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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Load Capacitance:
20pF
Operating Temperature:
-30℃~+85℃
Frequency:
24MHz
Mfr. Part #:
X3S024000BK1H-Z
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S024000BK1H-Z
Product Description
Product Overview
The Harmony Electronics HSX321S is a Quartz Crystal Unit designed for reliable frequency generation. This component is Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant, ensuring adherence to environmental standards. It is manufactured in Taiwan, with production facilities also located in Thailand and China.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX321S
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 01
Technical Specifications
| Item | Electrical Spec. | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 24.000000 | MHz | |
| Frequency (FL) | 24.000000 | MHz | |
| Mode of oscillation | Fundamental | ||
| Frequency tolerance | -10 to +10 | ppm | at 253 |
| Equivalent resistance (RR) | 60 | SERIES | |
| Storage temperature range | -40 to +85 | ||
| Operable temperature range | -30 to +85 | ||
| Temperature stability | -10 to +10 | ppm | -30 ~ +85 |
| Loading capacitance (CL) | 20.0 | pF | |
| Drive level (DL) | 10 to 100 | W | |
| Shunt Capacitance (C0) | 2.0 | pF | |
| Insulation resistance | 500 | M | at DC 100V |
| Aging | -3 to +3 | ppm/Year | |
| Circuit | Measured in HP/E5100A,S&A 250B | ||
| Dimensions (L x W x H) | 3.20.1 x 2.50.1 x 0.70.1 | mm | |
| Carrier Tape Width | 8.00.2 | mm | |
| Reel Diameter | 180+0/-3 | mm | |
| Standard Packing Quantity | 3,000 | PCS / REEL | |
| Shock Test | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | Refer to: JIS C 60068-2-6 A | |
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | Refer to: MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6 A | |
| Leakage Test Leak Rate | 1.0x10-9 | Pa-m3/sec. Max. | Measured by Helium leak detector. |
| Solder ability | Dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | Refer to: JIS C 60068-2-20 B | |
| Bending Strength | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. | Refer to: EIAJ ET-7403 A | |
| Adhesion | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | Refer to: EIAJ ET-7403 A | |
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | Refer to: EIAJ ET-7403 A | |
| Humidity Test | Temperature 602, RH 90~95%, duration of 240 hours. | Refer to: JIS C 60068-2-3 A | |
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. | Refer to: JIS C 60068-2-1 A | |
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. | Refer to: JIS C 60068-2-2 A | |
| Temperature cycles | -40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. | Refer to: JIS C 0025 A | |
| Frequency variation (after environmental tests) | 5 | ppm | |
| Equivalent resistance (after environmental tests) | 15% or 2 | ||
| Solder coverage (after environmental tests) | More than 90% | of lead |
2410121447_HELE-X3S024000BK1H-Z_C254345.pdf
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