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Specifications
Normal temperature Frequency Tolerance:
±20ppm
Frequency Stability:
±50ppm
Load Capacitance:
8pF
Operating Temperature:
-40℃~+85℃
Frequency:
25MHz
Mfr. Part #:
X3Z025000D81H-X
Package:
SMD3225-4P
Key Attributes
Model Number:
X3Z025000D81H-X
Product Description
Product Overview
The HSX321SK is a quartz crystal unit from HARMONY ELECTRONICS CORP., designed for various product applications. It operates at a nominal frequency of 25.000MHz with a frequency tolerance of +/-20 ppm at 25C. This crystal unit offers a wide operating temperature range of -40C to +85C and a low equivalent resistance of 60 ohms maximum. It is manufactured in Taiwan, Thailand, and China, and is compatible with AEC-Q200 standards, indicating its suitability for demanding environments.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321SK
- Type: Quartz Crystal Unit
- Country of Origin: TAIWAN
- Manufacturing Locations: THAILAND FACTORY, CHINA FACTORY
- Moisture Sensitivity Level: Level 1
- Compliance: ROHS Compliant, Green Product
Technical Specifications
| Specification | Value | Details |
|---|---|---|
| Frequency | 25.000MHz | |
| Holder Type | HSX321SK | |
| Frequency Tolerance | +/-20 ppm | at 25C +/-3C |
| Equivalent Resistance | 60 ohms Max. | /SERIES |
| Storage Temperature Range | -40C To +85C | |
| Operable Temperature Range | -40C To +85C | |
| Temperature Drift | +/-50 ppm | -40C To +85C |
| Loading Capacitance (CL) | 8.0 pF | |
| Drive Level | 10 uW | (100uW Max.) |
| Shunt Capacitance | 2.0 pF Max. | |
| Insulation Resistance | More than 500M ohms | at DC 100V |
| Mode of Oscillation | Fundamental | |
| Shock Test (Frequency Variation) | Less than +/-5 ppm | Dropping from 120 cm height 3 times on Concrete floor |
| Shock Test (Resistance Variation) | Less than +/-15% or 2ohms max. | Dropping from 120 cm height 3 times on Concrete floor |
| Aging | Less than +/-3 ppm / Year | |
| Holder Type | HSX321SK | Seam type |
| Standard Packing Quantity | 3,000 PCS / REEL | |
| Carrier Tape Material | PS | Conductive |
| Top Tape Material | Polyester | |
| Cover Tape Release Strength | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min |
| Sealing Tightness (Leak Rate) | 1.0x10-8 Pa-m3/sec. Max. | Fine Leakage |
| Solder Ability Test | B | After applying ROSIN Flux, dipping in solder bath at 245C+/-5C for 3+/-0.5 sec. |
| Substrate Bending Test | A | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec |
| Adhesion Test | A | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure : 5N for 101 sec |
| Body Strength Test | A | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec |
| Humidity Test | A | Temperature 60+/-2C, RH 90~95%, Duration of 240 hours. |
| Storage in Low Temperature Test | A | -40C +/-2C, Duration of 240 hours. |
| Storage in High Temperature Test | A | +85C +/-2C, Duration of 240 hours. |
| Temperature Cycles Test | A | -40C +/-2C (30min) +85C +/-2C (30min) 25 cycles. |
| Reflow Condition (Preheat) | 160~180 deg.C | 120sec. |
| Reflow Condition (Primary Heat) | 220 deg.C | 60sec. |
| Reflow Condition (Peak) | 260 deg.C Max. | 10sec. |
2410121327_HELE-X3Z025000D81H-X_C254350.pdf
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