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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Operating Temperature:
-20℃~+75℃
Load Capacitance:
7.2pF
Frequency:
26MHz
Mfr. Part #:
X2B026000B71HZ-HPR
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B026000B71HZ-HPR
Product Description
HSX221SA Quartz Crystal
Product Overview
The HSX221SA is a quartz crystal unit manufactured by HARMONY ELECTRONICS CORP., designed for various product applications. This specification sheet outlines its electrical, mechanical, and environmental characteristics, ensuring reliable performance in demanding conditions. It is suitable for applications requiring precise frequency control.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX221SA
- Type: Quartz Crystal Unit
- Country of Origin: TAIWAN
- Manufacturing Facilities: THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
Technical Specifications
| Item | Specification | Details |
|---|---|---|
| Frequency | 26.000000MHz | |
| Holder Type | HSX221SA | Seam type |
| Frequency Tolerance | +/-10 ppm | at 25C +/-3C |
| Equivalent Resistance | 30 ohms Max. | / SERIES |
| Storage Temperature Range | -40C To +85C | |
| Operable Temperature Range | -20C To +75C | |
| Temperature Drift | +/-10ppm | -20C To +75C |
| Loading Capacitance (CL) | 7.2 pF | |
| Drive Level | 10 W | (100W Max.) |
| Shunt Capacitance | 2.0 pF Max. | |
| Insulation Resistance | More than 500M ohms | at DC 100V |
| Mode of Oscillation | Fundamental | |
| Circuit Measurement | HP/E5100A, S&A 250B | |
| Shock Test (Dropping) | Frequency variation less than +/-5 ppm; Resistance less than +/- 15 % or 2ohms max. | Dropping from 120 cm height 3 times on Concrete floor |
| Aging | Less than +/- 3 ppm/Year | |
| Dimensions and Marking | Refer to Page 4 | |
| Emboss Carrier Tape & Reel | Refer to Pages 6 & 7 | |
| Mechanical Endurance - Natural Drop | Frequency variation < +/-5 ppm; Equivalent resistance < +/-15% or 2 | Dropping from 120 cm height 3 times on Concrete floor (JIS C 60068-2-6 A) |
| Mechanical Endurance - Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. (MIL-HDBK-781A 6.5.2 / JIS C 60068-2-6 A) | |
| Mechanical Endurance - Sealing Tightness | Leak Rate 1.0x10-8 Pa-m/sec. Max. | Measured by Helium leak detector. |
| Mechanical Endurance - Solder Ability | After applying ROSIN Flux, dipping in solder bath at 245C+/-5C for 3+/-0.5 sec. (JIS C 60068-2-20 B) | |
| Mechanical Endurance - Substrate Bending | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm / sec (EIAJ ET-7403 A) | |
| Mechanical Endurance - Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec (EIAJ ET-7403 A) | |
| Mechanical Endurance - Body Strength | Apply pressure to the center of body with the R0.5 pressure jig. Pressure: 10N for 101sec (EIAJ ET-7403 A) | |
| Environmental Performance - Humidity | Frequency variation shall be within +/-5ppm and equivalent resistance shall be within +/-15% or 2 | Temperature 60 +/- 2C, RH 90~95%, Duration of 240 hours. (JIS C 60068-2-3 A) |
| Environmental Performance - Storage in Low Temperature | Frequency variation shall be within +/-5ppm and equivalent resistance shall be within +/-15% or 2 | -40C +/-2C, Duration of 240 hours. (JIS C 60068-2-1 A) |
| Environmental Performance - Storage in High Temperature | Frequency variation shall be within +/-5ppm and equivalent resistance shall be within +/-15% or 2 | +85C +/-2C, Duration of 240 hours. (JIS C 60068-2-2 A) |
| Environmental Performance - Temperature Cycles | Frequency variation shall be within +/-5ppm and equivalent resistance shall be within +/-15% or 2 | -40C +/-2C (30min) +85C +/-2C (30min) 25 cycles. (JIS C 0025 A) |
| Soldering Condition (Reflow) | Preheat: 160~180C (120sec); Primary heat: 220C (60sec); Peak: 260C (10sec Max.). Available for Lead Free Soldering. Max 2 soldering times. | |
| Soldering Condition (Solder Iron) | Bit temp.: 350C max., Time: 3sec max., Each terminal solder a 1 time max. | |
| Standard Packing Quantity | 3,000 PCS / REEL | |
| Carrier Tape Material | PS | Conductive |
| Top Tape Material | Polyester | |
| Cover Tape Release Strength | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min. |
| Inside Structure Base Material | Alumina Ceramic (Al2O3) | |
| Inside Structure Lid Material | Fe-Ni-Co | |
| Inside Structure Adhesive | Silver Conductive Silicon Resin | |
| Inside Structure Electrode | W Ni Plating Au Plating | |
| Inside Structure Cover Ring | Fe-Ni-Co Alloy |
Application
- Products: CRYSTAL
- Accepted Model: HSX221SA
Manufacturing Information
- Spec. No.: X2B026000B71HZ-HPR Rev. 0
- Date: 2015/12/01
2410121327_HELE-X2B026000B71HZ-HPR_C136059.pdf
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