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Specifications
Normal temperature Frequency Tolerance:
±8ppm
Frequency Stability:
±12ppm
Load Capacitance:
7pF
Operating Temperature:
-30℃~+85℃
Frequency:
19.2MHz
Mfr. Part #:
X3S019200BZ1H-CHZ
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S019200BZ1H-CHZ
Product Description
Product Overview
The HSX321S Quartz Crystal from HARMONY ELECTRONICS CORP. is a fundamental mode crystal designed for various product applications. Manufactured in Taiwan, this crystal unit offers a nominal frequency of 19.200000MHz with a frequency tolerance of +/- 8 ppm at 25C. It features a compact holder type (HSX321S) and is suitable for operation within a temperature range of -30C to +85C. The crystal is designed for automatic insertion and comes in embossed carrier tape and reel packaging for efficient handling.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Origin: Taiwan
- Holder Type: HSX321S
- Marking Method: Laser marking
- Material (Base): Alumina Ceramic (Al2O3)
- Material (Cap): Fe-Ni
- Crystal Blank: Rectangular At-Cut Quartz Crystal Blank
- Adhesive: Silver Conductive Polyimide Resin
- Electrode Material: Au
- Pad Material: Alumina Ceramic (W. Ni. Au)
Technical Specifications
| Specification | Value | Details |
|---|---|---|
| Nominal Frequency | 19.200000MHz | |
| Frequency Tolerance | +/- 8 ppm | at 25C +/-3C |
| Equivalent Resistance | 70 ohms Max. | /SERIES |
| Storage Temperature Range | -40C To +85C | |
| Operable Temperature Range | -30C To +85C | |
| Temperature Drift | +/-12 ppm | -30C To +85C |
| Loading Capacitance (CL) | 7.0 pF +/-0.2 pF | |
| Drive Level | 100uW Max | |
| Shunt Capacitance | 1.1 pF +/-15% | |
| Insulation Resistance | More than 500M ohms | at DC 100V |
| Mode of Oscillation | Fundamental | |
| Shocking (Frequency Variation) | Less than +/-5 ppm | Dropping from 50 cm height 3 times on firm wood |
| Shocking (Resistance Variation) | Less than +/- 15 % or 2ohms max. | Dropping from 50 cm height 3 times on firm wood |
| Aging | Less than +/- 1 ppm/Year | |
| Holder Type | HSX321S | Seam type |
| Carrier Tape Width (W1) | 8.0+/-1.5 mm | |
| Carrier Tape Outer Width (W2) | 11.5+/-0.2 mm | |
| Reel Diameter (A) | 178+/-1 mm | |
| Reel Outer Line Diameter (B) | 60+1.0/-0.0 mm | |
| Standard Packing Quantity | 3,000 PCS / REEL | |
| Cover Tape Release Strength | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min |
| Drop Test (Height) | 50cm | 3 times on min. 30mm thickness hard wooden board |
| Vibration Test (Frequency) | 10-55Hz | Full amplitude of 1.5mm to X,Y and Z 3 axes, Duration of 2 hours to each axis |
| Sealing Tightness (Leak Rate) | 1.0x10 -8 Pa-m 3/sec. Max. | measured by Helium leak detector |
| Solderability (Dipping Test) | Over 90% covered by solder | Dipping in solder bath at 230+/-5 for 5 sec. |
| Humidity Test | 60+/-2, RH 90~95% for 240 hours | |
| Low Temperature Storage | -30+/-2 for 240 hours | |
| High Temperature Storage | +85+/-2 for 240 hours | |
| Temperature Cycles | -30+85 (30min each) for 20 cycles | |
| VPS Test | FC-70 (boiling point:+215) Vapor for 30 sec | |
| Soldering (Preheat) | 160~180 deg.C | 120sec. |
| Soldering (Primary Heat) | 220 deg.C | 60sec. |
| Soldering (Peak) | 260 deg.C | 10sec. Max. |
| Solder Iron Temperature | 350 max. | Time: 3sec max. , Each terminal solder a 1 time max. |
2410121342_HELE-X3S019200BZ1H-CHZ_C254370.pdf
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