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Specifications
Normal temperature Frequency Tolerance:
±30ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-10℃~+60℃
Frequency:
14.31818MHz
Mfr. Part #:
X3S01431AFK1H
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S01431AFK1H
Product Description
Product Overview
The Harmony Electronics Corporation HSX321S Quartz Crystal is a high-precision electronic component designed for various applications. It operates at a nominal frequency of 14.318180MHz with a fundamental mode of oscillation. This crystal is manufactured to be Pb-free, RoHS compliant, HF-Halogen free, and REACH compliant, indicating a commitment to environmental standards. It is suitable for automated SMT processes and is designed for reliability in a range of operating temperatures.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX321S
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- Country of Origin: Taiwan
- MSL Level: 1
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 14.318180 | MHz | |
| Mode of Oscillation | Fundamental | ||
| Frequency Tolerance | ±30 | ppm | at 25±3 |
| Equivalent Resistance (RR) | 80 | Ω | SERIES |
| Storage Temperature Range | -40 to +85 | ||
| Operable Temperature Range | -10 to +60 | ||
| Temperature Stability | ±30 | ppm | -10 ~ +60 |
| Loading Capacitance (CL) | 20.0 | pF | |
| Drive Level (DL) | 10 to 100 | µW | |
| Shunt Capacitance (C0) | 2.0 | pF | |
| Insulation Resistance | 500 | MΩ | at DC 100V |
| Aging | ±3 | ppm/Year | |
| Dimensions (L x W x H) | 3.2 x 2.5 x 0.7 | mm | ±0.1 tolerance |
| Carrier Tape Width | 8.0 | mm | ±0.2 tolerance |
| Reel Quantity | 3,000 | PCS / REEL | Standard Packing Quantity |
| Shock Test | Dropping from 120 cm height 3 times on 30 mm Concrete floor. (JIS C 60068232 A) | ||
| Vibration Test | Frequency 1055Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. (JIS C 6006826 A) | ||
| Leakage Test | 1.0x10-9 | Pa-m3/sec. Max. | Measured by Helium leak detector. |
| Solder Ability Test | Dipping in solder bath at 245deg.C ±5deg.C for 3 ±0.5 sec. (JIS C 60068220 B) | ||
| Bending Strength Test | Apply pressure until board bent to 3 mm and hold for 5 ±1 sec. (EIAJ ET7403 A) | ||
| Adhesion Test | Apply pressure: 5N for 10±1 sec. (EIAJ ET7403 C) | ||
| Body Strength Test | Apply pressure: 10N for 10±1sec. (EIAJ ET7403 C) | ||
| Humidity Test | 60±2, RH 90~95%, duration of 240 hours. (JIS C 6006823 A) | ||
| Storage in Low Temperature Test | 40deg.C ±2deg.C, duration of 240 hours. (JIS C 6006821 A) | ||
| Storage in High Temperature Test | +85deg.C ±2deg.C, duration of 240 hours. (JIS C 6006822 A) | ||
| Temperature Cycles Test | 40 ±2 (30min) +85 ±2 (30min), 25 cycles. (JIS C 0025 A) | ||
2410121447_HELE-X3S01431AFK1H_C254356.pdf
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