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Quality Quartz Crystal Oscillator HELE X2B026000BC1H-Z 26 Megahertz Frequency RoHS Compliant for Electronics factory
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Quality Quartz Crystal Oscillator HELE X2B026000BC1H-Z 26 Megahertz Frequency RoHS Compliant for Electronics factory
>
Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Operating Temperature:
-20℃~+85℃
Load Capacitance:
12pF
Frequency:
26MHz
Mfr. Part #:
X2B026000BC1H-Z
Package:
SMD2520-4P
Key Attributes
Model Number: X2B026000BC1H-Z
Product Description

Product Overview

The HSX221SA from Harmony Electronics Corporation is a high-quality Quartz Crystal designed for various electronic applications. It operates at a nominal frequency of 26.000000MHz with a fundamental mode of oscillation. This crystal is Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant, ensuring it meets stringent environmental and safety standards. It is manufactured in Taiwan and is suitable for use in automated SMT processes.

Product Attributes

  • Brand: HARMONY ELECTRONICS CORPORATION
  • Product Type: Quartz Crystal
  • Model: HSX221SA
  • Origin: Taiwan
  • Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
  • MSL Level: 1

Technical Specifications

Item Electrical Spec. Unit Min Type Max Notes
Frequency (FL) MHz 26.000000
Mode of oscillation Fundamental
Frequency tolerance ppm -10 +10 at 253
Equivalent resistance (RR) 30 SERIES
Storage temperature range -40 +85
Operable temperature range -20 +85
Temperature stability ppm -10 +10 20 ~ +85
Loading capacitance (CL) pF 12.0
Drive level (DL) W 10 100
Shunt Capacitance (C0) pF 2.0
Insulation resistance M 500 at DC 100V
Aging ppm/Year -3 +3
Circuit Measured in HP/E5100A,S&A 250B
Dimensions (L x W) mm 2.0 x 2.5 0.15
Dimensions (Height) mm 0.7 0.9 Max
Dimensions (Lead pitch) mm 0.73
Dimensions (Lead width) mm 0.58
Carrier Tape Width mm 8.0 0.2
Carrier Tape Pitch mm 4.0 0.1
Carrier Tape Pocket Depth mm 1.75 0.1
Carrier Tape Pocket Width mm 2.25 0.05
Carrier Tape Pocket Pitch mm 4.0 0.1
Carrier Tape Wall Thickness mm 0.25 0.05
Carrier Tape Bottom Thickness mm 0.8 0.05
Reel Diameter mm 180 +0/-3
Reel Width mm 60.5 0.5
Reel Flange Diameter mm 13.2 0.5
Reel Inner Diameter mm 9.3 0.3
Reel Height mm 11.3 1.0
Standard Packing Quantity PCS/REEL 3000
Shock Test Dropping from 120 cm height 3 times on 30 mm Concrete floor. A Refer to: JIS C 60068232
Vibration Test Frequency 1055Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. A Refer to: JIS C 6006826
Leakage Test Leak Rate Pam3/sec. Max. 1.0x109 Measured by Helium leak detector.
Solder ability Dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. B Refer to: JIS C 60068220
Bending Strength Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. A Refer to: EIAJ ET7403
Adhesion Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. C Refer to: EIAJ ET7403
Body strength Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec C Refer to: EIAJ ET7403
Humidity Test Temperature 602, RH 90~95%, duration of 240 hours. , % 60, 90 85, 95 Refer to: JIS C 6006823
Storage in Low Temperature -40deg.C 2deg.C, duration of 240 hours. deg.C -40 Refer to: JIS C 6006821
Storage in High Temperature +85deg.C 2deg.C, duration of 240 hours. deg.C +85 Refer to: JIS C 6006822
Temperature cycles -40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. deg.C -40 +85 Refer to: JIS C 0025

2410121447_HELE-X2B026000BC1H-Z_C254306.pdf

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