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Specifications
Frequency Stability:
±50ppm
Voltage - Supply:
3V~3.6V
Operating Temperature:
-10℃~+70℃
Frequency:
27MHz
Mfr. Part #:
SSR027000I3CH
Package:
SMD7050-4P
Key Attributes
Model Number:
SSR027000I3CH
Product Description
Product Overview
The HSO751S is a high-quality oscillator manufactured by Harmony Electronics Corp. Designed for reliable performance, this oscillator is suitable for a wide range of electronic products. Its key features include a stable output frequency of 27.000MHz, a broad operating temperature range, and robust electrical specifications, making it an ideal component for various industrial and commercial applications.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Country of Origin: TAIWAN
- Model Series: HSO751S
- Customer Part No.: HELE.
- Harmony Part No: SSR027000I3CH
- Specification Number: SSR027000I3CH Rev. 0
- Date: 2015/12/16
Technical Specifications
| Item | Symbol | Value | Unit | Condition | Min | Typ | Max | Etc | |
|---|---|---|---|---|---|---|---|---|---|
| Type Name | HSO751S | ||||||||
| Output Frequency | 27.000000 | MHz | |||||||
| Absolute Maximum Ratings | Vdd | -0.5 ~ 7.0 | V | Vdd terminal voltage | |||||
| Vcont | -0.5 ~ Vdd+0.5 | V | Input terminal voltage | ||||||
| Vout | -0.5 ~ Vdd+0.5 | V | Output terminal voltage | ||||||
| Iout | 15 | mA | Output terminal current | ||||||
| Tstr | -55 ~ 125 | Storage temp. range | |||||||
| Electric Specifications | f/F | ppm | Frequency tolerance | -50 | +50 | 3.3+/- 0.3V -10~70 | |||
| Topr | Operating temp. range | -10 | 25 | +70 | |||||
| Vdd | V | Supply voltage | 3.0 | 3.3 | 3.6 | ||||
| Idd1 | mA | Current consumption 1 (#1 pin: open or "H") | 25 | Fig1,2 3.3V 25+/-3 | |||||
| Idd2 | mA | Current consumption 2 (#1 pin: "L" level) | 0.02 | ||||||
| Duty | % | Symmetry | 40 | 50 | 60 | ||||
| Vol | xVdd | V | Low level output voltage | 0.1 | |||||
| Voh | xVdd | V | High level output voltage | 0.9 | |||||
| Tr & Tf | ns | Rise & Fall time | 10 | Output load C-MOS CL =15 pF (Idd1, Idd2 test at No Load) | |||||
| Iil | A | Low level input current | -100 | Fig3 3.3V 25+/-3 | |||||
| Iih | A | High Level input current | 100 | ||||||
| Vil | xVdd | V | Low level input voltage | 0.3 | |||||
| Vih | xVdd | V | High level input voltage | 0.7 | |||||
| Tplz | ns | Output disable time | 150 | ||||||
| Tpzl | ms | Output enable time | 10 | ||||||
| Tosc | ms | Start-up Time | 10 | ||||||
| Aging | ppm/year | Aging | -5 | 5 | Frequency Stability is inclusive of 25 Tolerance, operating temperature range, input voltage change, Load change, first of aging, shock and vibration. | ||||
| Moisture Sensitivity Level | Level 1 | ||||||||
| Dimensions | Overall Dimensions | 7.00.2 x 5.00.2 mm | |||||||
| Height Max. | 1.4 mm | ||||||||
| Lead Pitch | 5.08 mm | ||||||||
| Lead Width | 0.55 mm | ||||||||
| Tolerance | 0.2 mm | ||||||||
| Mechanical Performance | Drop Test | Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. | Refer to: JIS C 60068-2-6 A | A | |||||
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. | Refer to: MIL-HDBK-781A 6.5.2./JIS C60068-2-6 A | |||||||
| Sealing Tightness | (1) Leak Rate | Pa-m/sec. | Max. Measured by Helium leak detector. Fine Leakage. | 1.0x10-8 | |||||
| (2) Dipping | Dipping in the FC-40 at +125 +/-5deg.C for 5 minutes, no gas bubble observed from the inside of the can. | ||||||||
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. | Refer to: JIS C 60068-2-6 B | |||||||
| Base Material | Alumina Ceramic (Al2O3) | ||||||||
| Metalized Pad | W Ni Plating Au Plating | ||||||||
| Environment Performance | Humidity Test | Temperature 60 +/-2 , RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. | Refer to: JIS C 60068-2-3 A | A | |||||
| Storage in Low Temperature | -40deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | Refer to: JIS C 60068-2-1 A | A | ||||||
| Storage in High Temperature | +85deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | Refer to: JIS C 60068-2-2 A | A | ||||||
| Temperature Cycles | -30deg.C +/-2deg.C (30min) +80deg.C +/-2deg.C (30min) 25 cycles. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | Refer to: JIS C 0025 A | A | ||||||
| High Temperature Operation | +85deg.C +/-5deg.C, +3.3V Vdd Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | Refer to: JIS C 60068-2-2 A | A | ||||||
| Supplement | Reflow Condition | Refer to proposed reflow condition (soldering 2 times max.) | |||||||
| Solder Iron Condition | Bit temp.:350 Max. , Time: 3sec Max. , Each terminal solder a 1 time Max. | ||||||||
| Taping and Packing | Quantity on Reel | 1,000 PCS/REEL | |||||||
| Taping and Packing | Storage Condition | Temperature+40 Max. Humidity 80% Max. | |||||||
2410121322_HELE-SSR027000I3CH_C254230.pdf
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