications Code B | More than 90% of lead shall be covered by new solder. |
2409291004_HELE-X5H008000DK1H_C254399.pdf
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