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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Load Capacitance:
9pF
Operating Temperature:
-
Frequency:
26MHz
Mfr. Part #:
X2B026000B91H-HR
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B026000B91H-HR
Product Description
Harmony Electronics HSX221SA Quartz Crystal
The Harmony Electronics HSX221SA is a quartz crystal unit designed for various electronic applications. It offers a stable and reliable frequency source with a nominal frequency of 26.000MHz. This crystal is suitable for products requiring precise timing and oscillation, manufactured with high-quality materials and adhering to strict specifications for mechanical and environmental endurance.
Product Attributes
- Brand: Harmony Electronics Corp.
- Model: HSX221SA
- Country of Origin: Taiwan
- Manufacturing Factories: Thailand, China
- Moisture Sensitivity Level: Level 1
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 26.000000MHz |
| Holder Type | HSX221SA |
| Frequency Tolerance | +/-10 ppm at 25C +/-3C |
| Equivalent Resistance | 60 Ohms Max. / SERIES |
| Storage Temperature Range | -40C To +85C |
| Operable Temperature Range | -20C To +75C |
| Temperature Drift | +/-10ppm (-20C To +75C) |
| Loading Capacitance (CL) | 9.0 pF |
| Drive Level | 10 W (100W Max.) |
| Shunt Capacitance | 2.0 pF Max. |
| Insulation Resistance | More than 500M Ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Resistance (Frequency Variation) | Less than +/-5 ppm (after dropping from 120 cm height 3 times on Concrete floor) |
| Shock Resistance (Resistance Variation) | Less than +/- 15% or 2ohms max. (after dropping from 120 cm height 3 times on Concrete floor) |
| Aging | Less than +/- 3 ppm/Year |
| Holder Type | HSX221SA |
| Seam Type | Seam |
| Dimensions | Refer to Page 4 |
| Emboss Carrier Tape & Reel | Refer to Page 6 and Page 7 |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Carrier Tape Material | PS Conductive |
| Top Tape Material | Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min) |
| Mechanical Endurance - Natural Drop | Dropping from 120 cm height 3 times on Concrete floor |
| Mechanical Endurance - Vibration | 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. |
| Mechanical Endurance - Sealing Tightness | Leak Rate 1.0x10 Pa-m/sec. Max. (Measured by Helium leak detector) |
| Mechanical Endurance - Solder ability | Dipping in solder bath at 245C+/-5C for 3+/-0.5 sec. (After applying ROSIN Flux) |
| Mechanical Endurance - Substrate Bending | Apply Pressure until board bends to 3 mm and hold for 5 1 sec (Pressure speed: 0.5 mm/sec) |
| Mechanical Endurance - Adhesion | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig (Pressure: 5N for 101 sec) |
| Mechanical Endurance - Body Strength | Apply pressure to the center of body with R0.5 pressure jig (Pressure: 10N for 101sec) |
| Environmental Endurance - Humidity | 60C +/-2C, RH 90~95%, Duration of 240 hours. |
| Environmental Endurance - Storage in Low Temperature | -40C +/-2C, Duration of 240 hours. |
| Environmental Endurance - Storage in High Temperature | +85C +/-2C, Duration of 240 hours. |
| Environmental Endurance - Temperature Cycles | -40C +/-2C (30min) +85C +/-2C (30min), 25 cycles. |
| Soldering Condition (Reflow) | Preheat: 160~180C (120sec), Primary heat: 220C (60sec), Peak: 260C (10sec Max.) |
| Soldering Condition (Solder Iron) | Bit temp.: 350C max., Time: 3sec max., Each terminal solder 1 time max. |
2410121327_HELE-X2B026000B91H-HR_C254316.pdf
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